Exhibit 99.1
Supplement to Present Required Information in Searchable Format
MANUFACTURED CAPITAL - page 13
Intel Worldwide Headquarters:
•
Santa Clara, California
 
 
Wafer Fabs:
•
Oregon - 10nm, 14nm, 22nm
•
Arizona - 14nm, 22nm
•
New Mexico - 32nm, 45nm
•
Ireland - 14nm
•
Israel - 10nm, 22nm
•
Dalian Memory Fab
 
 
Assembly and Test:
•
Chengdu
•
Vietnam
•
Malaysia

OUR PRODUCTS - page 9
Our Product Portfolio
 
 
•
Platform Products - A CPU and chipset, an SoC, or a multichip package processes data and controls other devices in a system. They are primarily used in solutions sold through CCG, DCG, and IOTG.
 
 
•
Accelerators - Silicon products that can operate alone or accompany our processors in a system as accelerators, such as FPGAs.
 
 
•
Boards and Systems - Server boards and small form factor systems such as Intel NUC.
 
 
 
•
Connectivity - Ethernet controllers, Silicon Photonics, wireless cellular modem, Fabric, Wi-Fi, and Bluetooth IC.
 
 
•
Memory and Storage - SSD, persistent memory, and memory components.




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