Intel Enters into Strategic Agreement with Rockchip to Accelerate, Expand Portfolio of Intel-Based Solutions for Tablets
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SANTA CLARA, Calif.--(BUSINESS WIRE)--
Intel Corporation today announced it has entered into a strategic
agreement with Rockchip
to expand the breadth of and accelerate the rate at which it brings its
Intel® architecture and communications-based solutions to market for a
range of entry-level Android* tablets
Under the terms of the agreement, the two companies will deliver an
Intel-branded mobile SoC platform. The quad-core platform will be based
on an Intel®
Atom™ processor core integrated with Intel's 3G modem technology.
Expanding the offerings in Intel's SoFIA family of integrated mobile SoC
platforms for entry and value Android mobile devices, the new quad-core
SoFIA 3G part is expected to be available in the first half of 2015. It
will be targeted primarily at entry and value tablets. The Intel SoFIA
family was added to Intel's mobile product roadmap late last year and
includes Intel's first integrated applications processor and
As the tablet market continues to expand with greater choice of screen
size, form factor and price, the strategic agreement with Rockchip also
enables Intel to ramp new customers with a broader portfolio of products
"The strategic agreement with Rockchip is an example of Intel's
commitment to take pragmatic and different approaches to grow our
presence in the global mobile market by more quickly delivering a
broader portfolio of Intel architecture and communications technology
solutions," said Brian Krzanich, Intel CEO. "We are excited to work with
Rockchip. With today's announcement we've added yet another derivative
to the Intel SoFIA family, and we expect to have them all in market
before the middle of 2015. We are moving with velocity to grow Intel's
offerings for the growing global tablet market."
The strategic agreement with Intel expands Rockchip's product portfolio
with the addition of the performance and flexibility of the Intel
architecture and leading communications solutions.
"We are always looking for innovative ways to differentiate our product
portfolio, and the first-of-its-kind collaboration with Intel helps us
do this," said Min Li, Rockchip CEO. "The combination of Intel's leading
architecture and modem technology with our leading mobile design
capability brings greater choice to the growing global market for mobile
devices in the entry and value segments."
With today's announcement, the Intel SoFIA family is now made up of
three different offerings, including the dual-core 3G version expected
to ship in the fourth quarter of this year, the quad-core 3G version
that is expected to ship in the first half of 2015, and the LTE version,
also due in the first half of next year.
Pricing for the quad-core SoFIA 3G part will be disclosed at a later
date, and like the broader Intel SoFIA family, it is expected to be
price competitive. Under the agreement, both Intel and Rockchip will
sell the new part to OEMs and ODMs, primarily into each company's
existing customer base.
Rockchip is a China leading fabless semiconductor company and
mobile-internet SOC solution provider founded in Year 2001. Rockchip
focuses on mobile Internet Platform with products targeted on Mobile
Internet terminals (Tablet/OTT-BOX/Dongle/e-Book) and portable
multimedia entertainment terminals (MP3/PMP). Rockchip has combined its
Video/Audio and Android experience to produce semiconductor (IC)
solutions for the world-renowned OEM/ODM and Brand customers. Rockchip
is headquartered in Fuzhou, where most design and development is taking
place, and has three additional branches in Beijing, Shanghai and
Shenzhen, focusing mostly on programs and marketing. For more
information, visit www.rock-chips.com.
Intel (NASDAQ: INTC) is a world leader in computing innovation. The
company designs and builds the essential technologies that serve as the
foundation for the world's computing devices. As a leader in corporate
responsibility and sustainability, Intel also manufactures the world's
first commercially available "conflict-free" microprocessors. Additional
information about Intel is available at newsroom.intel.com
and about Intel's conflict-free efforts at conflictfree.intel.com.
Intel, Intel Atom and the Intel logo are trademarks of Intel Corporation
in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Kari Aakre, 503-696-5068
Xing, (86) 0591-8399-1906
Source: Intel Corporation
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