LETTER FROM YOUR CEO To our stockholders, customers, partners, and employees: Advancing Our Vision and Strategy Intel stands at a pivotal juncture in a world where insatiable demand for processing power is being driven by Al and the convergence of ubiquitous compute, connectivity, infrastructure, and sensing. We see a profound opportunity to push the boundaries of what is possible, to create solutions for the world's most significant challenges, and to improve the lives of everyone on the planet. Intel's mission to create a globally-diversified, resilient, and sustainable supply chain for semiconductors — the most critical and strategic resource of the 21st century — is central to our ambitions. Access to exceptionally engineered and relentlessly innovative chips will be the determining factor in the next phase of innovation for virtually every industry. To usher in this new era and enable our customers to harness this opportunity, Intel is investing in technology and manufacturing leadership as we open our manufacturing network to the world, bring "Al Everywhere," and relentlessly pursue Moore's Law. This is part of our effort to build a stronger Intel and includes the February launch of Intel Foundry, a first-of-its-kind systems foundry for the Al era that comprises our Technology Development, Global Manufacturing and Supply Chain, and foundry customer service and ecosystem operations. Moreover, the establishment of a foundry-like relationship between Intel Foundry and Intel Products, our product business units, will drive greater transparency, accountability, and cost optimization. Making Significant Progress on Our Transformation 2023 marked a year of across-the-board progress on our IDM 2.0 strategy and transformation priorities. We executed on our plan to re-establish process leadership, expanded our capacity and foundry plans, enhanced product execution, and began to realize our vision to bring Al Everywhere. Despite entering the year navigating significant macroeconomic and industry headwinds, the focus on our strategy and on operational and financial discipline enabled us to deliver on our goals. We know there is more work to do, but I'm proud of the team for delivering on what we said we would in 2023, which will enable us to take advantage of the opportunities ahead. Re-establishing Process and Product Leadership We remain on track to re-establish Intel's process technology leadership by delivering on our goal of five nodes in four years (5N4Y), which will be completed by the end of 2024. Intel 3 and Intel 4 are manufacturing-ready and ramping. We are excited to break into the Angstrom era with Intel 20A, set to launch this year, and Intel 18A, on track for manufacturing readiness in the second half of Pat Gelsinger, Chief Executive Officer, Director, and Principal Executive Officer 2024, marking the completion of 5N4Y and returning Intel to process leadership. In February, we unveiled our roadmap beyond 5N4Y with the addition of Intel 14A to Intel's leading-edge node plan, in addition to several specialized node evolutions. Our product roadmap also continues to advance. In the datacenter, we launched Xeon Gen 5 ahead of schedule. Sierra Forest is poised for launch in the first half of 2024, followed shortly by Granite Rapids, which will position Intel to regain share in the data center. Additionally, Clearwater Forest, our first Intel 18A part for servers, is already in the fab. Our Meteor Lake product on Intel 4 is ramping rapidly with 40 million units expected in 2024 and Arrow Lake, our lead Intel 20A vehicle, is slated for launch this year. Our first Intel 18A client platform, Panther Lake, is now in fab as well. Together, we expect to ship well over 100 million Al PCs in 2024 and 2025. Building the First Systems Foundry for the Al Era We are advancing our goal of becoming the world's second- largest foundry by 2030 as part of our broader mission to create a resilient and sustainable global supply chain for semiconductors. At our inaugural Intel Foundry Direct Connect event, in February, we unveiled the new brand and market positioning of Intel Foundry, the world's first systems foundry for the Al era. While still early in our foundry journey, we are seeing significant traction. We began 2023 with a commitment from one Intel 18A foundry customer and ended the year with four. We also achieved five advanced packaging wins, a testament to the advantages of Intel Foundry. ! "# ! $ $ % & ' ( ) * + % , , & % - . * / 0 * & , 1 2 "3"4 & -*" 3 $ $ $ 2 #5 ( - "3"6 & & "3"4 & !" # & 7896:; "3"6 4 6 $ & "3 #5 & "3"6 & 896: , 896: #6 2 < = . 8 / , "3"6 . > 0 , #5 <*+ & 6 63$ "3"6 + & "3 < 1 + & % $ #33 10 "3"8 $ % % &' "343 , - 0 , & , "3"4 #5 & ,
To support the growing demand for our foundry offering, we continued to expand our manufacturing capacity and capabilities. Our foundry collaborations have been bolstered by new strategic agreements with UMC to deliver a joint 12 nanometer process platform and with Tower Semiconductor to expand its wafer capacity corridor. Particularly noteworthy from Direct Connect was the deep support from ecosystem partners — including Synopsys, Cadence, Siemens and Ansys — that are ready to accelerate Intel Foundry customers' chip designs with tools, design flows and intellectual property portfolios validated for Intel's advanced packaging and Intel 18A process technologies. Accelerating Efforts to Bring Al Everywhere Intel is uniquely positioned across its product and foundry businesses to participate in 100% of the massive market for Al silicon, which is a key driver of the $1 trillion semiconductor opportunity expected by the end of this decade. Our efforts are to bring Al where data is generated and used and to extend across cloud, data centers, PCs, networks, and the edge. In 2023 we ushered in the age of the Al PC with Intel® CoreTM Ultra, the most significant transformation of the PC experience since the introduction of the wireless Intel Centrino platform more than 20 years earlier. We launched 4th Gen Intel® Xeon® processors with industry-leading Al inference performance, shipping 2.5 million units during the year, and 5th Gen Intel® Xeon® processors, which radically improved inference further. Our Intel® Gaudi®2 accelerators are exhibiting robust performance compared with peers, and Intel® Gaudi®3 is in the lab and powered on. Smart Capital remains a key component to our strategy as we prioritize critical investments to advance IDM 2.0. Intel also played a leading role in championing the passage of the U.S. CHIPS and Science Act to set the U.S. along the path to re-establishing global leadership in technology manufacturing. Looking Ahead to 2024 2023 was a year of consistent execution, where we achieved what we set out to do — and more. Thanks to the hard work of our talented and dedicated team, we have established a strong foundation for continued progress on our IDM 2.0 journey. In 2024, we aim to build on this progress and continue raising the bar with our ambitions. We remain relentlessly focused on our mission and committed to driving long-term value for our shareholders. We firmly believe Intel's brightest days lie ahead. Pat Gelsinger, CEO Intel Corporation 2023 was the year of Al training, but 2024 is poised to be the year of AI inferencing — where Intel is positioned to win. Demonstrating Strong Financial Improvement and Unlocking Shareholder Value Intel displayed strong financial discipline and improvement in 2023, consistently exceeding expectations on the top and bottom line for each of the four quarters. Through rigorous expense discipline, we achieved $3 billion in cost savings during the year. Additionally, at the beginning of 2024, we successfully transitioned to our internal foundry model. This model gives Intel Foundry its own profit-and-loss statement for the first time and establishes a foundry-like relationship between Intel Foundry and Intel Products. In 2023, we also unlocked significant value through strategic portfolio actions, including the stake sale of IMS. Along with the exit of 10 businesses since the second quarter of 2021, this culminated in approximately $1.8 billion in annual savings. This Annual Report contains forward-looking statements, and actual results could differ materially. Risk factors that could cause results to differ are set forth in the "Risk Factors" section and throughout our 2023 Form 10-K, which is included in this Annual Report. These risk factors are subject to update by our future filings and submissions with the U.S. SEC. Forward-looking statements included in our 2023 Form 10-K are based on management's expectations as of January 25, 2024, and forward-looking statements in the CEO letter are based on expectations as of March 15, 2024. Intel disclaims any obligation to update these statements, except as required by law. % $ < ?*0 #" % / $ 1 -0 ! / 0 / ! , & #5 ' $&'( #33@ & & A# $ < $ 10 & "3"4 10 B 0C ? 10$ 0 "3 6 . B =B " 8 8 . B =B < B . B" $ B. B4 "3"4 "3"6 ! ) % & * "3"4 $ $ % $ A4 "3"6 % , & , 1 "3"4 & & */ $ #3 "3"# $ A# 5 / 0 & 2 -*" 3 ? / 0D1/ / ? / # +,+- "3"4 $ ! % & & -*" 3 "3"6 % > & >& E>&, E "3"4,#3 F > % & ? / /(0 , & "3"4,#3 F G$ H "8 "3"6 & 0(< $ * #8 "3"6 $
UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K (Mark One) ▪ ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended December 30, 2023. or n TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the transition period from to Commission File Number: 000-06217 MEd® INTEL CORPORATION (Exact name of registrant as specified in its charter) Delaware 94-1672743 (State or other jurisdiction of incorporation or organization) (I.R.S. Employer Identification No.) 2200 Mission College Boulevard, Santa Clara, California 95054-1549 (Address of principal executive offices) (Zip Code) Registrant's telephone number, including area code: (408) 765-8080 Securities registered pursuant to Section 12(b) of the Act: Title of each class Trading symbol Name of each exchange on which registered Common stock, $0.001 par value INTC Nasdaq Global Select Market Securities registered pursuant to Section 12(g) of the Act: None Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. Yes 0 No 0 Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Act. Yes 0 No 0 Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. Yes 0 No 0 Indicate by check mark whether the registrant has submitted electronically every interactive data file required to be submitted pursuant to Rule 405 of Regulation S-T (§232.405 of this chapter) during the preceding 12 months (or for such shorter period that the registrant was required to submit such files). Yes 0 No 0 Indicate by check mark whether the registrant is a large accelerated filer, an accelerated filer, a non-accelerated filer, a smaller reporting company, or an emerging growth company. See the definitions of "large accelerated filer", "accelerated filer", "smaller reporting company", and "emerging growth company' in Rule 12b-2 of the Exchange Act. Large Accelerated Filer Accelerated Filer Non-Accelerated Filer Smaller Reporting Company Emerging Growth Company If an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act. 0 Indicate by check mark whether the registrant has filed a report on and attestation to its management's assessment of the effectiveness of its internal control over financial reporting under Section 404(b) of the Sarbanes-Oxley Act (15 U.S.C. 7262(b)) by the registered public accounting firm that prepared or issued its audit report. 0 If securities are registered pursuant to Section 12(b) of the Act, indicate by check mark whether the financial statements of the registrant included in the filing reflect the correction of an error to previously issued financial statements. 0 Indicate by check mark whether any of those error corrections are restatements that required a recovery analysis of incentive-based compensation received by any of the registrant's executive officers during the relevant recovery period pursuant to §240.10D-1(b). ❑ Indicate by check mark whether the registrant is a shell company (as defined in Rule 12b-2 of the Exchange Act). Yes 0 No 0 The aggregate market value of voting and non-voting common equity held by non-affiliates of the registrant as of June 30, 2023, based upon the closing price of the common stock as reported by the Nasdaq Global Select Market on such date, was $140.0 billion. 4,228 million shares of common stock were outstanding as of January 19, 2024. DOCUMENTS INCORPORATED BY REFERENCE Portions of the registrant's proxy statement related to its 2024 Annual Stockholders' Meeting to be filed subsequently are incorporated by reference into Part III of this Form 10-K. Except as expressly incorporated by reference, the registrant's proxy statement shall not be deemed to be part of this report. . /012345637 7 /893: ; . IJK L I I I ; . IJJI KJ IIJ 6<<2002632=:><?:8 !" M J IKJI J KK JK IJI :=/@/8: !"" J JIJINIKJ II J II O J LI J J 200263 6==:4:#6>=:A/8; /35/ =/8/ /=2B6832/ IKKI MNJPK ! KJI J"KJ NI N I #$ "!$$ NIJKIKJINIKN JJJ $J J# 25=:6B:/C1C=/00 8/;2340D<?6= /<:6B:/C1:EC1/34:63@12C18:4205:8:; ! 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Table of Contents Organization of Our Form 10-K The order and presentation of content in our Form 10-K differs from the traditional SEC Form 10-K format. Our format is designed to improve readability and better present how we organize and manage our business. See "Form 10-K Cross-Reference Index" within the Financial Statements and Supplemental Details for a cross-reference index to the traditional SEC Form 10-K format. We have defined certain terms and abbreviations used throughout our Form 10-K in "Key Terms" within the Financial Statements and Supplemental Details. The preparation of our Consolidated Financial Statements is in conformity with US GAAP. Our Form 10-K includes key metrics that we use to measure our business, some of which are non-GAAP measures. See "Non-GAAP Financial Measures" within MD&A for an explanation of these measures and why management uses them and believes they provide investors with useful supplemental information. Fundamentals of Our Business Page Availability of Company Information 2 Introduction to Our Business 3 A Year in Review 5 Our Strategy 7 Our Capital 10 Management's Discussion and Analysis Our Products 20 Segment Trends and Results 21 Consolidated Results of Operations 37 Liquidity and Capital Resources 42 Critical Accounting Estimates 44 Non-GAAP Financial Measures 45 Risk Factors and Other Key Information Risk Factors 48 Sales and Marketing 63 Quantitative and Qualitative Disclosures About Market Risk 64 Cybersecurity 65 Properties 66 Market for Our Common Stock 66 Stock Performance Graph 67 Issuer Purchases of Equity Securities 67 Rule 10b5-1 Trading Arrangements 67 Information About Our Executive Officers 68 Disclosure Pursuant to Section 13(r) of the Securities Exchange Act of 1934 69 Financial Statements and Supplemental Details Auditor's Reports 71 Consolidated Financial Statements 74 Notes to Consolidated Financial Statements 79 Key Terms 112 Controls and Procedures 114 Exhibits 115 Form 10-K Cross-Reference Index 120 J JK I OJ NI I II IK JJ J J NI IIKI JJIJ I IJ NI IJKK J I PI JL JJIIK J RR I O NI NK KK E II KK I MERJ J JJ JK N J J K II KKII MJ JJIJ I IJ !P IJ JIK IPJ KNKJI N NJ NI I ELIKERJ J JJ JK N J J K IIJ NI K J JJ JKK IJLRJ1"##$ NI I NKLJIKJJR NKJ KNI NI NK KK%K RI "##$KNIK E& "##$ 'KNIKERJ ' (# I M J JKKNIK RL JNKKJ PKJLI P PKJ IKRJNKN KN J IJ N J K NI)NK KK $ #P JL L IJ * JI NJ J NI)NK KK + #,I PR - NIJIJL . NIJ ' J/K KNKK # LKK NI$I NJK * JI K KN JK * K J KN JK IJ K +. 0QNJL J K NIK 1* IJ # N J KJJK 11 & "##$ 'KNIK 1- KJ IK JIL IJ KJ IK 12 K 'IJ 3+ 4N JJJP 4N JJP K KNIK# NJ'IJ K 31 L IKNIJL 3- $I IJK 33 'IJ INI J 33 J $I I "I 3. KKNI$NIKK QNJLNIJK 3. N -I #II JK 3. IJ # NJNI MNJPIK 32 K KNI$NIKN JJ J +5I6 JNIJK M #J 7+1 37 JJ JK N J J K #NJ I/K IJK . K J JJ JK .1 & JKJ K J JJ JK .7 LIK * JI K $I NIK 1 M JK - II KK I M *
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Forward-Looking Statements This Form 10-K contains forward-looking statements that involve a number of risks and uncertainties. Words such as "accelerate", "achieve, "aim", "ambitions", "anticipate, "believe", "committed", "continue, "could", "designed", "estimate, "expect", "forecast", "future, "goals", "grow", "guidance, "intend", "likely", "may", "might'', "milestones", "next generation", "objective, "on trace, "opportunity", "outlook", "pending", "plan", "position", "possible", "potential", "predict", "progress", "ramp", "roadmap", "seer, "should", "strive, "targets", "to be, "upcoming", "will", "would", and variations of such words and similar expressions are intended to identify such forward-looking statements, which may include statements regarding: our business plans and strategy and anticipated benefits therefrom, including with respect to our IDM 2.0 strategy, our Smart Capital strategy, our partnership with Brookfield, the transition to an internal foundry model, updates to our reporting structure, and our Al strategy; • projections of our future financial performance, including future revenue, gross margins, capital expenditures, and cash flows; • projected costs and yield trends; • future cash requirements, the availability, uses, sufficiency, and cost of capital resources, and sources of funding, including for future capital and R&D investments and for returns to stockholders, such as stock repurchases and dividends, and credit ratings expectations; future products, services, and technologies, and the expected goals, timeline, ramps, progress, availability, production, regulation, and benefits of such products, services, and technologies, including future process nodes and packaging technology, product roadmaps, schedules, future product architectures, expectations regarding process performance, per-watt parity, and metrics, and expectations regarding product and process leadership; investment plans and impacts of investment plans, including in the US and abroad; • internal and external manufacturing plans, including future internal manufacturing volumes, manufacturing expansion plans and the financing therefor, and external foundry usage; • future production capacity and product supply; • supply expectations, including regarding constraints, limitations, pricing, and industry shortages; • plans and goals related to Intel's foundry business, including with respect to anticipated customers, future manufacturing capacity and service, technology, and IP offerings; • expected timing and impact of acquisitions, divestitures, and other significant transactions, including the sale of our NAND memory business; • expected completion and impacts of restructuring activities and cost-saving or efficiency initiatives • future social and environmental performance goals, measures, strategies, and results; • our anticipated growth, future market share, and trends in our businesses and operations; • projected growth and trends in markets relevant to our businesses; • anticipated trends and impacts related to industry component, substrate, and foundry capacity utilization, shortages, and constraints; • expectations regarding government incentives; • future technology trends and developments, such as Al; • future macro environmental and economic conditions; • geopolitical tensions and conflicts and their potential impact on our business; • tax- and accounting-related expectations; • expectations regarding our relationships with certain sanctioned parties; and other characterizations of future events or circumstances. Such statements involve many risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including those associated with: the high level of competition and rapid technological change in our industry; the significant long-term and inherently risky investments we are making in R&D and manufacturing facilities that may not realize a favorable return; the complexities and uncertainties in developing and implementing new semiconductor products and manufacturing process technologies; our ability to time and scale our capital investments appropriately and successfully secure favorable alternative financing arrangements and government grants; implementing new business strategies and investing in new businesses and technologies; changes in demand for our products; macroeconomic conditions and geopolitical tensions and conflicts, including geopolitical and trade tensions between the US and China, the impacts of Russia's war on Ukraine, tensions and conflict affecting Israel, and rising tensions between the US and Taiwan; the evolving market for products with Al capabilities; Intel. 1 IRI0 JJ JK K I J K IRI KJJ JKJJ P P N I IKK N IJ JK ! IKKNKE IJE% EPE%EE%E J KE%E JJE%E PE%E JJE%E J NE%E N E%EK E%EKJJE%EMJE%E IKJE%ENJNIE% E KE%EI RE%EN E%E J E%E LE%ELE%EJE%E KJ KE%E MJ IJ E%E 8JPE%E JIE%E IJN JLE% E NJ E%E E%E E%E KJ E%E KK E%E J J E%EIJE%EI IKKE%EIE%EI E%EKE%EK N E%EKJIPE%EJIJKE% EJ E%EN E%ER E%ER N E% PIJ K KNR IK K IMIKK KI J J JLKN IRI KJJ JK%RL NKJJ JKII 9 U NI NK KK K KJIJL JJ JKJII % N RJIKJJ NI '* KJIJL% NIIJJ KJIJL% NIIJ IKRJ)I %JJI KJ J JI N IL %NJKJ NII IJ KJINJNI% NI# KJIJL: U I 8J K NINJNI I I % N NJNIIP N%I KKI K%J M JNIK% K RK: U I 8J KJK L JI K: U NJNIKIQNI JK%JP JL%NKK%KN L% KJ J IK NIK% K NIK N % N INJNI J ( PKJ JK IIJNI KJ KJ IK%KNKKJ INIKK P K% IJIJ K MJJ K: U NJNII NJK%KIPK% J K% JMJ K%J %IK%I IKK%P JL%I NJ %IN J % JK KNI NJK%KIPK% J K% N NJNII KK K J L%I NJ I K%KN K%NJNII NJIJJNIK%MJJ KII I KKI I %IRJJIJL% JIK% MJJ KII I NJ I KK IK: U PKJ J K JK PKJ J K% N J1 I : U JI MJI NJNI K% N NJNI JI NJNI P NK% NJNI M K K J JI I% MJI N ILNK: U NJNII NJ JL I NJKN L: U KN LMJJ K% N II KJI JK% JJ K%I % NKJILK IJK: U K KI JJ J /K N IL NK KK% N RJIKJJ JJNKJ IK%NJNI NJNI JL KIP%J L% $ I K: U MJJ J QNKJ K%PKJJNIK% JIK JJI KJ K% N JK NI&#& IL NK KK: U MJ J JK IKJINJNI JPJK KJKP I L JJPK U NJNIK PI J I I K%KNIK%KJIJK% IKN JK: U NI JJI RJ%NJNIIJKI% JI K NI NK KKK IJ K: U I 8JI RJ JI K IJKI P JJ NI NK KKK: U JJJI K JKI JJ NKJIL J%KN KJIJ% N ILJLNJ OJ %K IJK% KJI JK: U MJJ KII PI J JPK: U NJNIJ LJI K P JK%KNK# : U NJNII PI J J K: U J J K K JK JI J J J NI NK KK: U JM N J I JMJJ K: U MJJ KII NII J KKRJIJ K J IJK: U JIIJIOJ K NJNIP JK IINKJ K NKJJ JK P P LIKK N IJ JKJJ N NK NIJN IKN JKJ IJI LI J KMIKK I % N J KKK JRJ9 U J P JJ IJ NI NKJIL: U JK J JI I J LIKL PKJ JKRI ( NJNI JKJJL JI O P I IJNI : U J MJK N IJ JK P J RK NJ II NJK NJNI I KK J K: U NI JLJ J K NIJ PKJ JKI IJ L KNKKN LKNIP I JI JP II JK PI JI JK: U J R NK KKKJIJK PKJ R NK KKK J K: U K I NII NJK: U I J K J J K K JK% N J JIJ K K JR J1 %JJK NKK/KRI 1I %J K K JJ KI % IK J K K JR J1 R : U JP P IJ II NJKRJ# JK:
• our complex global supply chain, including from disruptions, delays, trade tensions and conflicts, or shortages; • product defects, errata and other product issues, particularly as we develop next-generation products and implement next-generation manufacturing process technologies; • potential security vulnerabilities in our products; • increasing and evolving cybersecurity threats and privacy risks; • IP risks including related litigation and regulatory proceedings; • the need to attract, retain, and motivate key talent; strategic transactions and investments; sales-related risks, including customer concentration and the use of distributors and other third parties; our significantly reduced return of capital in recent years; our debt obligations and our ability to access sources of capital; • complex and evolving laws and regulations across many jurisdictions; • fluctuations in currency exchange rates; • changes in our effective tax rate; catastrophic events; environmental, health, safety, and product regulations; our initiatives and new legal requirements with respect to corporate responsibility matters; and other risks and uncertainties described in this report and our other filings with the SEC. Given these risks and uncertainties, readers are cautioned not to place undue reliance on such forward-looking statements. Readers are urged to carefully review and consider the various disclosures made in this Form 10-K and in other documents we file from time to time with the SEC that disclose risks and uncertainties that may affect our business. Unless specifically indicated otherwise, the forward-looking statements in this Form 10-K do not reflect the potential impact of any divestitures, mergers, acquisitions, or other business combinations that have not been completed as of the date of this filing. In addition, the forward-looking statements in this Form 10-K are based on management's expectations as of the date of this filing, unless an earlier date is specified, including expectations based on third-party information and projections that management believes to be reputable. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law. Note Regarding Third-Party Information This Form 10-K includes market data and certain other statistical information and estimates that are based on reports and other publications from industry analysts, market research firms, and other independent sources, as well as management's own good faith estimates and analyses. Intel believes these third-party reports to be reputable, but has not independently verified the underlying data sources, methodologies, or assumptions. The reports and other publications referenced are generally available to the public and were not commissioned by Intel. Information that is based on estimates, forecasts, projections, market research, or similar methodologies is inherently subject to uncertainties, and actual events or circumstances may differ materially from events and circumstances reflected in this information. Intel, Arc, Arria, Celeron, Intel Agilex, Intel Atom, Intel Core, eASIC, Intel Evo, FlexRAN, Granulate, the Intel logo, Intel Optane, Intel Unison, MAX, Movidius, Open VINO, Open VINO logo, Pentium, Stiatix, Thunderbolt and the Thunderbolt logo, Intel vPro, and Xeon are trademarks of Intel Corporation or its subsidiaries. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Intel Corporation is under license. • Other names and brands may be claimed as the property of others. Availability of Company Information We use our Investor Relations website, www.intc.com, as a routine channel for distribution of important, and often material, information about us, including our quarterly and annual earnings results and presentations, press releases, announcements, information about upcoming webcasts, analyst presentations, and investor days, archives of these events, financial information, corporate governance practices, and corporate responsibility information. We also post our filings on this website the same day they are electronically filed with, or furnished to, the SEC, including our annual and quarterly reports on Forms 10-K and 10-Q and current reports on Form 8-K, our proxy statements, and any amendments to those reports. All such information is available free of charge. 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.... ........ 1,1EE pulp .g .tz "MS' a Imr. 11111111111 I i ," '22b .m.ssiquit II::: • la = "Hutu lislrbvii .== 1=7: nii.sliti 0=z, llis -.I' thihi I" 1 Is it ......1 11,._ i _ nums itl iiiiii " T asts.... We are an Industry leader and a catalyst for technology innovation and products that revolutionize the way we live. We are committed to harnessing the breadth and scale of our reach to have a positive effect on business, society, and the planet. Our purpose is to create world-changing technology that improves the life of every person on the planet. in r i e if
Introduction to Our Business We are committed to creating world-changing technology that improves the life of every person on the planet—we are the technology the world builds on. We have the opportunity to push the boundaries of what's possible and to create solutions to the world's biggest challenges. As technology permeates every aspect of our lives, we see an insatiable demand for processing power. That is why we are opening our manufacturing network to the world and creating the resilient supply chain industries need. It's why we are bringing the full breadth of our silicon and software to bear by bringing Al everywhere—from the client to the data center to the edge. It's why we continue our relentless pursuit of Moore's Law to unlock innovation and spark new ecosystems. Much as oil has defined geopolitics for the past five decades, technology supply chains and where semiconductors are built will define the next five decades. With one of the most geographically balanced supply chains across North America, Europe and Asia, we lead the way in creating open, end-to-end value chains that the US and Europe seek for resiliency and security—and that, for the first time, gives the ecosystem a true alternative to other foundries. We are at a pivotal moment in Al technology. AI is an incredibly powerful technology with untold potential, but it's still relatively immature. We must ensure Al technology advances responsibly. Intel defines the spirit of Moore's Law as relentless innovation and pursuit of exponential leaps in computing power—all in close collaboration with our customers. But we're not finished yet. Continuous innovation is the cornerstone of Moore's Law. We do this because we are committed to being an excellent partner for the next era of compute: creating trusted environments, collaboratively innovating and delivering exceptional engineering, from silicon to services. The possibilities are limitless. It starts with Intel. "Semiconductors are essential to maintaining and enabling modern society and there are infinite possibilities as we enter the age of Al. Our strategy for reclaiming process and product leadership, bringing Al everywhere and driving a resilient, diverse and balanced supply chain, puts Intel in the position to help define the future of technology." — Pat Gelsinger, Intel CEO I l .” !"# ’ ’ $ ’ I f ’ i ’ % $ & ' " (( )* " + $ $ I , / I $ %, 0 $ & 1 , ! $ ’ & $ & $ 2 & “
Revenue Gross Margin Diluted EPS Attributable to Intel 2022 2023 $63.1 2022 $54.2 2023 47.3% 43.6% $(11.9) 2023 $1.67 $1.05 $0.40 $(4.1) 2022 2023 2022 $54.2B GAAP 40.0% GAAP 43.6% non-GAAP1 $0.40 $1.05 GAAP non-GAAP1 $11.5B $(11.9)B GAAP non-GAAP1 A Year in Review 2023 revenue was $54.2 billion, down $8.8 billion, or 14%, from 2022. CCG revenue decreased 8% due to lower notebook and desktop volume from lower demand across market segments, partially offset by increased volume in the second half of the year as customer inventory levels normalized compared to higher levels in the first half. Notebook ASPs decreased due to a higher mix of small core products combined with a higher mix of older generation products. This was partially offset by higher desktop ASPs due to an increased mix of product sales to the commercial and gaming market segments. DCAI revenue decreased 20% due to lower server volume resulting from a softening CPU data center market, partially offset by higher ASPs from a lower mix of hyperscale customer-related revenue and a higher mix of high core count products. NEX revenue decreased 31% as customers tempered purchases to reduce inventories and adjust to a lower demand environment across product lines. We invested $16.0 billion in R&D, made capital investments of $25.8 billion, and had $11.5 billion in cash from operations and $(11.9) billion of adjusted free cash flow. Cash Flows ■ GAAP $B ■ GAAP ■ Non-GAAP ■ GAAP ■ Non-GAAP ■ Operating Cash Flow $B ■ Adjusted Free Cash Flow' $B Revenue down 14% from 2022 Gross margin Gross margin Diluted EPS Diluted EPS Operating Adjusted free revenue down 2.6 ppts down 3.7 ppts down $1.54 or down $0.62 or cash flow cash flow down from 2022 from 2022 79% from 37% from down $4.0B $7.8B or 191% 2022 2022 or 26% from from 2022 2022 Lower revenue in CCG, DCAI, Lower GAAP gross margin from Lower GAAP EPS from lower Lower operating cash flow and NEX. lower revenue, higher unit cost, gross margin and absence of primarily driven by lower net and higher excess capacity one-time gains recognized in income, partially offset by charges, partially offset by the 2022, partially offset by lower favorable changes in working sell-through of previously R&D and MG&A spending, and capital and other adjustments. reserved inventory, lower a higher tax benefit. inventory reserves taken in 2023, lower product ramp costs, and the absence of one-time charges recognized in 2022. Managing to our long-term financial model Our 2023 results reflect the continued advancement of our transformational journey. We continued to prioritize investments critical to our IDM 2.0 transformation, achieved operational milestones, and executed disciplined expense management. To achieve our long-term financial model, we believe it is imperative that we drive to world-class product cost and operational efficiency. A key component of our overall strategy is our internal foundry model. Under this model, we intend to reshape our operational dynamics and establish transparency and accountability through standalone profit and loss reporting for our manufacturing group in 2024. We expect this model to enable increased efficiencies across a number of aspects of our organization that we believe are integral to achieving our financial and operational goals. At the same time, we continue to prioritize capital investments critical to our efforts to regain process leadership and establish a leading-edge, at-scale foundry business. See "Non-GAAP Financial Measures" within MD&A. intel. Fundamentals of Our Business 5 #,I PR **+IP NRK;-1 * % R ;2 2 % I1<%I *** "IP NIK2<NJ RI J KJ P NI RI I KKIJK JK%IJ L KJ L IKP N JK JLIKNKJ I P J IL P K I O IJ I P K JIKJ & J #$KIKNJ IM K I I NJK RJIM I IJ I NJK KRKIJ L KJ LIKJ #$KNJ IK M I NJK KJ J I IJK JK # IP NIK*<NJ RIKIPIP N IKN J I K J $1J JIIJ%IJ L KJ LI#$KI RIM LIK NKJ II J IP N IM I N JI NJK & =IP NIK+<KNKJ IKJINIKKJ IN P J IK 8NKJJ RI PI JI KKI NJ K ! 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Delivering leadership products We seek to develop and offer leading products that will help enable a future in which every human can have more computing power and quicker access to data. We remain committed to our goal of delivering five technology nodes in four years to regain transistor performance and power performance leadership by 2025. This year, we achieved several key milestones on our product roadmap, including: • We launched the Intel® Core TM Ultra processors, featuring our first integrated neural processing unit, for power-efficient Al acceleration and local inference on the PC. • We introduced the 13th Gen Intel® Core TM mobile processor family, led by the launch of the first 24-core processor for laptops, and introduced the new Intel vPro® Platform powered by the full lineup of 13th Gen Intel Core processors. We introduced the 14th Gen Intel® Core TM desktop processor family, delivering fast desktop frequencies and enhanced desktop experience for enthusiasts. • We launched the 4th Gen Intel® Xeon® Scalable processors, a critical part of our heterogeneous hardware and software portfolio to accelerate real-world data center, cloud and edge workloads, including Al, and also launched the 4th Gen Intel Xeon Scalable processors with Intel® vRAN Boost, a new general-purpose chip that fully integrates Layer 1 acceleration into the Xeon SoC and is designed to eliminate the need for external accelerator cards. • We launched the 5th Gen Intel® Xeon® Scalable processors for data center, cloud, and edge, with embedded capabilities for powering Al workloads. • We introduced two new Intel® Arc1M Pro Graphics Processing Units, Intel Arc Pro A60 and Intel Pro A60M, and shipped Intel Arc Pro A40-based systems. Investing in leading-edge, at-scale manufacturing We are committed to strengthening the resilience of the global semiconductor supply chain for leading-edge semiconductor products by investing in geographically balanced manufacturing capacity. In the US, we are expanding our existing operations in Arizona, New Mexico, and Oregon, and investing in two new leading-edge chip factories in Ohio. We have submitted all four of our major project proposals in Arizona, New Mexico, Ohio, and Oregon, estimated to represent over $100 billion of US manufacturing and research investments over the next five years, to the US Department of Commerce's CHIPS Program Office. In the European Union and Israel, we have announced a series of investments, spanning our existing operations in Ireland and Israel, as well as our planned investment of more than $33 billion in Germany to build a leading-edge wafer fabrication mega-site, and our plans to invest up to $4.6 billion in an assembly and test facility in Poland. We also announced the start of high-volume manufacturing using Intel 4 technology and EUV technology in Ireland. Unlocking value We continue to look for innovative ways to unlock value for our stakeholders. We sold a 32.4% minority stake in our IMS Nanofabrication business, including investments from Bain Capital and Taiwan Semiconductor Manufacturing Company (TSMC). Net proceeds resulting from the IMS minority stake sales totaled $1.4 billion. We also executed a secondary offering of Mobileye stock that generated net proceeds of $1.6 billion. Further, we communicated our intent to operate our Programmable Solutions Group (PSG) as a standalone business, with standalone financial reporting beginning January 1, 2024. This is expected to enable potential private and public equity investments. These transactions provide an additional source of capital to support the critical investments needed to advance our strategy. intel. Fundamentals of Our Business 6 PI IKI NJK !KJ P I I NJKJJR NJNI RPILN P I NJ RI QNIKKJ J !I JJJ NI PI PJ L K NILIKJ I JI KKJ I I I RII I IK L**- KLI%RPKPI L KJ K NII NJI % N 9 W ! N J J X IY1 JII KK IK%JNI NIIKJ JIJ NI I KK N J% I RI J# IJ I J$ W ! JI NJ+J" J X IY I KK I L% LJ N JIKJ*1 II KK I I J K% JI NJ R J P$I X$ J I RI LJN N +J" J II KK IK W ! JI NJ1J" J X IYKJ I KK I L% PI KJKJ IQN K KJ MI I JNKKJK W ! N J1J" J X= X I KK IK%IJ IJ NIJI NKIRI K JRI IJ J IJI R I J JI% N R I K% N # % K N J1J" J = I KK IKRJ J XP #&) KJ% R I NI KJJN L JIJK0LI IJ J J= KK J JJ IMJI IJ IIK W ! 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Superpowers fuel strategic pillars and guide execution Ubiquitous Compute:Everything we interact with involves computer technology CS ec no o u •e r• ow er Eit aroduct Leadership We intend to lead and democratize compute with Intel x86 and 111P1atforms We aim to deliver open software and hardware platforms with industry-leading standards. Manufacturing at Scale Our I M 2.0 strategy combines three capabilities: our internal factory network, strategic use of foundry capacity. and our systems foundry. Our People Our world-class talent is at the heart of everything we do. We strive to have a positive effect on business, society, and the planet. Network and Edge 6)26 Mobileye Pervasive Connectivity: Everything and everyone is connected Cloud-to-Edge Infrastructure: Unlimited scare and capacity combined with unlimited reach—while simultaneously addressing the need for lower latency and higher bandwidth Artificial Intelligence: Intelligence everywhere —turning infinite data into actionable insight Sensing: Through advancements in Al, telemetry, photonics, mapping, and more, machines are adopting human-centric abilities for smarter, more useful data Our State. Technology permeates every aspect of our lives and is increasingly central to every aspect of human existence. As we look ahead to the next decade, we expect to see continued demand for processing power. Semiconductors are the underlying technology powering this digital expansion, and we are strategically positioning ourselves to create a resilient global semiconductor supply chain by investing in geographically balanced manufacturing capacity. The demand for compute is being accelerated by five superpowers: ubiquitous compute, pervasive connectivity, cloud-to-edge infrastructure, AI, and sensing. Together these superpowers combine to amplify and reinforce each other, and will exponentially increase the world's need for computing by packing even more processing capability onto ever-smaller microchips. We intend to lead the industry by harnessing these superpowers for our customers' growth and our own. We are uniquely positioned with the depth and breadth of our silicon, platforms, and software, and packaging and process technology with at-scale manufacturing. With these strengths and the tailwinds of the superpowers driving digital disruption, our strategy to win is focused on four key themes: product leadership, open platforms, manufacturing at scale, and our people. Our Priorities Product Leadership Lead and democratize compute with Intel x86 and xPU. Our product offerings provide end-to-end solutions, scaling from data center to network, PCs, edge computing, and the emerging fields of Al and autonomous driving, to serve an increasingly smart and connected world. At our core is the x86 computing ecosystem, which supports an extensive and deep universe of software applications, with billions of lines of code written and optimized for x86 CPUs. We continue to advance this ecosystem with x86 microarchitectures focused on performance, which push the limits of low latency and single-threaded application performance, and microarchitectures focused on efficiency, which are designed for computing throughput efficiency to enable scalable multithreaded performance. Beyond the CPU, we are delivering a growing family of xPU products, which encompass client and data center GPUs, IPUs, FPGAs, and other accelerators. The xPU approach recognizes that different workloads benefit from different computing architectures, and our broad portfolio helps meet our customers' increasingly diverse computing needs. As part of our strategy, we seek to develop and offer leading products across each of these architectural categories. We also seek to address every phase of the Al continuum, including the largest, most challenging GenAl and large language models. We believe Al represents a generational shift in computing by expanding human abilities and solving the most challenging problems. We are in the early stages of realizing Al's full potential and GenAl is just the beginning. Our strategy is to bring Al to where the data is being generated and used and we believe we have a full spectrum of hardware and software platforms, offering open and modular solutions, for competitive total cost of ownership and time to value that customers need to win in this era of exponential growth and Al everywhere. We are infusing Al into Intel technologies, supporting today's GenAl workloads, fueling emerging usages like Al PC and Al at the edge, and pioneering innovations that we believe advance the future of Al in the next decade. We believe our leadership in IP, process, packaging, security, software, services, manufacturing, and foundry services positions us to realize Al's full potential to transform industries and solve the world's biggest challenges. Intel. Fundamentals of Our Business 7 NIJIJL LIJKPILKJ NI PK K IK L JI J PILKJ N MKJ #KR J J MJ%RMJJ K J N II KK RI NJ IKIJN I L J L RI JK J M K % RIKJIJ L KJ NIK PKJ IJIK J K NJ IKN L L PKJ I L NJNI JL I NJK IJ LPKNI RIK9N QNJ NK NJ% IPKP JPJL% NJ IKJINJNI%# % K K JIJKKNI RIK J L I I JI% R M J L IKJR I /K I NJ L P II KK JL J PIK I I K ! J J J NKJIL LI KK JKKNI RIK I NINKJ IK/I RJ NI R !IN QN L KJ RJJJ IJ NIK % J IK% K JRI% I KKJ LRJ JK NJNI !JJKKJI JK JJ R K JKNI RIKIP J KINJ % NIKJIJLJ R K NK NILJK9I NJ IK% J IK% NJNI JK % NI NI$I IJK $I NJ0IK 0 IJO NJRJ J M23 M$1 NII NJ I KI P J K NJ K%K I J JIJ JR I%$K% NJ % JI K # NJ NKIP %J KIP IK LKIJ J R I #J NI IKJM23 NJ KLKJ%RKN IJK MJ KP N PIK K JRI J K%RJ K K RIJJ JO IM23$1K ! J NJ P JK KLKJRJM23I IJJNIK NK I I %RNKJ JK R J L K JI J I I % I IJJNIK NK L%RIK I NJ JI NNJ LJ K N JJII I )L J$1%RI PI I R L M$1I NJK%R KK J J JI"$1K% $1K%$"#K% JI IJ IK M$1I I OKJJI JR I K JI I J NJ IJJNIK% NI I IJ KJ NINKJ IK/ IK LPIK NJ K #KIJ NIKJIJL%RKJ P I I NJKI KK JKIJJNI J IK ! K KJ IKKPILK J# J NN% N J IKJ% KJ " # I N K ! P# IIK JK IJ KJ NJ LM N JK K P J KJ I K !I JI LKJK I O # /KN J J " # K8NKJJ NIKJIJLKJ I # J RIJJK IJ NK R PRPN KJIN IRI K JRI J IK% I N IK NJ K% I JJPJ J KJ R IK JJ P NJJNKJ IK J R JKI M J I RJ # PILRI ! 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Open Platforms We aim to deliver open software and hardware platforms with industry-defining standards. Around the globe, companies are building their networks, systems, and solutions on open standards-based platforms. Intel has helped set the stage for this movement, with our historic contributions in developing standards such as CXL, Thunderbolt1M, and PCI Express*. We also contributed to the design, build, and validation of open-source products in the industry such as Linux*, Android*, and others. The world's developers constantly innovate and expand the capabilities of these open platforms while increasing their stability, reliability, and security. In addition, microservices have enabled the development of flexible, loosely coupled services that are connected via application programming interfaces to create end-to- end processes. We use industry collaboration, co-engineering, and open-source contributions to accelerate software innovation. Through our oneAPI initiative, developers use a unified language across CPUs, GPUs, and FPGAs that is designed to reduce development time and to enhance productivity. We also deliver a steady stream of open-source code and optimizations that are designed for projects across virtually every platform and usage model. We are committed to co-engineering and jointly designing, building, and validating new products with software industry leaders to accelerate mutual technology advancements and help new software and hardware work better together. Our commitment extends to developers through our developer-first approach based on openness, choice, and trust. Ultimately, we believe our pivot to a software-defined, silicon-enhanced strategy will enable us to realize value at all layers of the compute stack. This should allow us to continue to monetize foundational and ecosystem-enabling software through hardware sales, limited licensing, and customer-enabling service offerings. Additionally, we are expanding our software portfolio by developing and monetizing software solutions, services, and platforms with SaaS, software subscriptions, and other business models. We are prioritizing three portfolios of offerings for our SaaS and subscription-based software: AI, trust and security, and performance optimization. We are also scaling the availability of Intel® Developer Cloud, which is designed to enable developers to learn, prototype, test, and run their own Al workloads across multiple Intel hardware architectures to experience the competitive performance of Intel platforms and develop their Al software from today's hardware portfolio to next-generation architectures. An open approach and deep engagement with the developer ecosystem are essential to lowering barriers to entry and unlocking Al innovations for developers and customers. We are expediting an open Al software ecosystem that we believe is needed to break down proprietary walls. We offer customers, partners, and developers early access and a rapid path to scale their Al solutions with the Intel Developer Cloud and integrated and scalable hardware and software systems and solutions. We believe Al will only be truly accessible to all when its use is ethical and responsible. Partnering with industry leaders, we are working to deliver innovative ecosystem tools and solutions intended to make Al safer and more secure, and help address privacy concerns as Al scales exponentially. We are building platforms and technologies for the convergence of Al and security to help customers confidently secure diverse Al workloads across the data center, cloud, PC, and edge. Manufacturing at Scale IDM 2.0, the next evolution and expansion of our IDM model, is a differentiated strategy that combines three capabilities: Internal factory network. Our global, internal factory network has been foundational to our success, enabling product optimization, improved economics, and supply resilience. We intend to remain a leading developer of process technology and a major manufacturer of semiconductors and will continue to build the majority of our products in our factories. Strategic use of foundry capacity. We expect to expand our use of third-party foundry manufacturing capacity, which will provide us with increased flexibility and scale to optimize our product roadmaps for cost, performance, schedule, and supply. Our use of foundry capacity will include manufacturing for a range of modular tiles on advanced process technologies. Open System Foundry. We are building a world-class foundry business to meet the growing long-term global demand for semiconductors. We plan to differentiate our foundry offerings from those of others through a combination of leading-edge packaging and process technology, committed capacity in the US and Europe available for customers globally, and a world-class IP portfolio that will include x86 cores, as well as other ecosystem IP. The current foundry model enabled explosion of ecosystem innovation at the wafer level. We believe this established model has historically served the industry well, but a new mindset is needed in our new era of chipmaking. As innovation evolves, we see the rack has collapsed into a system and the system has collapsed into an advanced package. We are building out an Open System Foundry that has four components: wafer fabrication, packaging, chiplet standard, and software. The Open System Foundry involves engaging with customers at multiple levels, from basic wafer manufacturing to helping define and implement their desired system architectures. We intend to build our customers' silicon designs and deliver full end-to-end customizable products built with our advanced packaging technology. We believe our IDM 2.0 strategy enables us to deliver leading process technology and products to meet growing long-term demand using internal and external capacity, while leveraging our core strengths to provide foundry services to others and providing superior capacity, supply resilience, and an advantageous cost structure. In the upcoming year, we plan to implement an internal foundry model, where our business units engage with our manufacturing group in an arm's-length fashion, similar to how fabless semiconductor companies engage with external foundries. The model is integral to our IDM 2.0 operational and financial strategies and aims to fully leverage our invested capital while serving a wide variety of chip customers worldwide. intel. 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Recent events, including the pandemic-related global chip shortage, made clear how supply chain disruptions can severely impact everyday life. The steady rise of chipmaking capacity in Asia has made the world vulnerable to continued and increasingly extreme shortages. We believe a secure, balanced, and resilient supply of semiconductors is essential to the interests of the entire global economy. With one of the most geographically balanced supply chains across North America, Europe and Asia, we plan to partner with the public sector to strengthen the resilience of the global semiconductor supply chain by investing in a more geographically balanced capacity. We believe our investments will help develop a more resilient supply chain for generations to come and hedge against geopolitical instability. Our People Our world-class talent is at the heart of everything we do. Together we strive to have a positive effect on business, society, and the planet. Delivering on our strategy and growth ambitions requires attracting, developing, and retaining top talent from across the world. Our people build our technology, unlock new business opportunities, and work with our partners and customers to create global impact. Fostering a culture of empowerment, inclusion, and accountability is also core to our strategy. We are committed to creating an inclusive workplace where the world's best engineers and technologists can fulfill their dreams and create technology that improves the life of every person on the planet. Growth Imperative We are investing to position the company for accelerated long-term growth, focusing on both our core businesses and our growth businesses. In our client and server businesses, our strategy is to invest to strengthen the competitiveness of our product roadmap and to explore new opportunities. We believe we have significant opportunities to grow and gain share in graphics; mobility, including autonomous driving; networking and edge; AI; software; and foundry services. Focus on Innovation and Execution We are focused on executing our product and process roadmap and accelerating our cadence of innovation. We have set a detailed process and packaging technology roadmap and announced key architectural innovations to further our goal of delivering leadership products in every area in which we compete. We are returning our culture to its roots in innovation and execution, drawing on principles established by our former CEO Andy Grove that emphasize discipline and accountability. This includes using OKRs throughout the organization to drive a common purpose. To help us execute toward our IDM 2.0 strategy, we are leveraging our Smart Capital approach. This approach is designed to enable us to adjust quickly to opportunities in the market, while managing our margin structure and capital spending. The key elements of Smart Capital include: ■ Smart capacity investments. We are aggressively building out manufacturing shell space, which gives us flexibility in how and when we bring additional capacity online based on milestone triggers such as product readiness, market conditions, and customer commitments. ■ Government incentives. We are continuing to work with governments in the US and Europe to advance and benefit from incentives for domestic manufacturing capacity for leading-edge semiconductors. ■ SCIP. We are accessing strategically aligned capital to increase our flexibility and help efficiently accelerate and scale manufacturing build-outs. This type of co-investment also demonstrates how private capital is unlocked and becomes a force multiplier for government incentives for semiconductor manufacturing expansion. ■ Customer commitments. IFS is working closely with potential customers to make advance payments to secure capacity. This provides us with the advantage of committed volume, de-risking investments while providing capacity corridors for our foundry customers. ■ External foundries. We intend to continue our use of external foundries where their unique capabilities support our leadership products. intel. Fundamentals of Our Business 9 JP JK% N J I J K IJ% I RKN L KINJ K KPI LJ PILL KJLIK JL #KKJR I PN I J J N IK LMJI K IJK ! PKNI% % IK JKN L K NJ IKKKK J J J JIKJK J JI L !J J KJ I L KN L KI KK& IJ#I% NI #K%R J IJ IRJ JN KJ IJ KJI J JIK J K NJ IKN L L PKJ I I L JL ! 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Our Ca•ital We deploy various forms of capital to execute our strategy in a way that seeks to reflect our corporate values, help our customers succeed, and create value for our stakeholders. Capital Strategy Financial Value Leverage financial capital to invest in ourselves and exit businesses to optimize our portfolio, both to drive our strategy and long-term value creation. We strategically invest financial capital to continue to build our business, create long-term value and provide returns to our stockholders. Intellectual Invest significantly in R&D and IP to enable us to deliver on our accelerated process technology roadmap, introduce leading x86 and xPU products, and develop new businesses and capabilities. We develop IP to enable next-generation products, create synergies across our businesses, expand into new markets, and establish and support our brands. Manufacturing Build manufacturing capacity efficiently to Our geographically balanced manufacturing scope and meet the growing long-term global demand for scale enable us to provide our customers with a broad semiconductors, aligned with our IDM 2.0 strategy. range of leading-edge products and foundry capabilities. Human Build a diverse, inclusive, and safe work environment to attract, develop, and retain top talent needed to build transformative products. Our talented employees enable the development of solutions and enhance the intellectual and manufacturing capital critical to helping our customers win the technology inflections of the future. Social and Relationship Build trusted relationships for both Intel and our stakeholders, including employees, suppliers, customers, local communities, and governments. We collaborate with stakeholders on programs to empower underserved communities through education and technology, and on initiatives to advance accountability and capabilities across our global supply chain, including accountability for the respect of human rights. Natural a Strive to reduce our environmental footprint through efficient and responsible use of natural resources and materials used to create our products. With our proactive efforts, we seek to mitigate climate and water impacts, achieve efficiencies, lower costs, and position ourselves to respond to the expectations of our stakeholders. Comprehensive ESG and Corporate Responsibility Strategy: RISE Our commitment to corporate responsibility and sustainability leadership is deeply integrated throughout our business. We strive to create an inclusive and positive work environment where every employee has a voice and a sense of belonging, and we are proactive in our efforts to reduce our environmental footprint through efficient and responsible use of natural resources and materials. We continue to raise the bar for ourselves and leverage our leadership position in the global technology ecosystem to make greater strides in corporate responsibility and apply technology to address social and environmental challenges. Through our RISE strategy, we aim to create a more responsible, inclusive, and sustainable world, enabled by our technology and the expertise and passion of our employees. Our corporate responsibility strategy is designed to increase the scale of our work through collaboration with our stakeholders and other organizations; we know that we cannot achieve the broad social impact to which we aspire by acting alone. More information about our RISE goals, including progress we have made toward achieving them, is included in our Corporate Responsibility Report'. The contents of our Corporate Responsibility Report are referenced for general information only and are not incorporated by reference in this Form 10-K. Intel. Fundamentals of Our Business I Our Capital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$35.9 $21.8 $29.5 7 $10.9 $15.4 $42.4 $41.8 $5.6 $14.2 2022 2023 2019 2020 $33.9 2019 2020 2021 $5.6 $6.0 2.4 $3.1 2021 2022 2023 Financial Capital We take a disciplined approach to our financial capital allocation strategy, which continues to focus on building stakeholder value and is driven by our priority to invest in the business and capacity and our capital needs. We also seek to pay competitive dividends, optimize our portfolio, look for innovative ways to unlock value across our assets, and, from time-to-time, engage in mergers and acquisitions. As we invest in our IDM 2.0 strategy and implement our next phase of capacity expansions and the acceleration of our process technology roadmap, our allocation priorities have shifted more heavily toward investing in the business and away from stock repurchases. In the long term, we will continue to look for opportunities to further our strategy through acquisitions while remaining disciplined on capital allocation. Cash from Operating Activities $B $(4.1) $(11.9) 2019 2020 2021 2022 2023 • Cash from Operating Activities Adjusted Free Cash Flow' Our Financial Capital Allocation Strategy Invest in the Business Our first allocation priority is to invest in R&D and capital spending to capitalize on the opportunity presented by the world's demand for semiconductors. In 2023, we continued our focus on capital investment and the deployment of our Smart Capital strategy. Return Excess Cash to Stockholders Our capital allocation strategy includes returning excess cash to stockholders. We achieve this through our dividend policy and, when permissible, stock repurchases. In 2023, we declared a reduced quarterly dividend on our common stock. This dividend reduction reflects our deliberate approach to capital allocation, is expected to support the critical investments needed to execute our business strategy, and is designed to position us to create long-term value. We expect future stock repurchases to continue to be curtailed during this time of meaningful investment in capital. R&D and Capital Investments $B Cash to Stockholders $B • R&D • Logic • Memory2 • Repurchases Dividend Optimize our Portfolio and Unlock Value Our capital allocation strategy also includes opportunistic investment in and acquisition of companies that complement our strategic objectives. We look for acquisitions that supplement and strengthen our capital and R&D investments. We also seek to drive value creation through transactions such as the 2022 Mobileye IPO, the 2023 minority stake sales in IMS, and the 2023 announcement of our intent to operate PSG as a standalone business which we expect to enable potential private and public equity investments. Together, these transactions provide an additional source of capital to support the critical investments needed to advance our business strategy. Lastly, we take action when investments do not strategically align to our key priorities. In the last three years, we exited numerous businesses, including the NAND memory business and Intel® Optane TM memory business. I See "Non-GAAP Financial Measures" within MD&A. 2 2021-2023 capital investments in Memory are not presented due to the divestiture of the NAND memory business announced in October 2020. 2019 and 2020 capital investments presented include Memory. Intel. Fundamentals of Our Business I Our Capital 11 J !JK I J NI J J KJIJL%R J NKJ NK N KJ IP N K IP L NII IJLJ PKJ J NK KK JL NIJ K ! K KJ L JJPP K% JO NI IJ % I PJPRLKJ N P NI KK NIKKJK% %I JJ J% IIK QNKJ K #K R PKJ NI '* KJIJL J NI MJK JLM K K J IJ NII KKJ L I % NI J I IJKPKJ IP LJ RI PKJ J NK KK RLI KJ INIKK J JI%RR J NJ I IJN JKJ NIJI NIKJIJLJI NQNKJ KR I K J J KI IJ #JPJK;) % 7! % 7 %7 %7 %7%!7" %7$ %7 %7 %7 *7 ** ** *** **+ VKI IJ #JPJK V#8NKJIK R NI J # J JIJL PKJ J)NK KK NIIKJ J I IJLKJ PKJ ( J K J J O J IJN JLIK J LJR I /K I K NJ IK **+%R J N NI NK J PKJ J J L J NIIJJ KJIJL JNI MKKKJ J IK NIJ J KJIJL NKIJNI MKKKJ KJ IK !PJKJI N NIP L %R IKK %KJ INIKK **+%R IINQNIJI LP NI KJ KP INJ I JK NI IJI J J J %KMJJ KN IJJIJ PKJ JK J MNJ NI NK KKKJIJL% KK J KJ NKJ IJ JIP N !MJNJNIKJ INIKKJ J NJ NIJ NI JKJ N PKJ J J ( J PKJ JK;) KJ J IK;) %7! %"7$ % 7 %7 %7$ *7 ** ** *** **+ ;+ 3 ;1 * ;* 1 ;Z Z ;- 3 ;- 3 ;- 3 ;3 ;+ *7 ** ** *** **+ V ( V0 V' IL* V NIKK V P JO NI$ IJ 1 ? N NIJ J KJIJL K NK IJN KJ PKJ J QNKJ KJJ J NIKJIJ 8JPK ! IQNKJ KJJKN J KJI J NIJ ( PKJ JK ! K KJ IPP NIJ JI NJI KJ KKNKJ***' L $%J**+ IJLKJK K '% J **+ N J NI J JJ IJ$"KKJ NK KKRRMJJ J J IPJ N QNJL PKJ JK JI%JKJI KJ KI P J K NI J J KN IJJIJ PKJ JK J P NI NK KKKJIJL 0KJ L%RJJ R PKJ JK JKJIJ L J NILI IJK J KJJILIK%RMJ NI NK NK KKK% N J&#& IL NK KK J XJ Y IL NK KK * /& 0;-# $ "#$ 7 $61! 6B# 2# 7 "$4# $ # , 6 ) 6# 7 )&!C$! & 4! 6 991 & 2 9#, 6 # 1! &? 2 // ) )&!C=16# 66$ &1 " 9# 3" &= ! $ 9 "$4# $ # , 6 ) 64! 6 9# " 19 7 )&!C N J K NI)NK KK NIJ
Intellectual Capital Research and Development R&D investment is critical to enable us to deliver on our accelerated technology roadmap, introduce leading products, and develop new businesses and capabilities in the future. We seek to protect our R&D efforts through our IP rights and may augment R&D initiatives by acquiring or investing in companies, entering into R&D agreements, and directly purchasing or licensing technology. Areas Key to Product Leadership We have intensified our focus on areas key to product leadership. Our objective with each new generation of products is to improve user experiences and value through advances in performance, power, cost, connectivity, security, form factor, and other features. We also focus on reducing our design complexity, re-using IP, and increasing ecosystem collaboration to improve our efficiency. Process and packaging. Our leading-edge process and packaging technology and world-class IP portfolio are key to the success of our strategy. We are committed to achieving process technology leadership in 2025 by planning to deliver five technology nodes in four years. In addition, we have solidified our process and packaging offerings to external customers through IFS. ■ Intel 7 process node is in production for our 13th Gen Intel Core processors and represents the continuous improvement of transistor and interconnect performance. ■ Intel 4, our first EUV node, delivers significant density scaling and approximately 20% performance-per-watt improvement over Intel 7. The Intel Core Ultra processor is our first high-volume client product on Intel 4 and began shipping to customers in Q3 2023. ■ Intel 3 is expected to deliver further logic scaling and up to 18% performance-per-watt improvement over Intel 4. Intel 3 is our first advanced node offered to IFS customers and is optimized for the needs of data center products. ■ Intel 20A will follow Intel 3 and will introduce two breakthrough technologies that we expect to deliver up to a 15% performance- per-watt improvement over Intel 3: RibbonFET and PowerVia. RibbonFET, our implementation of a gate-all-around transistor, is designed to deliver faster transistor switching speeds while achieving the same drive current as multiple fins, but in a smaller footprint. PowerVia is our unique industry-first implementation of backside power delivery that is designed to optimize signal transmission by eliminating the need for power routing on the front side of the wafer. ■ Intel 18A, our second IFS advanced node offering, will improve on Intel 20A by delivering ribbon innovation for design optimization and line width reduction. Intel 18A is expected to deliver an additional 10% improvement in performance per watt over Intel 20A. ■ Beyond Intel 18A, we have initiated definition and development of our next two process nodes and continue to define, build, and develop the next-generation High Numerical Aperture EUV lithography into our process technology roadmap. To continue our modernization and infrastructure expansions, we have begun the installation of the world's first High-NA EUV tool for commercial use at our Gordon Moore Park in Oregon. ■ Our family of 3D advanced packaging technology will usher in the next generation of Foveros technology, enabling us to mix multiple top die tiles with multiple base tiles across mixed fab nodes, providing greater flexibility for disaggregated chip designs. Our future Foveros Direct technology should scale interconnect pitch below 10pm, enable direct copper-to-copper bonding for low-resistance interconnects, and blur the boundary between wafer and package. Longer term, we expect to deliver complete glass substrate solutions as the next generation of advanced packaging designed to enable continued scaling of transistors in a package. xPU architecture. We believe the future is a diverse mix of scalar, vector, matrix, and spatial architectures deployed in CPU, GPU, IPU, accelerator, and FPGA sockets, enabled by a scalable software stack and integrated into systems by advanced packaging technology. We are building processors that span several major computing architectures, moving toward an era of heterogeneous computing: • CPU. We started shipping our 5th Gen Intel Xeon Scalable processors based on Intel 7 with built-in Al acceleration, cryptographic acceleration, and advanced security capabilities. We also launched our 14th Gen Intel Core processors, which are designed to scale from thin and light laptops to enthusiast desktop and notebook platforms. These are based on a hybrid architecture utilizing our most advanced performance cores and power-efficient cores. • GPU and HPC. The Intel Arc graphics family offers modern GPU features to power today's demanding games, applications, and Al workloads. In 2023, the Intel Arc portfolio expanded while offering a substantial performance uplift through continual driver updates, offering consumer and professional solutions that target a significant part of the market. Intel Arc discrete GPUs currently ship in three performance tiers, with Intel Arc 7, 5, and 3 series for consumers, and Intel Arc Pro A60, A50, and A40 for workstations. In the mobile segment, Intel Arc A-series GPUs can be found powering a range of consumer and workstation designs. In Q1 2023, we launched the Intel® Xeon® CPU Max Series and Intel® Data Center GPU Max Series. Designed for the future compute demands of HPC and Al workloads, the Intel Max Series product family power the Aurora supercomputer at Argonne National Laboratory. Intel. Fundamentals of Our Business I Our Capital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■ Infrastructure Acceleration. Our first ASIC IPU has been deployed widely across Google Cloud. Our second generation IPU, is also co-developed with Google and is expected to tape in the first half of 2024. It is expected to double the throughput and compute capabilities. The IPU becomes the center of the CSP compute platform, with the bulk of CSP infrastructure cycles spent running on the IPU and not the host processor. This frees up processing cores for business-value applications and infrastructure as a service rental. • Ethernet. Our 200G foundational network interface card targeting cloud, enterprise, and edge, is expected to go into production in 2H 2024 and extend our 100G market. Additionally, we plan to productize our 10G/2.5G/1G offering, a refresh of our high- volume 10G and 1G portfolio with modernized software, management, and manufacturing technologies. • Matrix Accelerator. We are showing strong customer and performance momentum for our Intel® Gaudi® Al accelerators. In Q3 2023, we announced that a large Al supercomputer would be built entirely on Intel Xeon processors and 4,000 Intel Gaudi 2 Al hardware accelerators, with Stability Al as the anchor customer. Software. Software unleashes the potential of our hardware platforms across all workloads, domains, and architectures. ■ oneAPI adoption continues to expand across the industry. oneAPI is designed to enable developers to build cross-architecture applications using a single code base across CPUs, GPUs, and FPGAs to reduce development time and enhance productivity. Our oneAPI-based tools take advantage of unique hardware features and lower software development and maintenance costs. Developers can choose the best architecture for the problem at hand without rewriting their entire code base, accelerating their time to value. ■ We seek to accelerate adoption of oneAPI and Intel software developer tools through diverse ecosystem activities, including developer training, summits, centers of excellence, access to Intel hardware and software through Intel Developer Cloud and industry collaboration through the Linux Foundation's Unified Acceleration (UXL) Foundation project. Our Intel Developer Cloud offering is designed to host global users spanning AI, data science, high-performance computing, media and graphics, and other accelerated computing workloads using oneAPI and the latest Intel hardware. ■ We believe Al will be ubiquitous, and with our tools and the broad open software ecosystem, we are well-positioned to scale Al. We optimize and contribute software to popular frameworks, such as PyTorch and TensorFlow, to achieve the best performance for Intel platforms and to deliver productivity and programmability for Al developers. We are accelerating the disruption of the proprietary ecosystems through Intel contributions to new software Al languages such as Triton, Mojo, and JAX. This higher level of open, vendor-independent programmability, combined with Intel's commitment to open spec governance, implementations, licensing models, and segment-optimized solutions, such as OpenVINOTM' powered by oneAPI, offers customers a choice of hardware and software stack tailored to diverse workload needs. ■ We seek to continually improve our system and foundational-level software in support of our client, data center, networking, and graphics products, delivering AI-optimized software across the stack, including BIOS, firmware, simulation, operating systems, and virtualization. IP Rights We own and develop significant IP and related IP rights around the world that support our products, services, R&D, and other activities and assets. Our IP portfolio includes patents, copyrights, trade secrets, trademarks, mask works, and other rights. We actively seek to protect our global IP rights and deter unauthorized use of our IP and other assets. We have obtained patents in the US and other countries. Because of the fast pace of innovation and product development, our products are often obsolete before the patents related to them expire, and in some cases our products may be obsolete before the patents are granted. As we expand our product offerings, particularly around our foundry business, we also seek to extend our patent development efforts. In addition to developing patents based on our own R&D efforts, we may purchase or license patents from third parties. The software that we distribute, including software embedded in our products, is entitled to copyright and other IP protection. To distinguish our products from our competitors' products, we have obtained trademarks and trade names for our products, and we maintain cooperative advertising programs with customers to promote our brands and to identify products containing genuine Intel components. We also protect details about our processes, products, and strategies as trade secrets, keeping confidential the information that we believe provides us with a competitive advantage. Efforts to protect our IP can be difficult, particularly in countries that provide less protection to IP rights and in the absence of harmonized international IP standards. Competitors and others may already have IP rights covering similar products. There is no assurance that we will be able to obtain IP rights covering our own products or that we will be able to obtain IP licenses from other companies on favorable terms or at all. For a discussion of IP-related risks, see "Risk Factors" within Risk Factors and Other Key Information. While our IP rights are important to our success, our business as a whole is not significantly dependent on any single patent, copyright, or other IP right. Intel. Fundamentals of Our Business I Our Capital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■ Wafer Fa bs • Assembly &Test ■ Advanced Packaging ■ Future Site * Intel Worldwide Headquarters Arizona Ohio Germany • Wafer Fab • Future She • Future Sate Fab) CTWafer Fab) NORTH AlviEricA SOUTH AMER/CA EUROPE Oregon New Mexico Costa Rica Ireland Poland Israel ■ Water Fab ■ Wafer Fah fAMY. Packaging ■Assembly & Test • Miter Fab • Future Site • Wader Pala CaPaemtay q. Tell) 14 Intel. Fundamentals of Our Business I Our Capital ASIA Chengdu Vietnam • Assembiy & Test • Assemble a Test Malaysia ■ Assembly & Test My. Packaging MIDDLE EAST Manufacturing Capital As the guardians of Moores Law, we continue to innovate to advance the design and manufacturing of semiconductors to help address our customers' greatest challenges. This makes possible new leadership products with higher performance while balancing power efficiency, cost, and size. Our IDM 2.0 strategy allows us to deliver leadership products using internal and external capacity while leveraging our core strengths to provide foundry services to others. IDM 2.0 combines three capabilities. First, we will continue to build most of our products in our fabs. Second, we expect to expand our use of third-party foundry capacity to manufacture a range of modular tiles on advanced process technologies. Third, we are building a world-class foundry business with IFS, which we expect will combine leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that will include x86 cores, as well as other ecosystem IP. Network and Supply Chain In 2023, our factories delivered continuous support to our customers as we ramped new process technologies and equipment for our products and expanded Open System Foundry offerings. We continue to work across our supply chain to minimize disruptions, improve productivity, and increase overall capacity and output to meet customer expectations. Our global supply chain supports internal partners across architecture, product design, technology development, manufacturing and operations, sales and marketing, and business units, and our supply ecosystem comprises thousands of suppliers globally. Our mission is to enable product and process leadership, industry-leading total cost of ownership, and on-time and uninterrupted supply for our customers, delivered in a responsible and sustainable manner. As of the end of 2023, we had nine geographically dispersed manufacturing sites in production. The following map shows the locations of these factory sites. Our manufacturing facilities are primarily used for silicon wafer manufacturing, assembling, testing, and advanced packaging. We operate in a network of manufacturing facilities integrated as though they were one factory to provide the most flexible supply capacity, allowing us to better analyze our production costs and adapt to changes in capacity needs. Our new process technologies, when ready for high volume manufacturing, are transferred from a central development fab to one or more of our manufacturing facilities. The network of factories and the development fab collaborate to continue driving operational improvements. This enables fast ramp of the operation, quick learning, and quality control. We are expanding manufacturing capacity across multiple sites and geographies. These include silicon wafer manufacturing in Arizona, Germany, Ireland, Israel, Ohio, and Oregon and advanced packaging manufacturing in Malaysia and New Mexico. This year, we added Poland to our assembly and test expansion roadmap. These investments further our IDM 2.0 strategy and are expected to support a resilient semiconductor supply chain and to create the foundation for a next-generation chip ecosystem. Intel's Global Footprint ' NJNI J #KJNI K ' I/K0R%R J NJ PJJ P JK NJNI K NJ IKJ IKK NINKJ IK/IJKJ K KK KK R IKI NJKRJII I R RI L% KJ% KO NI '* KJIJL RKNKJ PI IKI NJKNK JI MJI JLR PI NI IKJI JKJ I P N ILKIPKJ JIK '* KJI JK IKJ%RR J NJ N KJ NII NJK NI K %RMJJ M NINK JIIJL N ILJLJ NJNII N IJ K P I KK J K I%RI N R I KK N IL NK KKRJ %RRMJR I KKJ L% JJJL J1 NI % R I KK $ IJ JJR NM23 IK%KR K JI KLKJ $ &JR I N L **+% NIJ IK PI J N NKKN IJJ NINKJ IKKRI RI KKJ K QN J I NI I NJK M LKJ N IL I K ! J NJ R II KK NIKN L J OKINJ K%I P I NJPJL% IK PI JL NJNJJ JNKJ IMJJ K NI KN L KN IJK JI IJ IKI KKIJJNI%I NJK %J LP J% NJNI IJ K%K K IJ % NK KKN JK% NIKN L KLKJ IKKJ NK K KN IK L NIKK K J I NJ I KK IK% NKJIL J J KJ R IK% J N JIINJKN L I NI NKJ IK% PI IK K KNKJ I #K J **+%R I LKIK NJNI KJK I NJ R K RKJ J K JKJ ILKJK NI NJNI JKIII LNK IK RI NJNI %KK %JKJ % P ! IJ JR I NJNI JK JIJKJ NJLRI J ILJ I PJ KJ M KN LJL% R NKJ JJI LO NII NJ KJK JJ K JL K NI RI KK J K%R IL IP N NJNI %IJI KIII JI P J J I I NI NJNI JK JR I J IK JP J IJJ J NIP IJ I P JK K KKJI J IJ %QN I % QN JL JI !IM NJNI JLI KKN J KJK IK K NK RI NJNI #IO % "I L% I % KI % % I P NJNI ' LK &R'M KLI%R $ J NIKK L JKJM K I K PKJ JKNIJI NI '* KJIJL IMJJ KN IJ IK JK NJ IKN L J IJJ N J I MJ IJ KLKJ N J K NI)NK KK NIJ 1
Human Capital Our human capital strategy is grounded in our belief that our people are fundamental to our success. Delivering on our strategy and growth ambitions requires attracting, developing, and retaining top talent across the world. We are committed to creating an inclusive workplace where the world's best engineers and technologists can fulfill their dreams and create technology that improves the life of every person on the planet. We invest in our highly skilled workforce of 124,800 people (as of December 30, 2023) by creating practices, programs, and benefits that support the evolving world of work and our employees' needs. Our human capital philosophy includes three pillars we believe are needed to position our talent strategy as a competitive advantage: ■ Hire and retain the best talent: We have embraced the future of work with a flexible, hybrid-first approach that differentiates Intel from competitors. ■ Develop our talent to full potential: We have updated role descriptions and career pathways to better enable movement and help top talent work on the highest priorities. ■ Create a winning culture: We have reignited Intel's results-driven, performance culture. Fostering a culture of empowerment, inclusion, and accountability is also core to our strategy. We believe that an inclusive culture is important for attracting, developing, and retaining top talent, and we strive to provide a work environment where all employees from all backgrounds are valued, challenged, and rewarded. We are focused on reinvigorating our culture to strengthen our execution and accelerate our cadence of innovation. Our values—customer first, fearless innovation, results driven, one Intel, inclusion, quality, and integrity—inspire us and are key to delivering on our purpose. All employees are responsible for upholding these values, the Intel Code of Conduct, and Intel's Global Human Rights Principles, which form the foundation of our policies and practices and ethical business culture. Talent Management We continue to see significant competition for talent throughout the semiconductor industry. Our hiring was limited in 2023, in line with macroeconomic forecasts, financial performance, and cost-cutting measures, and we took actions to rebalance our workforce. However, the investments we are making to accelerate our process technology require continued and focused efforts to attract and retain talent— especially technical talent. Our undesired turnover rate' was 5.6% in both 2023 and 2022. We invest significant resources to develop the talent needed to remain at the forefront of innovation and make Intel an employer of choice. We offer extensive training programs and provide rotational assignment opportunities and have updated our job architecture to help employees create custom learning curricula for building skills and owning their careers. To further support the growth and development of our people, we continue to increase mentoring in our technical community, drive engagement through employee resource groups, and promote health and wellness resources to all our people. Through our annual employee experience survey, employee inclusion survey, and manager development feedback survey, employees can voice their perceptions of the company, their managers, their work experiences, and their learning and development opportunities. Our employees' voices are important to enable our culture of continuous improvement, and as a result, we link a portion of our executive and employee performance bonus to year-over-year improvements of our employee experience survey results. Our performance management system is designed to support our cultural evolution and to increase our focus on disciplined OKRs. 1 Undesired turnover includes all regular Intel employees who voluntarily left Intel, but does not include Intel contract employees, interns, or employees who separated from Intel due to divestiture, retirement, voluntary separation packages, death, job elimination, or redeployment. Intel. Fundamentals of Our Business I Our Capital 15 >N J NIN J KJIJLKI N NI JJ NI IN J J NIKNKK PI NIKJIJL I RJ J KIQNIKJJIJ %P % IJ J J JI KKJR I !I JJJ IJ NKP R I RIJR I /K KJ IK J KJK N JIIK IJJ LJJI PKJ PIL IK J J ! 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28.19 71.9% 2023 Global Employees by Gender Global employees Senior leadership Technical positions 81.0% ■ Female ji Male 2023 URM3 in the US US employees US senior leadership 8.2% 91.8% ■ URM ■ Non-URM Inclusion Diversity and inclusion are core elements of Intel's values and instrumental to driving innovation and positioning us for growth. Over the past decade, we have taken actions to integrate diversity and inclusion expectations into our culture, performance and management systems, leadership expectations, and annual bonus metrics. Through our annual employee inclusion survey, employees can voice their experiences at Intel and provide feedback on how we can continue to improve. We are proud of what we have accomplished to advance diversity and inclusion, but we believe we can achieve more, including beyond the walls of Intel. Our RISE strategy and 2030 goals set our global ambitions for the rest of the decade, including, in part, ambitious goals to achieve 25% representation of women in senior leadership; achieve 12% representation of underrepresented minorities in US senior leadership; achieve 10% representation of employees with a disability in our global workforce; and exceed 40% representation of women in technical roles, including engineering positions and other roles with technical job requirements. Our ambitious goals were established, in part, based on modeling of where market availability is expected to be in 2030. Market availability analysis will be re-conducted over the time period to assess ongoing alignment and expectations. To drive accountability, we continue to link a portion of our executive and employee compensation to diversity and inclusion metrics. We have committed our scale, expertise, and reach through our comprehensive RISE strategy to work with customers and other stakeholders to accelerate the adoption of inclusive business practices across industries. As part of the Alliance for Global Inclusion, we worked with a coalition of technology companies to create a global inclusion index survey, which serves as a benchmark for companies to track diversity and inclusion improvements, provide information on current best practices, and highlight opportunities to improve outcomes across industries. The results of the third global inclusion index survey were published in 2023 and shared with business leaders across industries. For the first time, based on the maturity of the respondents' best practices, the survey results transitioned to an index, in which organizations that received an overall score of 50% or higher across all regions in which they participated were recognized for their diversity and inclusion efforts. There were 27 respondents and, of those, 18 earned spots on the index, including Intel. This collective effort allows the industry to more clearly identify actions needed to advance progress on closing persistent gaps and advancing more inclusive practices in workplaces, industry, and society. The survey shows increased commitment to diversity and inclusion around key areas of workforce inclusivity, recruitment, advancement opportunities, and accountability. We will also continue to collaborate on initiatives that expand the diverse pipeline of talent for our industry, advance social equity, make technology fully inclusive, and expand digital readiness for millions of people around the world. 2 Senior leadership refers to salary grades 10+ and equivalent grades. While we present male and female, we acknowledge this is not fully encompassing of all gender identities. 3 The term underrepresented minority (URM) is used to describe diverse populations, including Black/African American, Hispanic, and Native American employees in the US. Compensation and Benefits We structure pay, benefits, and services to meet the varying needs of our employees, helping support employee financial well-being with competitive compensation, investment opportunities, and financial resources. Our total rewards package includes market-competitive pay, broad-based stock grants and bonuses, an employee stock purchase plan, healthcare and retirement benefits, paid time off and family leave, parent reintegration, fertility assistance, flexible work schedules, sabbaticals, and on-site services. Since 2019, we have achieved gender pay equity globally and we continue to maintain race/ethnicity pay equity in the US. We achieve pay equity by closing the gap in average pay between employees of different genders or race/ethnicity in the same or similar roles after accounting for legitimate business factors that can explain differences, such as location, time at grade level, and tenure. We have also advanced transparency in our pay and representation data by publicly releasing our EEO-1 survey pay data since 2019. We believe that our holistic approach toward pay equity, representation, and creating an inclusive culture enables us to cultivate a workplace that helps employees develop and progress in their careers at all levels. Our "hybrid-first" approach to working was informed by employees surveyed around the globe and involves the majority of our employees splitting their time between working remotely and in the office. Hybrid-first and remote work options cast a wider recruitment net and support our ambition to hire the best global talent. Currently, there is no company-wide mandate on the number of days per week employees should be on site or how they should collaborate. Our goal is to enable remote and on-site work where it drives the best output, while providing our employees with equitable access to systems, resources, and opportunities that allow them to succeed. Health, Safety, and Wellness We are committed to providing a safe and injury-free workplace. We regularly invest in programs designed to improve physical, mental, and social well-being. We provide access to a variety of innovative, flexible, and convenient health and wellness programs, including on- site health centers, and we aim to increase awareness of and support for mental and behavioral health. In support of our RISE goals, we intend to continue our efforts to build our strong safety culture and drive the global expansion of our corporate wellness program through employee education and engagement activities. Intel. Fundamentals of Our Business I Our Capital 16 NK PIKJL NK I I JK J /KP NK KJIN J J IP PJ KJ NK II RJ PIJKJ%RPJ J KJ JIJPIKJL NK MJJ K J NIN JNI%I I JKLKJK% IK MJJ K% N NKJIK I N NI N L NK KNIPL% LK P JIMI KJ J I P RR J NJ I P !II N RJRP KJ P PIKJL NK % NJR PR P I% N L JR K J NI KJIJL *+ K KJ NI J K IJIKJ J% N % IJ% J NK KJ P *-<IIK JJ R K I IK:P*<IIK JJ N IIIK J IJK 1K I IK:P<IIK JJ LK RJK JL NI R I I: M1<IIK JJ R J I K% N I KJ K JII KRJJ 8 IQNI JK NI J NK KRIKJ K% IJ% K RIIJP JLKMJJ *+ 'IJP JL LKKR I NJ PIJJI J KKKK J MJJ K IP N J JL%R J NJ IJ NIMNJP L KJ J PIKJL NK JIK !P JJ NIK %MIJK% IJI N NI I KP KJIJLJ R IRJNKJ IK JIKJ IKJ IJJ J NKP NK KK IJKI KK NKJIK #KIJ J# I" NK %RR IRJ J J L KJ IJ NK MKNIPL%RKIPKK I I KJ JIPIKJL NK I P JK%I P IJ NII J KJ IJK% J IJN JKJ I P NJ KI KK NKJIK IKN JK JJI NK MKNIPLRIN K **+ KIRJ NK KK IKI KK NKJIK IJIKJJ% K JJNIJL JIK JK/ KJIJK%JKNIPL IKN JKJI KJ J M% R I OJ KJJIP PI K I -< I II KK I K RJLIJJRII O IJIPIKJL NK IJK IRI*.IK JK % J K%2I K JK J M% N J K JP IJ RKJ NKJILJ I I L JLJ K J P I IKK K IKKJ JK P I NKPIJK R I K% NKJIL% K JL KNIPLK RK IK J JJ PIKJL NK I N LIK R I I NKPJL%IINJ J%P J IJN JK% N J JL !R K J NJ IJ JJPKJJM JPIK J J I NI NKJIL%P K QNJL%J LN L NKP% M J I KK I K I N JR I * #&! $9 !62#4! ? !6 &6$ $!C'!$9 6 $ 9 G1#,$ '!$9 6H2# B 4! 6 )$ $ 9? )$ B $"> &B 9' 2#6#6 & ?1 C "&)4$66# ' &?$ ' 9 !#9 # # 6 <2 !)1 9 !! 4! 6 9)# &!# C5.7#616 9 &9 6"!#= 9#, !6 4&41 $ #& 6# " 19# '@ $">?!#"$ ) !#"$ I#64$ #"$ 9/$ #, ) !#"$ )4 &C 6# 2 5* KJ ) JK !KJINJNIL% JK% KIPKJ JJPIL K NI LK% KN IJ L R RJ JJP KJ % PKJ J IJN JK% IK NIK NIJ J IRIK NKIJ JJPL% I KKJ I JK NKK% LKJ NIK % JI IJI J JK%J L P%I JI JIJ %IJ JLKKKJ % M R IKN K%K J K% KJKIPK *7%RPP ILQNJL L R J NJ J I8J JLLQNJL J1 !PLQNJL L K J PIL JR LK I J IK II8J JL JK IK II KJI N J I JJ NK KK J IKJJ M I K%KNK J %JJI P % J NI !P K P JI KI L NIL IIK JJ J LN LI K NI KNIPLLJK *7 ! PJJ NI KJI J RIL QNJL%IIK JJ % IJ NKPN JNI KNKJ N JPJR I JJ K LKP I IKK JIIIKJ P K NIEL IIKJEI J R I RK I L LKKNIPLI N J P PKJ 8 IJL NI LKK JJ JIJ JR R I I J L J >L IIKJ I JR I J KKJRI IINJ J J KN IJ NI J J IJ KJ J J NII J L%JIK LR J J N I LKIR LKK N KJ I RJLK N IJ NI KJ I J KJR IRIJIPK J KJ NJNJ%R I P NI LKRJQNJ KKJ KLKJK%IK NIK% IJN JKJJ RJJ KN > J%JL% ! KK !I JJJ I P K 8NILIR I !IN I L PKJ I IKK J I PLK % J % K R !I PKKJ PIJL PJP% M % P J J R KKI IK% N KJ J JIK% RJ IKRI KK KN IJ I J P I J KN IJ NI K%R J J J N NI IJKJ N NIKJI KJLN JNI IPJ M K NI I IJR KKI IJI N LNJ JJPJK N J K NI)NK KK NIJ 3
Social and Relationship Capital We are committed to engaging in initiatives that support our communities and help us develop trusted relationships with our stakeholders. Proactive engagement with our stakeholders and investments in social impact initiatives, including those aligned with the United Nations Sustainable Development Goals, advance our position as a leading corporate citizen and create shared value for Intel, our global supply chain, and our communities. Economic and social. The health of our business and local economies depends in part on continued investments in innovation. We provide high-skill, high-paying jobs around the world, many of which are manufacturing and R&D jobs located in our factories. As we expand operations in both existing and new locations around the world, we are building a pipeline of qualified workers through our talent strategy and the many investments we are making in education. We also benefit economies through our R&D ecosystem spending, sourcing activities, employee spending, and tax payments. We make sizable capital investments and provide leadership in public-private partnerships to spur economic growth and innovation. We stand at the forefront of new technologies that are increasingly being used to empower individuals, companies, and governments around the world to solve global challenges. We aim to empower people through education and advance social initiatives to create career pathways into the technology industry. This includes our global Intel Digital Readiness Programs, such as Al for Youth and Al for Workforce, scaled in partnership with governments and institutions to empower individuals with digital readiness and Al skills. Additionally, we invest in multi-year partnerships with historically Black colleges and universities in the US to increase the number of Black/African Americans who pursue electrical engineering, computer engineering, and computer science fields. Our employees and retirees share their expertise through volunteer initiatives in the communities where we operate, volunteering 3.8 million' hours over the past four years. These efforts contribute to our RISE goal to volunteer 10 million hours over a decade. Since 2020, we announced and further expanded upon the Intel RISE Technology Initiative, which provides an expanded channel to build deeper relationships with our customers and partners aligned with our corporate purpose and work to create shared value through our RISE strategy. Specifically, we are funding projects in areas such as using technology to improve health and safety, making technology more inclusive while expanding digital readiness, and carbon-neutral computing to help address climate change. Human rights commitment. We are committed to maintaining and improving systems and processes to avoid causing or contributing to adverse impacts on human rights in our own operations, products, and supply chain. We have established an integrated approach to managing human rights across our business, including senior-level management involvement and board-level oversight. We also meet throughout the year with external stakeholders and experts on human rights to continue to inform and evolve our human rights policies and oversight processes. While we do not always know nor can we control what products our customers create or the applications end users may develop, we do not support or tolerate our products being used to adversely impact human rights. Where we become aware of a concern that Intel products are being used by a business partner in connection with abuses of human rights, we intend to evaluate and restrict or cease business with the third party unless and until we have a high confidence that Intel's products are not being used to adversely impact human rights. I This is a preliminary estimate. The final number will be reported in our 2023-24 Corporate Responsibility Report, to be issued later in 2024. Intel. Fundamentals of Our Business I Our Capital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
Supply Chain Responsibility We actively manage our supply chain to help reduce risk, improve product quality, achieve environmental and social goals, and improve overall performance and value creation for Intel, our customers, and our suppliers. To drive responsible and sustainable practices throughout our supply chain, we have robust programs to educate and engage suppliers that support our global manufacturing operations. We actively collaborate with other companies and lead industry initiatives on key issues such as improving transparency around climate and water impacts in the global electronics supply chain and, as part of our RISE strategy, we are advancing collaboration across our industry on responsible minerals sourcing. Through these efforts we help set electronics industry-wide standards, develop audit processes, and conduct training. Over the past decade, we have directly engaged with suppliers to verify compliance and build capacity to address risks of forced and bonded labor and other human rights issues. We perform periodic audits, and identify critical direct suppliers to engage through capability- building programs, which help suppliers build sustainability acumen and verify compliance with the Responsible Business Alliance and the Intel Code of Conduct. We also engage with indirect suppliers through our programs on forced and bonded labor, responsible minerals, and supplier diversity. To achieve our RISE goals, we are significantly expanding the number of suppliers covered by our engagement activities. The supply chain environmental team is also actively engaging suppliers to measure and reduce their greenhouse gas emissions footprints and the resulting impact on our footprint. These activities are intended to help us meet our long-term emissions reductions goals, including our goal to achieve net-zero upstream Scope 3 greenhouse gas emissions by 2050, which we announced in 2023. Our commitment to diversity and inclusion also extends to our suppliers. We believe a diverse supply chain supports greater innovation and value for our business. We have set additional spending targets with women-owned suppliers outside the US and with minority- owned suppliers globally to accelerate progress toward our goal to increase global annual spending with diverse suppliers to reach $2.0 billion in annual spending by 2030. Natural Capital Driving to the lowest possible environmental footprint as we grow helps us create efficiencies, support our communities, and respond to the needs of our stakeholders. We invest in environmental projects and set company-wide environmental targets to drive reductions in greenhouse gas emissions, energy and water use, and waste generation. We build energy efficiency into our products to help our customers lower their own emissions, energy usage, and costs, and we collaborate with policymakers and other stakeholders to use technology to address environmental challenges. In April 2022, we announced our new goal to reach net-zero greenhouse gas emissions in our operations by 2040, creating an important target to strengthen our commitment to sustainable business practices. We furthered our commitment in 2023 by announcing our goal to reach net-zero upstream Scope 3 greenhouse gas emissions by 2050. Our 2030 RISE goals continue to be important milestones to drive to higher levels of operational efficiency, including a goal of a 10% reduction in our greenhouse gas emissions on an absolute basis from a 2019 baseline by 2030. We continue to take action on emissions reduction strategies focused on emissions abatement, and to make additional investments in renewable electricity, process and equipment optimization, and energy conservation. In 2023, we linked a portion of the executive and employee performance bonus to our goal to reduce our 2023 Scope 1 and 2 greenhouse gas emissions by 130,000 metric tons carbon dioxide equivalent, compared to 2022. Our RISE strategy also focuses on addressing climate change impacts upstream and downstream in the value chain. This includes improving product energy efficiency and increasing our "handprint"—the ways in which Intel technologies can help others reduce their footprints, including Internet of Things solutions that enable intelligence in machines, buildings, supply chains, and factories, and make electrical grids smarter, safer, and more efficient. In August 2023, we published our inaugural green bond report, which provides an update on the allocation of the net proceeds of the $1.3 billion principal amount of senior notes issued in 2022. We are using the proceeds from the green bond offering to fund projects that support our investments in sustainable operations, which can include items such as green buildings, energy efficiency, circular economy and waste management, greenhouse gas emissions reductions, water stewardship, and renewable energy. Energy We focus on reducing our own climate change impact, and over the past two decades have reduced our direct and indirect greenhouse gas emissions associated with energy consumption. Through our RISE goals, we have committed to a goal of conserving 4 billion kWh of energy this decade. We have conserved 1.6 billion kWh' of energy cumulatively since 2020. We also invest in renewable electricity and on-site alternative energy projects in support of our 2030 goal to achieve 100% renewable electricity use across our global operations. In 2023, continuing our practice of linking a portion of our executive and employee performance bonus to our corporate sustainability metrics, we linked a portion of the performance bonus to our 2023 target to reach 95% renewable electricity use globally. We reached our target and achieved 99%1 renewable electricity usage globally in 2023. I This is a preliminary estimate. The final number will be reported in our 2023-24 Corporate Responsibility Report, to be issued later in 2024. Intel. Fundamentals of Our Business I Our Capital 18 N L K K JL !JP L NIKN L J INIK%I PI NJQN JL%P PI J K K% I P PI I I P NIJ I J % NINKJ IK% NIKN IK IPIK K KNKJ IJK JI N NJ NIKN L %RPI NKJI IKJ NJ KN IKJJKN IJ NI NJNI IJ K !JP L IJRJ JI K NKJIL JJPK LKKNKKNKI P JI KI LI N J RJIJK J JI KKN L %KIJ NI KJIJL%RIP IJ I KK NI NKJIL IK K I KK NI I NJK IJKR KJ JI K NKJILRKJ IK%P NJ I KKK% NJJI PIJKJ%RPIJ L RJKN IKJ PIL N JLJ IKKIKK I I JIN IJKKKNK !I II NJK% JLIJ IJKN IKJ JI N JL N I IK%R KN IK N KNKJ JLN PIL RJJ K K )NK KK# J J NJ ! K RJ IJKN IKJI N NII IK I I%IK K I K% KN IPIKJL P NI K%RIK J LM J N I KN IK PI L NI J JPJK KN L PI J JK K JP L KN IKJ KNI INJII NKK KK K JI JK JIKN J J NI JI J KJPJKI J J NKJ NI JIKK K INJ K K% N NI J P JOI NKJI +I NKKKK K L*-%RR N **+ NI J JJ PIKJL NK K MJ KJ NIKN IK ! PPIKKN L KN IJKIJI PJ P N I NI NK KK !PKJJ K JIJKRJR R KN IK NJKJ1 RJ IJL R KN IK LJ IJI IKKJ RI NI J IK N K RJPIKKN IKJ I;* N K L*+ &JNI J IP J J RKJ KK PI J JI JKRI R KNKIJ K%KN IJ NI N JK% IK J J K NIKJ IK ! PKJ PI J I 8JK KJ LR PI J JIJKJ IPINJ K I NKKKK K% IL RJINK% RKJ IJ ! N IL L J NII NJKJ NI NKJ IK RIJI R KK K% ILNK% KJK% R IJRJ LIK JIKJ IKJ NK J LJ IKK PI J K #I ***%R N NI R J I JOI I NKKKK K NI IJ K L*1%IJ IJ J JIJJ KJI J NI J JJ KNKJ NK KKIJK !NIJI NI J J **+ L N NI J I JOI NKJI +I NKKKK K L*- NI*+ K J NJ IJ J KJ KJ IP J I P K IJ L% N <INJ NII NKKKK K K NJ KKI *7 K L*+ ! J NJ JJ KK KINJ KJIJK NK KK K J J% J J PKJ JK I R JIJL%I KK QN J JOJ % IL KIPJ **+%R IJ JMNJP LI I NKJ NI J IN NI**+ *I NKKKK K L +%JIJ KI MQNP J% IJ *** NI KJIJL K NKK IKK J JK NKJI R KJI JP N K NKI P I NJ IL L IK NIE I JEZJRLK R J J K JIKINJI JI JK% N JI J KK NJ KJJ J K% N K%KN L K% J IK% JI IKKIJI%KI% I J #NNKJ**+%RN K NI NNI I I IJ%RI PK NJ J J J JI K J; + I N J K I JKKKN *** !INK JI KI JI I J N I 8JKJJ KN IJ NI PKJ JK KNKJ IJ K%R NJKKNKI N K% IL L%IN I L RKJ J%I NKKKK KINJ K%RJIKJRIK% I R IL IL ! NK IN NI R J J% PIJKJJR KPIN NIIJ IJI NK KKK KKK JRJ IL KNJ I N NI K%RP JJJ KIP 1 ! ILJK !P KIP 3 ! ILNN JP LK ** ! K PKJ I R JIJL KJ JI JP ILI 8JK KN IJ NI*+ J P<I R JIJLNKI KK NI IJ K **+% J N NIIJ IJ NIMNJP LI I NKJ NI I IJKNKJ JL JIK%R IJ JI I NKJ NI**+JIJJ I7-<I R JIJLNK L !I NI JIJ P77<I R JIJLNK L **+ <2#6#6$4! #)# $!C 6 #)$ <2 ?# $ 1)= !B# = ! 4&! 9# &1! %&!4&!$ . 64& 6#=# # C. 4&! &= #661 9 $ !# N J K NI)NK KK NIJ 2
Water Stewardship Water is essential to the semiconductor manufacturing process. We use ultrapure water to remove impurities from our silicon wafers, and we use fresh and reclaimed water to run our manufacturing facility systems. Through our RISE goals, we have committed to achieve net positive water globally, and as part of that effort, conserve 60 billion gallons of water in this decade. Water conservation reduces the amount of water needed from fresh water sources; we have conserved 35.9 billion gallons' of water and enabled restoration of 9.6 billion gallons' of water to local watersheds since 2020. In 2023, we linked a portion of our executive and employee performance bonus to our target to conserve and restore 12.0 billion gallons of water during the year. We will achieve our Water from operations Water restored Water coming In goal of net positive treated and returned to through watershed from fresh water water use when: communities or environment projects sources Circular Economy and Waste Management We have long been committed to waste management, recycling, and circular economy strategies that enable the recovery and productive re-use of waste streams. Our 2030 goals include a target of zero waste2 to landfill, as well as implementation of circular economy strategies for 60% of our manufacturing waste streams in partnership with our suppliers. We continue to focus on opportunities to upcycle waste by improving waste segregation practices and collaborating with our suppliers to evaluate new technologies for waste recovery. In 2023, we linked a portion of our executive and employee performance bonus to our interim target to achieve 5% of waste to landfill. Governance and Disclosure We are committed to transparency around our carbon footprint and climate risk, and use the framework developed by the TCFD to inform our disclosure on climate governance, strategy, risk management, and metrics and targets. For governance and strategy, we follow an integrated approach to address climate change, with multiple teams responsible for managing climate-related activities, initiatives, and policies, with senior-level management involvement and board-level oversight, including the Corporate Governance and Nominating Committee. We describe our overall risk management processes in our Proxy Statement, and describe climate-related risks and opportunities in our annual Corporate Responsibility Report, the Intel Climate Change Policy, and "Risk Factors" within this Form 10-K. In addition to what is included in this Form 10-K, information about and progress toward our RISE goals is included in our Corporate Responsibility Report. Our Corporate Responsibility Report also includes a mapping of our disclosure to the TCFD, GRI and SASB frameworks. The Corporate Responsibility Report and our CDP Climate Change Survey are available on our website and are published annually.3 In November 2023, we published our first Climate Transition Action Plan, which is available on our website. I This is a preliminary estimate. The final number will be reported in our 2023-24 Corporate Responsibility Report, to be issued later in 2024. 2 Intel defines zero waste as less than 1%. 3 The contents of our website and our Corporate Responsibility Report, Climate Change Policy, Climate Transition Action Plan and CDP Climate Change Survey are referenced for general information only and are not incorporated by reference in this Form 10-K. Intel. Fundamentals of Our Business I Our Capital 19 !JIJRIK !JIKKK J J JK NJ I NJNI I KK !NKN JINIRJIJ I PNIJKI NIK RIK% RNKIK I RJIJ IN NI NJNI JLKLKJK I N NI K%RP JJJ P J KJPRJI L% KIJ JJ IJ% KIP3 K RJI JK !JI KIPJ INKJ N J RJI I IKRJIK NIK:RP KIP+- 7 K RJI IKJ IJ 7 3 K RJIJ RJIKKK ** **+%R IJ NIMNJP LI I NKJ NI JIJJ KIP IKJ I* K RJINI JLI IN I L !KJ' J !P JJJ RKJ J%IL % IN I LKJIJKJJ JI PIL I NJP INK RKJKJIK NI*+ K NJIJ OI RKJ*J %KR K JJ IN I L KJIJK I3< NI NJNI RKJKJIK IJ IKRJ NIKN IK ! J NJ NK IJN JKJ NL RKJ LI P RKJKIJ IJK IJ RJ NIKN IKJ P NJ RJ K IRKJI PIL **+%R IJ NIMNJP LI I NKJ NI JIJIJJ P-< RKJJ " PI K KNI !I JJJ JI KI LI N NII JI J JIK% NKJIR IP LJ J I NIK KNI J PI %KJIJL%IK J% JIK JIJK I PI KJIJL%R R JIJI J IKK J %RJN J JKIK K I JI JJPJK% JJPK% K%RJK I P J P P J I P PIKJ% N J I IJ" PI & J JJ !KI NI PI IK JI KKK NI$I MLJJ J% KI JI JIKK IJN JK NI N I IJ K K JL IJ%J J J $ L% E KJ IKERJ JK I J J RJK N JK I% IJ NJ I IKKJ RI NI KK N NI I IJ K K JL IJ NI I IJ K K JL IJ K NK NIK KNIJ J %" #) IR IK I IJ K K JL IJ NI $ J NIPLIP NIR KJ IN K N L + & P I**+%RN K NIIKJ JI KJ #J $ %RKP NIR KJ <2#6#6$4! #)# $!C 6 #)$ <2 ?# $ 1)= !B# = ! 4&! 9# &1! %&!4&!$ . 64& 6#=# # C. 4&! &= #661 9 $ !# 9 ?# 6J !&B$6 $6 66 2$ <2 "& 6&?&1!B =6# $ 9&1!%&!4&!$ . 64& 6#=# # C. 4&! % #)$ %2$ ' ;& #"C% #)$ <!$ 6# #& " #& ; $ $ 9% ;% #)$ %2$ ' *1!, C$! ! ? ! " 9?&!' !$ # ?&!)$ #& & C$ 9$! & # "&!4&!$ 9=C! ? ! " # 2#6-&!) E N J K NI)NK KK NIJ 7
Mana•ement's Discussion and Anal sis Our Products We are a global IDM of CPUs and related solutions that we design, develop, manufacture, market, sell, support, and service. Our CPUs and related solutions are incorporated in computing and related end products and services, and utilized globally by consumers, enterprises, governments, and educational organizations. Our customers primarily include OEMs, ODMs, cloud service providers, and other manufacturers and service providers, such as industrial and communication equipment manufacturers and other cloud service providers who buy our products through distributor, reseller, retail, and OEM channels throughout the world. We market and sell these products directly through our global sales and marketing organizations and indirectly through channel partners. We manufacture our products at our fabrication and assembly and test facilities located throughout the world. Our product offerings provide end-to-end solutions, scaling from data center to network, PCs, edge computing, and the emerging fields of Al and autonomous driving, to serve an increasingly smart and connected world. Products, such as our gaming CPUs, may be sold directly to end consumers, or they may be further integrated by our customers into end products such as notebooks and storage servers. Combining some of these products—for example, integrating FPGAs with Intel Xeon processors in a data center solution—enables incremental synergistic value and performance. In 2023 we launched new products, including the 13th Gen Intel Core mobile processor family, the 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost, and the Intel Core Ultra processors, which feature our first integrated neural processing unit for power-efficient Al acceleration and local inference on the PC. Our diverse product line includes CPU and chipset, an SoC, or a multichip package based on Intel® architecture that processes data and controls other devices in a system. The primary CPU products in CCG are our Intel Core processors, which include designs specifically for notebook and desktop applications. The primary CPU product in DCAI is our Intel Xeon processor, which includes solutions for data center compute, networking, and the intelligent edge. The primary offerings of NEX include Intel Xeon, Intel Core, and Intel Atom® processor products. During 2023, we managed our business through the operating segments that are presented below and have included the 2023, 2022 and 2021 financial results for each segment. "Note 3: Operating Segments" within the Notes to Consolidated Financial Statements of this Form 10-K reconciles our segment revenues presented below to our total revenues, and our segment operating income (loss) presented below to our total operating income (loss), for each of the periods presented. We have also included a discussion of our 2023, 2022 and 2021 consolidated results of operations and related information subsequent to the operating segment discussion below. intel. MD&A 20 ' J/K KNKK # LKK NI$I NJK !I ' $1K I JK NJ KJJRK %P % NJNI%IJ%K %KN IJ% KIP NI$1K I JK NJ KI I IJ NJ I J I NJK KIPK% NJ O L L KNIK% JIIKK% PI JK% NJ I OJ K NINKJ IKII L N 'K% 'K% NKIPI PIK% JI NJNIIK KIPI PIK%KNK NKJI N J QN J NJNIIK JI NKIP I PIKR NL NII NJKJI NKJI NJ I%IK I%IJ % ' KJI N NJJR I !IJ K JK I NJKIJ LJI N NI K K IJ I OJ K IJ LJI N IJ IK ! NJNI NI I NJKJ NI IJ KK L JKJ JK JJI N NJJR I NII NJ I KI P J K NJ K%K I J JIJ JR I%$K% NJ % JI K # NJ NKIP %J KIP IK LKIJ JR I $I NJK%KNK NI $1K%L K IJ LJ KNIK% IJLL NIJI JIJ L NINKJ IK J I NJKKNK J K KJ IKIPIK K JKI NJKZ IM % JIJ $"#KRJ J = I KK IK J JIK NJ Z K I J KL IKJP N I I **+R N RI NJK% N J+J" J I I KK I L%J1J" J = I KK IKRJ J P #&) KJ% J J I1 JII KK IK%RJNI NIIKJ JIJ NI I KK N J I RI J# IJ I J$ NIPIKI NJ NK$1 KJ% % IN J K J XIJJNIJJI KKKJ JI K JIPK KLKJ IIL$1I NJK "I NI J II KK IK%R NK KK L I J KJ J K IIL$1I NJ # K NI J = I KK I%R NKK NJ K IJ JI NJ% JR I % J J J IIL I K & = N J = % J I% J #J X I KK II NJK NI **+%R NI NK KKJI NJ IJ K JKJJIIK J R P NJ**+%*** ** IKN JK IK J E& J+9IJ JKERJ J& JKJ K J JJ JK JK I I K NIK JIP NKIK J RJ NIJ J IP NK% NIK J IJ 5 KK6IK J R J NIJ J IJ 5 KK6% I JI KIK J !P K NKNKK NI**+%*** ** K JIKN JK IJ K I J IJ KN KQN JJ J IJ K JKNKK R ' (# *
Overview We are committed to advancing PC experiences by delivering an annual cadence of leadership products and deepening our relationships with industry partners to co-engineer and deliver leading platform innovation. We engage in an intentional effort to bring together the operating system, system architecture, hardware, and software application integration to enable industry-leading PC experiences. We embrace these opportunities by focusing our roadmap, delivering innovative PC capabilities, and designing advanced PC experiences. By doing this, we believe we help continue to fuel innovation across the industry, providing a solid source of IP, scale, and cash flow for Intel. Key Business Developments ■ We launched our 13th Gen Intel Core mobile and select desktop processors, Intel Core 14th Gen processors, and Intel Core Ultra processors, the first client processor family on Intel 4 technology that features a new neural processing unit to drive Al at scale. ■ We launched the industry's first Al PC Acceleration Program to help enable Al on more than 100 million PCs through 2025. ■ We worked with industry partners to co-engineer and deliver new experiences with the Intel® Evo TM device, including phone to PC capabilities with Intel® Unison TM application and future premium laptop experiences with Al and Intel Core Ultra processors. intel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
Market and Business Overview Market Trends and Strategy In 2023, the PC market started to stabilize from a soft macroeconomic environment and inflationary pressures, with PC supply and demand levels beginning to normalize. We remain positive on the long-term outlook for PCs, as household density is stable to increasing, educational device penetration rates remain low outside of the US, and PC usage remains elevated compared to pre-pandemic rates'. Commercial growth opportunities also remain as corporations expand the size of their PC fleets, while also replacing older devices. Currently, approximately 200 million commercial devices are more than four years old2. We see the Al PC as a critical inflection point for the PC market over the coming years, and we believe we are well positioned to capitalize on the emerging growth opportunity of Al. We believe that the PC is as essential as ever, and we expect our leadership in client Al to further support our original forecasted long-term PC TAM of approximately 300 million units3. Together with our industry partners, we are working to increase demand and drive market growth through enhanced PC capabilities, which we expect will lead to greater market penetration and faster PC refresh cycles. As we continue on our strategy to develop more competitive products and more capabilities for customers, we are designing our product roadmap to drive product leadership grounded in a philosophy of openness and choice. We deliver value to our customers by leveraging our engineering capabilities and working with our partners across an open, innovative ecosystem to deliver technology that drives every major vector of the computing experience, including performance, power efficiency, battery life, connectivity, graphics, and form factors, to create the most advanced PC platforms. Products and Competition We released our 14th Gen Intel Core desktop processor family, delivering improved single-threaded and multi-threaded performance when gaming, streaming, and recording. In addition, we released our first Intel Core Ultra family of processors, which utilizes a disaggregated architecture and is the first PC platform built on Intel 4 technology. Our latest processor family is the first client processor to feature a dedicated NPU for Al acceleration and delivers improved power efficiency and graphics performance. Intel Core Ultra represents an inflection point in Intel's client processor roadmap as we usher in the age of the Al PC. With new capabilities in the PC, including significantly improved battery life, Al capabilities with our NPU and GPU products, and up to double the graphics performance with Intel Core Ultra processors, we seek to provide compelling reasons to drive refresh in commercial and consumer markets. We expect to deliver more than 230 Intel Core Ultra designs to market. There is strong demand for our 13th Gen Intel Core processor family, which features Intel® Thread Director technology and our second- generation performance hybrid architecture. We expect to deliver more than 300 designs from partners across major multi-national corporations and leading manufacturers. We continue to innovate beyond the CPU to deliver premium PC experiences with Intel Evo Edition laptops and Intel vPro Platforms. We worked with industry partners to co-engineer and deliver new experiences with Intel Evo Edition, which are designed to deliver key experience indicators such as responsiveness, battery life, intelligence collaboration, and Intel Unison Multi-Device Experience. Intel vPro is designed for enterprise needs and delivers increased productivity, connectivity, security features, and remote manageability. We operate in a particularly competitive market. In processors, we compete with Advanced Micro Devices, Inc. (AMD) and vendors who design applications processors based on ARM architecture*, such as Qualcomm Inc. (Qualcomm), and Apple Inc. (Apple), with its M1 and M2 products. We expect this competitive environment to continue to intensify in 2024. We remain committed to creating an open ecosystem to foster growth and technology innovations. We embrace and collaborate with a global ecosystem of industry partners to deliver leadership technologies together. We launched the industry's first Al PC Acceleration Program, designed to provide the software ecosystem with engineering tools and resources to enable Al on more than 100 million PCs through 2025. We also announced a collaboration with Microsoft to drive the development of Al on personal computing, with Intel Core Ultra processors and Windows 11 expected to scale across the ecosystem of Intel and Microsoft OEM and ISV partners. During 2023, we continued to diversify our product strategy across nodes, advance our packaging capabilities with disaggregated silicon, and balance internal and external manufacturing. We increased our levels of operating inventory and worked with our customers to develop strategically located supply hubs that forward position inventory. In addition, we continue to invest in a globally diverse supply chain that enables us the flexibility and proximity to support customers. These have further enhanced the service and responsiveness we are able to provide our customers. 'Source Intel calculated PC density from industry analyst reports. 2Source: Intel calculated volume of devices over four years old from industry analyst reports and internal data. 3Source: Intel calculated multi-year TAM forecast derived from industry analyst reports. intel. MD&A 22 'IJ )NK KKPIPR 'IJI K JIJL **+%J$IJKJIJJ KJ OI K JI PI J J ILIKKNIK%RJ$KN L P K J I O !I KJP J JI NJ I$K%K NK KJLKKJ J IK % NJ P JIJ IJKI R NJK J1% $NKI K PJ IJ I IJK I I RJ IJN JK K I K I IJ KM JKO JI$ JK%R K I IPK NII J L%I MJ L* I PKI IJ NILIK * !KJ# $KIJ J J IJ$IJ PIJ LIK% R PRIR KJ J J O JI I RJ IJN JL # ! PJJJ$KKKK J KPI% RMJ NI IK J# J NIJIKN IJ NI I IKJ JI$#' I MJ L+ N JK+ JIRJ NI NKJILIJ IK%RI R I J IK IPIJI RJJI N $ JK%RRMJR J IJIIJ JIJ KJI$IIKL K #KR J N NIKJIJLJ P I JJPI NJK I JK INKJ IK%RIK NII NJ I J IPI NJ IKI N K L KK ! PIP NJ NINKJ IK L PI NI I JK R I RJ NIIJ IKI KK % PJP KLKJJ PIJ LJJIPKPIL 8 IPJ I J NJ MI % N I I % RI L% JJIL % JPJL%IK% IJ IK%J IJJ KJP $ J IK $I NJK JJ !I K NI1J" J IKJ I KK I L% PI I PK JI N JJII I R %KJI % I I J %RI K NIIKJ J I1 JI L I KK IK%RNJ OK KIJIJJNI KJIKJ$ J I N J J 1J L NI JKJI KK I LKJIKJ JI KK IJ JNIJ&$1 I# IJ PIKI P RI L IKI I J I1 JIIIK JK J J J /K JI KK II KRNKI J J# $ !J R JK J$% N K J LI P JJIL %# JKRJ NI&$1 "$1I NJK% NJ N JIKI I RJ J I1 JII KK IK%RKJ I P IK KJ IPIIK I KNIIJK !MJJ PI IJ *+ J I1 JIK KJ IJ IKKJI I NI+J" J II KK I L%RJNIK J XI IJ IJ L NIK IJ I I L IIJJNI !MJJ PI IJ +K KI IJ IKI KK8 IN J J I IJ K NJNIIK ! J NJ PJ L J$1J PIIN$MI KRJ J P J J K J P$I $ J IK ! R IRJ NKJILIJ IKJ I PI RMI KRJ J P J %RIK J PIL MI J IKKNKIK KP KK% JJIL % J IJ % J 1 K 'N J P MI J P$I KK I JIIK K PIK IKI NJPJL% JPJL%KNIJLJNIK% I J JL ! IJ IJN I L JJPIJ I KK IK%R JRJ#P 'I PK% 5#' 6 P IKR K J KI KK IK K # 'IJJNIA%KNK4N 54N 6% # 5# 6%RJJK' '*I NJK !MJJK JJP PI JJ J NJ J KL **1 !I JJJ IJ KLKJJ KJII RJ J L PJ K ! I IJRJ KLKJ NKJILIJ IKJ PI IKJ KJ JI ! N J NKJIL/KIKJ# $# IJ $I I%K J I PJK JRI KLKJRJ I J K IK NIKJ # IJ $K JI N**- ! K N IJ RJ'I K JJ IPJP J # IK NJ %RJ J I 1 JII KK IK ! RKMJJ K I KKJ KLKJ J 'I K J ' ?IJ IK NI **+%R J NJ PIKL NII NJKJIJLI KK K%P NI JKRJKIJK % JI MJI NJNI ! IK NI P K IJ P J IL R IRJ NINKJ IKJ P KJIJ L JKN LN KJJ IRI KJ P J IL J %R J NJ PKJ LPIKKN L JJ KNKJ M JL I MJLJ KN IJNKJ IK KPNIJI JKIP IK KP KKR I J I P NINKJ IK *&1!" "$ "1 $ 9;%9 6# C?!&)# 916 !C$ $ C6 ! 4&! 6 *&1!" "$ "1 $ 9,& 1) &?9 ,#" 6&, !?&1!C $!6& 9?!&)# 916 !C$ $ C6 ! 4&! 6$ 9# ! $ 9$ $ *&1!" "$ "1 $ 9)1 #C $!<7?&! "$6 9 !#, 9?!&)# 916 !C$ $ C6 ! 4&! 6 ' (# **
Financial Performance CCG Revenue $B CCG Operating Income $B $41.1 $29.3 $31.8 53.2 $15.5 $2.3 $12.4 19 1 $10.2 $10.7 $6.5 $5.6 $17.0 2023 2022 2021 2023 2022 2021 ■ I Notebook I Desktop I Other Revenue Summary 2023 vs. 2022 ■ Notebook revenue was $17.0 billion, down $1.8 billion from 2022. Notebook volume decreased 5% from 2022, driven by lower demand across market segments, partially offset by increased volume in the second half of the year as customer inventory levels normalized compared to higher levels in the first half. Notebook ASPs decreased 5% from 2022 due to relative strength in the education market segment resulting in a higher mix of small core products combined with a higher mix of older generation products. ■ Desktop revenue was $10.2 billion, down $495 million from 2022. Desktop volume decreased 9% from 2022, driven by lower demand across market segments, partially offset by increased volume in the second half of the year as customer inventory levels normalized compared to higher levels in the first half. Desktop ASPs increased 5% from 2022, due to an increased mix of product sales to the commercial and gaming market segments. ■ Other revenue was $2.1 billion, down $229 million from 2022, primarily driven by the continued ramp down of our legacy smartphone modem business and lower demand for our wireless and connectivity products as a result of lower notebook volumes. 2022 vs. 2021 ■ Notebook revenue was $18.8 billion, down $6.7 billion from 2021. Notebook volume decreased 36% from 2021, driven by lower demand in the consumer and education market segments, and notebook ASPs increased 15% from 2021 due to an increased mix of commercial and consumer products and a lower mix of education products. ■ Desktop revenue was $10.7 billion, down $1.8 billion from 2021. Desktop volume decreased 19% from 2021, driven by lower demand in the consumer and education market segments, and desktop ASPs increased 5% from 2021, primarily from an increased mix of commercial products. ■ Other revenue was $2.3 billion, down $870 million from 2021, primarily driven by the continued ramp down of our legacy smartphone modem business and lower demand for our wireless and connectivity products. intel. MD&A 23 $I I " P N;) "IJ ;) %"7 %$7$ %7 %7 %7" %7 %7 %7 % 7%7 % 7$ %7 **+ *** ** %!7 %7! %7 **+ *** ** V\V& J V\V KJ V\VJI P NNIL **+PK *** G & J IP NRK;. % R ; 2 I *** & J P NIK-<I ***%IP L RI I KKIJK JK%IJ L KJ L IKP N JK JLIKNKJ I P J IL P K I O IJ I P K JIKJ & J #$KIK-<I ***NJ I JPKJI J JNJ IJ K JIKN J IM K II NJK RJIM I IJ I NJK G KJ IP NRK; * % R ;17- I *** KJ P NIK7<I ***%IP L RI I KKIJK JK%IJ L KJ L IKP N JK JLIKNKJ I P J IL P K I O IJ I P K JIKJ KJ #$K IK-<I ***%NJ IKM I NJK KJ J I IJK JK G JIIP NRK;* % R ;**7 I ***%II LIP LJ J NI R NI LKIJ NK KK RI I NIRI KK JPJLI NJKKIKN J RI J P NK ***PK ** G & J IP NRK;2 2 % R ;3 . I ** & J P NIK+3<I **%IP L RI J KNI NJ IJK JK% J #$K IK-<I **NJ IKM I KNII NJK RIM NJ I NJK G KJ IP NRK; . % R ; 2 I ** KJ P NIK7<I **%IP L RI J KNI NJ IJK JK% KJ #$K IK-<I **%II LI IKM I I NJK G JIIP NRK;* + % R ;2. I **%II LIP LJ J NI R NI LKIJ NK KK RI I NIRI KK JPJLI NJK ' (# *+
Operating Income Summary Operating income increased 17% year over year, and operating margin was 22% in 2023 and 18% in 2022. (In Millions) $ 6,520 2023 Operating Income 1,692 Lower period charges driven by the sell-through of previously reserved inventory and lower reserves taken in 2023 1,220 Lower operating expenses driven by various cost-cutting measures 268 Lower period charges primarily driven by a decrease in product ramp costs (1,704) Lower product margin primarily from lower notebook and desktop revenue (385) Higher unit cost primarily from increased mix of Intel 7 products (140) Higher period charges related to excess capacity charges $ 5,569 2022 Operating Income (3,047) Lower product margin from notebook revenue (2,183) Higher notebook and desktop unit cost primarily from increased mix of Intel 7 products (1,306) Lower product margin from desktop revenue (1,400) Higher operating expenses driven by increased investments in leadership products (1,155) Higher period charges primarily driven by inventory reserves taken in 2022 Lower CCG other product margin driven by lower demand for our wireless and connectivity products and the continued ramp down from the exit of our 5G smartphone modem business (267) Higher period charges primarily associated with the ramp of Intel 4 (162) Higher period charges related excess capacity charges Lower period charges due to a benefit related to insurance proceeds received for business interruption and property 192 damage that occurred in 2020 (262) Other $ 15,523 2021 Operating Income intel. MD&A 24 (364) IJ NIL IJ IK.<LI PILI% IJ I RK**< **+ 2< *** 32==2630 % ! H:8/52343C6<: %37* 0 RII IKIP LJK JI N IP NK LIKIP P J IL RIIKIPKJ **+ %** 0 RI IJ M KKIP LPI NK KJNJJ KNIK *32 0 RII IKII LIP LIK I NJI KJK 5%.16 0 RII NJI II LI RI J KJ IP N 5+2-6 >IN J KJII LI IKM J .I NJK 516 >II IKI JJ MKKJLIK % ! H:8/52343C6<: 5+%1.6 0 RII NJI I J IP N 5*%2+6 >I J KJ N J KJII LI IKM J .I NJK 5%+36 0 RII NJI I KJ IP N 5%16 >I IJ M KKIP L IK PKJ JK IKI NJK 5%--6 >II IKII LIP L P J ILIKIPKJ *** 5+316 0 RI" JII NJI IP L RI I NIRI KK JPJLI NJK J J N I R I JMJ NI-"KIJ NK KK 5*3.6 >II IKII LKK JRJJI J 1 53*6 >II IKI JMKKJLIK 7* 0 RII IKNJ JI JJ KNI I KIP I NK KK JIINJ I IJL JJ NII ** 5*3*6 JI % H:8/52343C6<: ' (# *1
Overview DCAI delivers cutting-edge workload-optimized solutions to cloud service providers and enterprises, along with silicon devices for communications service providers, network and edge, and HPC customers. Our unique capabilities enable us to help solve our customers' most complex challenges with the depth and breadth of our hardware and software portfolio, advanced packaging, and at- scale manufacturing made possible through a resilient, global supply chain. Our global customers and partners encompass cloud hyperscalers, multinational corporations, small-and medium-sized enterprises, independent software vendors, systems integrators, communications service providers, and governments. Key Business Developments ■ We have sold more than 2 million 4th Generation Intel Xeon Scalable processors as of the end of 2023, and launched the 5th Gen Intel Xeon processors in Q4 2023. ■ We were recognized by MLCommons, which published MLPerf Training performance benchmark data showing that 4th Gen Xeon and Intel Gaudi 2 are two compelling, open computing platforms in the Al market that compete on performance, price, and broad availability. ■ We announced our intent to separate PSG into a standalone company, giving PSG the autonomy and operational and financial flexibility it needs to accelerate growth to more effectively compete in the FPGA market. Standalone financial reporting for PSG began January 1, 2024. intel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
Market and Business Overview Market Trends and Strategy Data is a significant force in society and is generated daily at an unprecedented pace. The desire to harness insights from data to drive better outcomes for businesses and society is ever expanding. Al is becoming pervasive in nearly all applications, creating the potential for intelligence everywhere, and enabling powerful new uses of compute resources across all market segments. The installed base of Intel Xeon processors, combined with our portfolio of heterogeneous compute solutions (FPGAs, GPUs, IPUs, and Al accelerators), we believe positions us to lead in this high-growth area. DCAI is integral to our growth in Al through deep investments in the Al ecosystem, developer tools, frameworks, networking and memory, technologies, and open standards to drive a scalable path forward. We take a system-level approach that supplies the necessary hardware and software optimized for power and performance. Our technology is differentiated at the system level and in high-growth workloads based on our integrated hardware acceleration engines and software. For example, architected into our Intel Xeon processors are Intel® Advanced Matrix Extensions (Intel® AMX) for Al acceleration; Intel® Software Guard Extensions (Intel® SGX), providing enclaves of protected memory designed to deliver enhanced security for sensitive data; and Intel® Crypto Acceleration, which is designed to deliver breakthrough performance across cryptographic algorithms. We believe this acceleration and performance will continue to drive our differentiated value and growth across our customer base. Products and Competition Our products and services include: • A portfolio of hardware, including Intel Xeon processors, the Intel® Xeon CPU Max Series, the Intel® Data Center GPU Max Series, the Intel® Data Center GPU Flex Series, Intel Agilex® and Intel® Stratix® FPGAs, Intel® eASICTM^ devices, and the Intel Gaudi processors. • Platform enabling and validation in partnership with ODMs, OEMs, CSPs, and independent software vendors. ■ Optimized solutions for leading workloads such as AI, cryptography, security, storage, and networking, leveraging differentiated features supporting diverse compute environments. We provide our customers with an extensive portfolio of silicon and software products, engineered to deliver workload-optimized performance. Our hardware portfolio comprises CPUs, GPUs, domain-specific accelerators, and FPGAs, designed to support the performance, agility, and security that our customers demand. Deployment of our silicon platforms is accelerated by a software development environment that enables workload mobility across our heterogeneous architectures and enables developers to execute their workloads on the hardware that best meets application requirements. Our competitors include AMD, providers of GPU products such as NVIDIA, companies developing their own custom silicon, and new entrants and incumbents developing ARM- and RISC-V-based products customized for specific data center workloads. We expect this competitive landscape to continue. The Intel Xeon Scalable processor family delivers advanced CPUs for the data center, the network, and the edge, driving industry-leading performance, manageability, and security with differentiated features and capabilities. In 2023, we launched the 5th Gen Intel Xeon Scalable processors, which utilize modular SoCs for increased scalability and flexibility to deliver a range of products that meet the growing scale, processing, and power efficiency needs for Al, cloud, and enterprise installations. Our Intel Gaudi 2 Al deep learning processor is engineered to allow customers to benefit from the most cost-effective, high-performance training and inference alternative to comparable GPUs. Our FPGA and structured ASIC portfolio enhances Intel's ability to meet the needs of customers in the data center, across the network, and at the edge. In 2023, we released 21 new products within our FPGA business. These include the Intel Agilex 9 and Intel Agilex 7 product families, which are intended to handle the increased demand for customized workloads, including enhanced Al capabilities, and to provide lower total cost of ownership. Our Intel Xeon CPU Max Series, introduced in 2022, was the first and only x86-based processor with high bandwidth memory for HPC and Al workloads. The Intel Data Center GPU Max Series 1550 and 1100 are now broadly available through OEM systems. Our Intel CPU Max Series includes 64GB of on-package high bandwidth memory, which benefits data-intensive HPC workloads. Our Intel Data Center GPU Flex Series offers customers a flexible, general-purpose GPU for the data center and the intelligent visual cloud. We delivered and installed, in collaboration with Argonne National Laboratory (ANL) and Hewlett Packard Enterprise (HPE), the largest cluster of Max GPUs to the Aurora Supercomputer at ANL. The ubiquity of Intel Xeon in the installed base, along with our heterogeneous compute solutions combined with software that unlocks the value of our hardware, enable our customers to develop highly differentiated solutions. Our integrated approach has created significant value for Intel, our customers, and our partners by helping us mitigate risks, reduce costs, build brand value, and identify new market opportunities to apply our technology to address our customers' and society's most complex issues. intel. MD&A 26 'IJ )NK KKPIPR 'IJI K JIJL JKK J I K JL K IJ LJ N I J KIJ I KK KJKI JJ IP JJI NJ K I NK KKK K JLKPIM # K IPKP I L J K%IJ J J J I J PILRI% RIN RNKK NJIK NIKI KK IJK JK KJ K J = I KK IK% RJ NI IJ JI NK NJK NJ K5$"#K%"$1K% $1K% # IJ IK6%R P KJ KNKJ JKI RJI # K JI J NII RJ # JI N PKJ JK J# KLKJ%P I J K%IR IK% JR I IL%J K% KJ IKJ IPK J IRI !JKLKJ P I JJKN KJ KKILIRI K JRI JO I RI I I NI J LKI JJJJKLKJ P I RJR I K K NI JIJIRI IJ K K JRI IM %IJJ J NI J = I KK IKI J X#P 'JIM MJ K K5 J X#'=6 I# IJ : J X JRI"NI MJ K K5 J X"=6%I P PK I JJ ILK J PI KNIJL I K KJPJ: J XILJ # IJ %RKK J PI IJI NI I I KKILJ I IJK ! PJK IJ I I R J NJ IP NII JJP N I RJI KK NINKJ I K $I NJK JJ NII NJK KIPK N9 V # IJ IRI% N J = I KK IK%J J X= $1'MIK%J J X J JI"$1'MIK%J J X J JI"$1 MIK% J # MX J XJIJMX$"#K% J X# YPK% J J "NI KK IK V $ J I P J IJ IKRJ 'K% 'K%$K% JK JRIP IK V JOK NJ K I R I KKNK# %ILJ IL%KNIJL%KJ I% JR I % PI I JJ JNIKKN IJ PIK NJ PI JK !I P NINKJ IKRJ MJ KP IJ K K JRII NJK% IJ PIR I JO I I NIIRI IJ IKK$1K%"$1K% K IJ IK% $"#K%K J KN IJJ I I % JL% KNIJLJJ NINKJ IK L J NIK J IKK IJ LK JRI P J PI JJJ KR I JLI KK NIJI NKIJJNIK KP IKJ MNJ JIR I K JIRIJJ KJJK J IQNI JK NI JJ IK N#' %I PIK "$1I NJKKNK&? #% KP JI R NKJ K % R JI JK N JKP # ' ? KI NJKNKJ O IKJ JIR I K !MJJK JJP KJ J N J = I KK I L PIKP $1K IJJ JI%J JR I% J%IP NKJIL I I % JL% KNIJLRJI JJJNIK JK **+%R N J-J" J = I KK IK%RNJ O N I K I IKK JL M JLJ PII I NJKJJJJ I R K %I KK % RI L K I# % N% JIIK KJ J K NI J "N*# I I KK IK IJ RNKJ IKJ JI J KJ KJJP%I I JI I JI JPJ I "$1K NI$"# KJINJNI# IJ K J /K JLJ JJ K NKJ IK JJ JI%I KKJ JR I% JJ **+%RI K* RI NJKRJ NI$"# NK KK K NJ J # M7 J # M. I NJ K%RI J J J IK INKJ OR I K% N # JK% J I P RIJ J KJ R IK NI J = $1'MIK% JI N ***%RKJIKJ LM23 KI KK IRJ RJ IL I>$ # R I K J J JI"$1'MIK-- I R I LP JI N 'KLKJK NI J $1 'MIK NK31") RJ IL%R JKJ J KP>$R I K NI J J JI "$1 MIK IKNKJ IK M % I NI K"$1 IJJ JI J J JPKN N ! PI KJ % IJ RJ#I &J 0 IJ IL5#&06 >R JJ$I JIIK5>$ 6%J IKJ NKJI 'M"$1K J J#NI INI NJIJ#&0 N QNJL J = J KJ K% RJ NIJI NK NJK NJ K RJK JRIJJN KJ P N NIIRI% NINKJ IKJ P LI JJK NJ K NI JIJI KIJK J P N I J % NINKJ IK% NIIJ IK L NKJJIKK%IN KJK% N I P N% JL RIJ IJN JKJ L NIJ LJ IKK NINKJ IK/ K JL/K KJ MKKNK ' (# *3
Financial Performance DCAI Revenue $B DCAI Operating Income (Loss) $B $22.8 $7.4 $19.4 $15.5 $1.3 $(0.5) 2023 2022 2021 2023 2022 2021 Revenue Summary 2023 vs. 2022 Revenue was $15.5 billion, down $3.9 billion from 2022, driven by a decrease in server revenue. Server volume decreased 37% from 2022, due to lower demand in a softening CPU data center market. Server ASPs increased 20% from 2022, primarily due to a lower mix of hyperscale customer-related revenue and a higher mix of high core count products. 2022 vs. 2021 Revenue was $19.4 billion, down $3.3 billion from 2021, due to a decrease in server revenue, partially offset by higher other DCAI revenue. Server volume decreased 16% from 2021, led by enterprise customers in a competitive environment, and due to customers tempering purchases to reduce existing inventories in a softening data center market. Server ASPs decreased 5% from 2021, driven by a higher mix of revenue from hyperscale customers. Other DCAI revenue increased 18% from 2021 primarily driven by growth in our FPGA business. Operating Income (Loss) Summary We had an operating loss of $530 million in 2023, compared to operating income of $1.3 billion in 2022. (In Millions) $ (530) 2023 Operating Income (Loss) (2,709) Lower product margin primarily due to lower server revenue (1,269) Higher server unit cost primarily from increased mix of Intel 7 products (171) Higher period charges related to excess capacity charges 1,337 Lower operating expenses driven by various cost-cutting measures 520 Lower period charges primarily driven by a decrease in product ramp costs 462 Lower period charges driven by the sell-through of previously reserved inventory and lower reserves taken in 2023 $ 1,300 2022 Operating Income (3,325) Lower product margin from server revenue (1,137) Higher period charges primarily associated with the ramp up of Intel 4 (1,043) Higher operating expenses driven by increased investments in leadership products (671) Higher server unit cost from increased mix of 10nm SuperFin products (645) Higher period charges driven by inventory reserves taken in 2022 (189) Higher period charges related to excess capacity charges 785 Higher product margin from DCAI other product revenue Lower period charges due to a benefit related to insurance proceeds received for business interruption and property 223 damage that occurred in 2020 (74) Other $ 7,376 2021 Operating Income Intel. MD&A 27 $I I # P N;) # IJ 50 KK6;) %7 %7 %7$ **+ *** ** %7 %7 %"7 **+ *** ** P NNIL **+PK *** P NRK;- - % R ;+ 7 I ***%IP LIK KIPIIP N IPIP NIK+.<I ***%NJ RI K J $1J JIIJ IPI#$K IK*<I ***%II LNJ RIM LIK NKJ II JIP N IM I N JI NJK ***PK ** P NRK;7 1 % R ;+ + I **%NJ IK KIPIIP N%IJ L KJ LI JI # IP N IPIP NIK3<I **% L JIIKNKJ IK JJP PI J% NJ NKJ IK JI NIKKJ INMKJ P J IK K J J JIIJ IPI#$KIK-<I **%IP L IM IP NI LIK NKJ IK JI # IP N IK2<I **II LIP LI RJ NI$"# NK KK IJ 50 KK6NIL ! IJ KK ;-+ **+% IJ IJ ; + *** 32==2630 % H:8/52343C6<: 600 5*%.76 0 RII NJI II LNJ RIKIPIIP N 5%*376 >IKIPIN J KJII LI IKM J .I NJK 5.6 >II IKI JJ MKKJLIK %++. 0 RI IJ M KKIP LPI NK KJNJJ KNIK -* 0 RII IKII LIP LIK I NJI KJK 13* 0 RII IKIP LJK JI N IP NK LIKIP P J IL RIIKIPKJ **+ % H:8/52343C6<: 5+%+*-6 0 RII NJI I KIPIIP N 5%+.6 >II IKII LKK JRJJIN J 1 5%1+6 >I IJ M KKIP L IK PKJ JK IKI NJK 53.6 >IKIPIN J KJI IKM NI I NJK 531-6 >II IKIP L P J ILIKIPKJ *** 5276 >II IKI JJ MKKJLIK .2- >II NJI I # JII NJIP N **+ 0 RII IKNJ JI JJ KNI I KIP I NK KK JIINJ I IJL JJ NII ** 5.16 JI % " "! H:8/52343C6<: ' (# *.
Overview NEX transforms the world's networks and edge compute systems from fixed-function hardware to general-purpose compute, acceleration, and networking devices running cloud native software on programmable hardware. We work with partners and customers to deliver and deploy intelligent edge platforms that allow developers to achieve agility and to drive automation using Al for efficient operations while securing the integrity of their data at the edge. We have a broad portfolio of hardware and software platforms, tools, and ecosystem partnerships for the rapid digital transformation happening from the cloud to the edge. We are leveraging our core strengths in compute, connectivity, software, and manufacturing at scale to grow traditional markets and to accelerate entry into emerging ones. Key Business Developments ■ We launched the 4th Gen Intel Xeon processor with Intel vRAN Boost, and announced the Intel Xeon D-1800 series and the Intel Xeon D-2800 series processors optimized for cloud, edge, and 5G networks. ■ We continue to update solutions to improve developers' digital strategies and to accelerate market adoption of edge and Al applications. We announced 13th Gen Intel Core processors for Internet of Things edge and OpenVINO toolkit version 2023.1 with enhanced features for GenAl and edge computing. ■ We continue to work with our ecosystem partners like Ericsson, Nokia, Cisco, Dell Technologies, HPE, Lenovo, Amazon, Google, and Microsoft to drive the software-defined transformation of the world's network and edge infrastructure and accelerate AI-driven automation of physical operations. Intel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
Market and Business Overview Market Trends and Strategy The Internet is undergoing a shift toward a cloud-to-edge infrastructure, combining unrivaled scale and capacity in the cloud with faster response times at nearby edges. As Al is transforming and automating every industry—from factories to smart cities to hospitals—the demand for high-performance computing at the edge has expanded exponentially. Networks are moving toward software, becoming more programmable and flexible. Our network and edge solutions aim to unleash the power of intelligent edge solutions for our customers and move the world's networks to a software infrastructure that runs on Intel technologies by (1) providing edge-optimized, Al-enabled compute and connectivity solutions to run every workload at the edge, between the cloud and the end user, and (2) deploying software platforms that enable developers to build, deploy, run, manage, connect, and secure distributed edge infrastructure, applications, and edge Al across several verticals, such as industrials, federal, aerospace, retail, healthcare, education, and smart cities. Products and Competition With a greater emphasis on systems and solutions designed to harness the growth of data processed at the edge to yield insights, our competitive landscape has shifted beyond application-specific standard product vendors to include cloud, network, and Al computing platform providers. Today, we speed the deployment of network and edge computing solutions based on our open software frameworks, Al-enabled platform solutions, and edge and network-optimized broad silicon portfolio to address a wide range of applications across several markets. On-Premises Edge: More than just providing silicon, we partner with companies to design and deliver solutions to help a wide range of customers transform their businesses and take advantage of the rapidly increasing number of connected and intelligent devices. We develop high-performance, Al-enabled compute platforms that solve for technology and business use cases that scale across several industries, such as retail, education, manufacturing, energy, healthcare, and medical. We deliver edge-optimized Al-enabled platforms for edge applications based on our Intel Xeon, Intel Core, and Intel Atom processor portfolio, which reduces operational complexity for our customers and helps our customers create, store, and process data at the edge so they can analyze it faster and act on it sooner. We also build differentiated networking offerings that keep pace with industry speeds and deliver unique features needed for the intelligent edge, such as networking offloads, time-sensitive networking, and scalable reliable transport. Enterprise Networking: Enterprises are evolving their networks to connect new and varying environments, host services from anywhere between cloud and edge, deliver heightened service levels, and handle growing volumes of devices and data. We are leading the world's shift to run networking workloads in software and create network function virtualization to provide our customers with more efficient, cost- effective, and programmable platforms that enable secure, agile, and reliable networking solutions from edge to cloud. We work with our ecosystem partners of over 500 network builders to help enterprises optimize their networks with right-sized compute and connectivity requirements for current and future needs. Telecommunication Networks: We lead 5G core network deployments, demonstrating that 5G base stations can be almost entirely built from software running on Intel Xeon processors with Intel vRAN Boost. We continue to drive the transformation from fixed-function networks onto Intel Xeon Scalable processors and Intel Xeon D processors coupled with our FlexCore and FIexRANTM' software. Our customers are tier-one global communication service providers and their equipment suppliers. Our software-based cloud RAN platform is designed to allow operators to deploy the fastest cloud-native 5G infrastructure quickly and efficiently at scale to meet the needs of their end customers. Cloud Networking: Our cloud customers require uncompromised data center network performance and reliability driven by increased networking investments to support Al cluster deployments. We address these requirements by providing our open-standards-based NICs and IPUs. The IPU, a new class of product, is an open and programmable compute platform that frees up more compute cycles for customers by running infrastructure workloads in a separate, secure, and isolated set of CPU cores. Software and Platforms: Our customers' need for flexibility, programmability, and versatility drives workloads toward software and away from fixed-function hardware. As networking in the cloud, core network, 5G, and private networks move to software, and as our edge customers increasingly deploy Al applications, we aim to simplify innovation on Intel hardware. We support our customers' software strategy at the edge with an edge-native software platform with modular building blocks, premium service, and support offerings. The platform enables developers to build, deploy, run, manage, connect, and secure distributed edge infrastructure, applications, and edge Al. The platform is a horizontal approach to scaling the needed infrastructure for the intelligent edge and hybrid AI, as well as bringing together an ecosystem of Intel and third-party vertical applications. Offering unique optimizations for network, the Internet of Things, hybrid AI, and edge workloads on Intel architecture, the platform also broadly supports diverse architectures and can be consumed on a modular basis—avoiding vendor lock-in. The platform delivers a seamless cloud-like experience, combining truly edge-native capabilities for security and zero-touch management with our deep industry experience and unrivaled ecosystem. intel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
$5.8 Financial Performance NEX Revenue $B NEX Operating Income (Loss) $B $8.4 $7.7 $1.9 $(0.5) $1.0 2023 2022 2021 2023 2022 2021 Revenue Summary 2023 vs. 2022 Revenue was $5.8 billion, down $2.6 billion from 2022, as customers tempered purchases to reduce inventories and adjust to a lower demand environment across product lines. 2022 vs. 2021 Revenue was $8.4 billion, up $744 million from 2021, driven by higher Ethernet ASPs and increased demand for 5G products, partially offset by lower demand for Network Xeon. Ethernet demand declined in Q4 2022 due to lower server demand, and edge demand declined in Q4 2022 due to macroeconomic factors. Operating Income (Loss) Summary We had an operating loss of $482 million in 2023, compared to operating income of $1.0 billion in 2022. (In Millions) (482) 2023 Operating Income (Loss) (1,832) Lower product margin driven by lower revenue across NEX product lines (181) Higher period charges driven by inventory reserves taken in 2023 498 Lower operating expenses driven by various cost-cutting measures 1,033 2022 Operating Income (520) Higher operating expenses driven by increased investments in leadership products (377) Higher period charges primarily associated with the ramp of Intel 4 (367) Higher period charges primarily due to other product enhancements (290) Higher period charges driven by reserves taken in 2022 and lack of sell-through of reserves compared to 2021 522 Higher product margin from Ethernet revenue 203 Lower unit cost primarily from10nm SuperFin products (73) Other 1,935 2021 Operating Income Intel. MD&A 30 $I I & = P N;) & =IJ 50 KK6;) %7$ %$7 %"7" **+ *** ** %7 %7 %7 **+ *** ** P NNIL **+PK *** P NRK;- 2 % R ;* 3 I ***%KNKJ IKJINIKKJ IN P J IK 8NKJJ RI PI JI KKI NJ K ***PK ** P NRK;2 1 %N;.11 I **%IP LI JI J#$K IK I-"I NJK%IJ L KJ L RI I&JR I= JI J 41***NJ RIKIPI % 41***NJ I J IK IJ 50 KK6NIL ! IJ KK ;12* **+% IJ IJ ; *** 32==2630 % $ H:8/52343C6<: 600 5%2+*6 0 RII NJI IP L RIIP NI KK& =I NJ K 526 >II IKIP L P J ILIKIPKJ **+ 172 0 RI IJ M KKIP LPI NK KJNJJ KNIK % H:8/52343C6<: 5-*6 >I IJ M KKIP L IK PKJ JK IKI NJK 5+..6 >II IKII LKK JRJJI J 1 5+3.6 >II IKII LNJ JII NJ JK 5*76 >II IKIP LIKIPKJ *** K JI N IKIPK IJ ** -** >II NJI I JI JIP N *+ 0 RIN J KJII LI NI I NJK 5.+6 JI % H:8/52343C6<: ' (# +
Overview Mobileye is a leader in the development and deployment of ADAS and autonomous driving technologies and solutions. We pioneered ADAS technology more than 20 years ago, and have continued to expand the scope of our ADAS offerings while playing a leading role in the evolution of autonomous driving solutions. Our portfolio of solutions is built upon a comprehensive suite of purpose-built software and hardware technologies designed to provide the capabilities needed to make the future of ADAS and autonomous driving a reality. These technologies can be harnessed to deliver mission-critical capabilities at the edge and in the cloud, advancing the safety of road users, and revolutionizing the driving experience and the movement of people and goods globally. Our customers and strategic partners include major global OEMs, Tier 1 automotive system integrators, and public transportation operators. Key Business Developments • We launched EyeQTM-based systems into approximately 300 different vehicle models and built significant traction with our advanced portfolio of products, including Cloud-enhanced ADAS, Mobileye SuperVisionTM, and Mobileye ChauffeurTM' ■ Mobileye SuperVision execution continues to progress as we delivered an over-the-air update in August 2023 delivering highway navigate-on-pilot capabilities that are now enabled in 22 cities, as compared to two cities at the August 2023 launch. Customer traction also saw an acceleration in 2023, as we achieved new SuperVision design wins with Porsche, FAW, Mahindra & Mahindra, and a major global western OEM. We achieved our first production design wins for the Chauffeur product during 2023 as well, including with Polestar, FAW, and a major global western OEM. ■ We were recognized as the leader in the development of autonomous vehicle technology by two leading research groups, Guidehouse Insights and ABI Research, excelling in quantitative and qualitative assessments across various criteria such as technology, innovation, strategy, implementation, and customer bases. We moved up six positions in the Guidehouse Leaderboard since the 2021 report, demonstrating progress in realizing our autonomous vision. intel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
Market and Business Overview Market Trends and Strategy In 2023, the automotive industry grew with an approximately 9% increase in global vehicle production year over year. We expect industry ADAS volumes to grow faster than overall global vehicle production in the coming years and anticipate long-term ADAS growth from increases in the percentage of vehicles that are equipped with basic ADAS features from the factory. Despite our expectation for a decline in Mobileye ADAS volumes in 2024 due to a correction of inventory with our customers, we continue to believe we will benefit from positive industry ADAS growth over the medium-term. In addition to potential volume growth, our portfolio of advanced solutions has the potential to drive higher average system price over time. Beyond ADAS solutions, we believe that the availability of AVs will cause a significant transformation in mobility, including vehicle ownership and utilization. We expect that AV technology will eventually be accessed by consumers through shared-vehicle MaaS networks, as well as in consumer-owned and operated AVs. We are pursuing this market trend by using our eyes-on/hands-off Mobileye SuperVision solution as a baseline to scale to our eyes-off/hands-off Mobileye Chauffeur consumer AV product in a variety of operational design domains. As it relates to AMaaS, we intend to primarily go to market by supplying Mobileye Drive TM self-driving system to transportation network companies, public transit operators, and suppliers of AV-ready vehicle platforms. In some cases, we expect to bundle our Mobileye Drive self-driving system with Moovit's urban mobility and transit intelligence application and its global user base. Products and Competition We currently ship a variety of ADAS solutions to a large number of global automakers. We are recognized for our top-rated safety solutions globally, and since 2007, we have introduced numerous industry-first ADAS products. We are building a robust portfolio of end-to-end ADAS and autonomous driving solutions to provide the capabilities needed for the future of autonomous driving, leveraging a comprehensive suite of purpose-built software and hardware technologies. We pioneered "base" ADAS features to enhance vehicle safety and to meet global regulatory requirements and safety ratings with our driver assist solution and we have since created a new category of ADAS with our Cloud-Enhanced DriverAssistTM and premium driver assist offerings, such as Mobileye SuperVision. By leveraging Mobileye SuperVision's full-surround computer vision and True Redundancy TM , we are developing Mobileye Chauffeur, our consumer AV solution and Mobileye Drive, our eyes-off/hands-off autonomous driving solution designed for fleet deployment. Our current offerings to Tier 1 and OEM customers do not include cameras, radars, lidar systems, or other sensors (except in particular cases). We intend in the future to offer radar and lidar products that are currently in development stages. The ADAS and autonomous driving industries are highly competitive. In the ADAS and consumer AV market, we face competition primarily from other external providers, including Tier 1 automotive suppliers and silicon providers, as well as in-house solutions developed by OEMs to a certain extent. Our Tier 1 customers may be developing or may in the future develop competing solutions. In the autonomous driving market, including AMaaS and consumer AV, we face competition from technology companies; internal development teams from the automakers themselves, sometimes in combination with investments in early-stage autonomous vehicle technology companies, Tier 1 automotive companies, as well as robotaxi providers. 'Source: S&P Global Production Forecast intel. MD&A 32 'IJ )NK KKPIPR 'IJI K JIJL **+%JNJ JP NKJILIRRJ I MJ L7< IK P I NJ LI PILI !MJ NKJIL # #P NKJ I RKJIJ PI P I NJ J LIK JJ JI# #I RJI IKK JI J P KJJIQNRJ K# #JNIKI JJ IL KJ NIMJJ I ' L# #P NK **1NJ IIJ P J ILRJ NINKJ IK%R J NJ PRR JI KJP NKJIL# #I RJ PIJNJI J J J J P NI RJ% NI IJ P K NJ KKJ J J J IPIPIKLKJI PIJ )L # #K NJ K%R PJJJP JL #?KR NKK JJI K IJ JL% N P R IK NJ OJ !MJJJ#?J LR P JN L KK L KNIKJI NKIP ' JR IK%KR K KNI R IJ#?K !INIKN JKIJJI LNK NILK 8 K ' L NI?K K NJ K K J K J NILK 8 K ' LNNI KNI#?I NJ PIJL IJ K K #KJI JKJ #'%R J J II L J IJ LKN L ' L IPYK IP KLKJJ JI K IJJ JR I K%N JI KJ IJ IK% KN IK #?ILP J IK K KK%RMJJ N NI' L IPK IP KLKJRJ' PJTKNI JL JI KJ J J JK NKI K $I NJK JJ !NII J LKPIJL # #K NJ KJ I N I NJ IK !II O I NIJ IJKJL K NJ K L% K *.%RP JI N NI NK NKJILIKJ# #I NJK !I N I NKJ IJ J # # NJ NKIP K NJ KJ I PJ JK IJNJNI NJ NKIP % PI I KPKNJ NI K N JK JRI IRIJ K ! I] K^ # #JNIKJ P KJL J J IN J ILIQNI JK KJLIJ KRJ NIIPIKKKJK NJ RPK IJ RJ IL # #RJ NI N IPI#KKKJY INIPIKKKJ I K%KNK ' LNI?K )L PI ' LNI?K TKN KNII N NJIPK IN N LY%RIP ' LNNI% NI KNI#?K NJ ' L IP% NILK 8 K NJ NKIP K NJ K I J L J NINII J I KJ I 'NKJ IK J NIK%IIK% IKLKJK% I JIK K IK5MJ IJN IKK6 ! J JNJNIJ III II NJKJJINII J L P JKJK # # NJ NKIP NKJIKI L JJP J# # KNI#?IJ%R JJ II L I JIMJI I PIK% N INJ JPKN IK K I PIK%KR K NKK NJ KP L 'KJ IJ MJ J NIINKJ IKL P IL JNJNIP J K NJ K JNJ NK IP IJ% N #' KNI#?%R JJ I J L K: JI P JJKI J NJ IKJK PK%K JK J RJ PKJ JK I LKJNJ NKP J L K%I NJ JP K%KR KI JMI PIK *&1!" * ;0 &=$ ;!&91" #& -&! "$6 ' (# +*
$1.4 Financial Performance Mobileye Revenue $B Mobileye Operating Income $B $2.1 $1.9 $0.7 $0.7 $0.6 r 2023 2022 2021 2023 2022 2021 Revenue and Operating Income Summary 2023 vs. 2022 Revenue was $2.1 billion, up $210 million from 2022, primarily driven by higher demand for EyeQ products. Operating income was $664 million, down $26 million from 2022. 2022 vs. 2021 Revenue was $1.9 billion, up $483 million from 2021, primarily driven by higher demand for EyeQ products and Mobileye SuperVision systems. Operating income was $690 million, up $136 million from 2021, primarily due to higher revenue, partially offset by increased investments in leadership products. intel. MD&A 33 $I I ' L P N;) ' LIJ ;) %7 %7 %7 **+ *** ** %7" %7" %7! **+ *** ** P N IJ NIL **+PK *** P NRK;* %N;* I ***%II LIP LI I L4I NJK IJ RK;331 % R ;*3 I *** ***PK ** P NRK; 7 %N;12+ I **%II LIP LI I L4I NJK ' LNI?K KLKJK IJ RK;37 %N;+3 I **%II LNJ IIP N%IJ L KJ L IK PKJ JK IKI NJK ' (# ++
Overview As the first Open System Foundry, we enable our customers' transition from general-purpose monolithic chips to systems of chips tailored to high-growth applications, including AI, and optimize their solutions by combining the best technologies from Intel and the ecosystem. We believe this combination of systems technology, systems expertise, ecosystem partnerships, and robust supply chain helps fuel the growth of our customers, creates more robust global supply chains, and ultimately transforms the foundry industry. Our customers and strategic partners include traditional fabless companies, cloud service providers, automotive, and military, aerospace, and defense firms. We also offer IMS mask-making equipment for advanced lithography used by most of the world's leading-edge foundries. Key Business Developments ■ In 2023, we were granted four design wins on Intel 18A, including a design win with a significant high performance computing customer on Intel 18A and a large prepayment. We have seen accelerated interest in our advanced packaging business, especially for Al related designs, and have secured five new design wins. ■ Our IFS Accelerator Ecosystem Alliance program doubled in size to over 40 strategic agreements across EDA, silicon IP, design services, cloud, and USMAG alliances since launching in Q1 2022. We announced a multigenerational agreement with ARM and a definitive agreement with Synopsys. The ARM agreement is expected to enable chip designers to build optimized compute SoCs on the Intel 18A process. The Synopsys agreement expands the development of a portfolio of IP on Intel 3 and Intel 18A. These agreements and the IFS accelerator program are expected to enable customers to design using a robust suite of EDA and IP across IFS nodes, similar to the way they would design with their existing foundry supplier. ■ We expanded partnerships under the Rapid Assured Microelectronics Prototypes-Commercial (RAMP-C) program created by the US Department of Defense in 2021 to assure domestic access to leading-edge technology and the US-based foundry ecosystem. The combination of expanded partnerships and RAMP-C enables customers to develop and fabricate chips on Intel 18A, including customers such as Nvidia, IBM, Microsoft, Boeing, and Northrop Grumman. • We announced a commercial agreement with Tower, pursuant to which we are expected to provide foundry services and manufacturing capacity through our New Mexico advanced manufacturing facility for 300mm advanced analog processing. Intel. MD&A 34 PIPR #KJIKJ LKJ N IL%R NINKJ IK/JI KJ I I NI K JKJ KLKJK K J IJ I RJ J K% N # % JOJIK NJ K L J KJJ KI J J KLKJ ! PJK J KLKJKJ L%KLKJKMIJK% KLKJIJ IKK% I NKJKN L KN JI RJ NINKJ IK%IJK II NKJ KN L K% N JJ LJI K IKJ N IL NKJIL NI NKJ IK KJIJIJ IK NJIJ KK K% NKIPI PIK%NJ JP% JIL%I K% KIK ! K I 'K QN J IP J ILNK L KJ JR I /K N IK L)NK KK P JK V **+%RRII J NIK R K J 2#% N K R RJK JI I NJ NKJ I J 2# IIL J !PK IJ JIKJ NIP NK KK% K L I# I JK K% PKNIP RK R K V NI # IJ I KLKJ# I I N KOJ PI1KJIJI JKI KK #%K $%K KIPK% N% 1'#" KK N 4*** ! N N J IJ I JRJ# ' JPI JRJL KLK # 'I JKMJJ K IKJ N JO NJ K J J 2#I KK L KLKI JM KJP J IJ $ J + J 2# KI JK J IJ II IIMJJ NKJ IKJ K NK I NKJKNJ # $I KK K%K IJ JRLJLR N K RJJIMKJ N ILKN I V !M IJ IKKN IJ #KKNI'I JI K$I J JLK I 5 #'$6I IIJ LJ 1 IJ J K **J KKNI KJKKJ J L J1 K N IL KLKJ J M IJ IKK #'$ KNKJ IKJ P IJK J 2#% N NKJ IKKNK&P% )'%'I K J%) % & IJI "IN V ! N I I JRJ RI%NIKN JJ RRIMJJ I P N ILKIPK NJNI JLJI N NI&R'M P NJNI JL I+P I KK ' (# +1
Market and Business Overview Market Trends and Strategy The chip industry is undergoing a structural transformation driven by: ■ Five superpowers: ubiquitous compute, pervasive connectivity, cloud-to-edge infrastructure, AI, and sensing; ■ A generational shift in computer architectures: the move from system on chip to system of chips (chiplets), increased tailoring of chips to workloads, especially Al, and the vertical integration into chipmaking by OEMs and CSPs; ■ Increasing costs of R&D and capacity for advanced node technologies; and ■ Supply chain risk highlighted by geo-political issues and the growing need for a resilient, secure, and sustainable global supply chain. These transformational trends are driving significant semiconductor market growth in leading-edge silicon and packaging technologies, especially in systems of chips for Al applications. Customers have to make complex design choices at every level of the system, from packaging technologies, process nodes, interconnects, physical IP, and compute elements to software. The abundance of technology choices and optimizations is adding complexity in design, technology, integration, and manufacturing. Our IDM 2.0 strategy includes our pursuit of these complex manufacturing and market growth opportunities by making significant capital investments in leading-edge semiconductor technologies in order to create foundry capacity and establish IFS as a major provider of foundry services that provides semiconductor manufacturing solutions for others and for ourselves. We have made and expect to continue to make significant capital investments in furtherance of this strategy. Products and Competition We seek to address this tectonic shift in the chip industry by enabling our customers to create optimized systems of chips by combining the best technologies from Intel and the ecosystem. We believe Open System Foundry is a world-class foundry offering, delivered from a resilient, secure, and sustainable source of supply and complemented by access to the systems of chips capabilities from Intel. The basic foundry offering is advanced process technologies backed by an ecosystem of IP, EDA, and design services, which enable customers to design as they would with other foundries. The systems of chips capabilities include advanced packaging technologies, software to accelerate bring-up and integration of complex chips, and driving standards that will improve system performance. With our IFS accelerator program members and the Arm and Synopsys agreements, we believe we are well on the way to building out a world-class foundry offering. With the rise of Al, our advanced packaging business is expected to be another unique advantage for Intel. Chips created with us or other foundries can be packaged using Intel's advanced packaging technologies, including 2D and 2.5D/3D solutions designed to enable large, highly scalable packages at competitive costs. We continue to drive technologies, capabilities, and standards needed to optimize systems of chips, including the Universal Chiplet Interconnect Express* standard for communication between chips in a system, which was demonstrated in silicon in 2023. We accelerate our customers' designs by providing services and software that leverage Intel's vast experience as a systems company. Our competitors are mostly pure-play foundries that focus on delivering a pure-play foundry offering from fabrication plants based primarily in Asia. Of the five major semiconductor foundries, TSMC, Samsung, Global Foundries (GF), United Microelectronics Corporation (UMC), and Semiconductor Manufacturing International Corporation (SMIC), only Samsung is an IDM and foundry, and only GF is headquartered in the US. TSMC leads the market with 59% market share, followed by Samsung at 16% in 2022'. Neither Samsung nor TSMC currently offers its most advanced nodes outside of Asia and both have limited advanced node capacity in the US. We believe the Open System Foundry model delivers differentiated capabilities to help our customers lead in their industries while bringing stability to the global semiconductor supply chain. The momentum and customer commitments we are seeing demonstrate that our strategy and offerings are resonating, and we look to build on this success in 2024 and in future periods. 'Source: TrendForce intel. MD&A 35 'IJ )NK KKPIPR 'IJI K JIJL NKJILKN I KJINJNI JI K IJ IP L9 G PKNI RIK9N QNJ NK NJ%IPKP JPJL% NJ IKJINJNI%# % K K : G # IJ KJ NJIIJJNIK9J PI KLKJ J KLKJ K5 JK6% IKJ I KJ R I K%K L# % JPIJ JIJ J L 'K $K: G IK KJK ( JL IP J K: G N L IK J L J KKNK JI R IIK J%KNI% KNKJ KN L KJI K IJ JI KIIP K JK NJ IIJI RJ K J K% K L KLKJK K I# J K NKJ IKPJ MK KJPIL P JKLKJ%I J K%I KK K% JI JK%LK $% NJ JKJ K JRI N J L K JOJ KK MJL K %J L% JIJ % NJNI NI '* KJIJL NK NINIKNJ JK M NJNI IJI RJ IJN JK L K JJ PKJ JK K NJ IJ K IIJ IJ N ILJL KJ K K8 II PI N ILKIPKJJI PKK NJ I NJNI K NJ K I JIK I NIK PK !P MJJ J N J K JJ PKJ JK NIJI JKKJIJL $I NJK JJ !KJ IKKJKJJ KJ J NKJIL L NINKJ IKJ IJ JOKLKJK K L J KJJ KI J J KLKJ ! P LKJ N ILKR I KK N IL I % PII IK J%KNI% KNKJ K NI KN L J LKKJ JKLKJK K JKI J K N IL I KP I KKJ K L KLKJ $% #% K KIPK%R NKJ IKJ K KJLR N RJ JI N IK KLKJK K JK NP J K%K JRIJ IJ I N JIJ MK% IP KJ IKJJR I PKLKJI I !J NI IJ II I IK J#I L KLKI JK%R PRIR JRLJ N NJ R I KK N IL I !JJIK # % NIP NK KKKMJJ JIN QNP J I J KIJRJNK I JI N IK NK J /KP J K% N * * - 8+ K NJ KK J I% LK KJ JJP KJK ! J NJ IPJ K% JK% KJ IK J JOKLKJK K% N J1 PIK J JI J MIKKAKJ I I N J JR K KLKJ%RRK KJIJ K **+ ! IJ NINKJ IK/K K LI P KIPK K JRIJJ PI J /KPKJMI KKLKJK L NI JJ IKI KJ LNI L N IKJJ NK PI NI L N IL I I IJ JK K II L #K JP8 IK NJ I N IK%'%KN %" N IK5"6%1 J'I JI K I IJ 51'6% NJ I' NJNI JI J I IJ 5' 6% LKN K ' N IL% L "KQNIJI J1 ' KJIJRJ-7<IJKI% R LKN J3< *** &JIKN I'NII J L IKJK KJP K NJK #K JP JP JL J1 ! PJ LKJ N IL PIKI JJ JKJ NINKJ IK JI NKJIKR I KJ JLJ J K NJ IKN L JN NKJ I J JKRIK KJIJJJ NIKJIJL I KIIK J % R J N JKKNKK **1 NJNII K *&1!" <! 9-&!" ' (# +-
Financial Performance IFS Revenue $B IFS Operating Income (Loss) $B $1.0 $0.5 $0.3 $(0.3) $(0.5) 2023 2022 2021 2023 2022 2021 Revenue and Operating Income (Loss) Summary 2023 vs. 2022 Revenue was $952 million, up $483 million from 2022, driven by higher packaging revenue. We had an operating loss of $482 million, compared to an operating loss of $281 million from 2022, primarily due to increased spending to drive strategic growth. 2022 vs. 2021 Revenue was $469 million, up $122 million from 2021, primarily driven by higher sales of multi-beam mask writer tools. We had an operating loss of $281 million, compared to operating income of $76 million in 2021, primarily due to increased spending to drive strategic growth. intel. MD&A 36 $I I P N;) IJ 50 KK6;) %7 %7 %7 **+ *** ** %7 %7 %7 **+ *** ** P N IJ 50 KK6NIL **+PK *** P NRK;7-* %N;12+ I ***%IP LI IP N ! IJ KK ;12* % IJ IJ KK ;*2 I ***%II LNJ IKK J IPKJIJI RJ ***PK ** P NRK;137 %N;** I **%II LIP LIK K N J KRIJIJ K ! IJ KK ;*2 % IJ IJ ;.3 **%II LNJ IKK J IPKJIJ I RJ ' (# +3
Consolidated Results of Operations For additional key highlights of our results of operations, see "A Year in Review." Years Ended (In Millions, Except Per Share Amounts) December 30, 2023 December 31, 2022 December 25, 2021 Amount % of Net Revenue Amount % of Net Revenue Amount % of Net Revenue Net revenue $ 54,228 100.0 % $ 63,054 100.0 % $ 79,024 100.0 % Cost of sales 32,517 60.0 % 36,188 57.4 % 35,209 44.6 % Gross margin 21,711 40.0 % 26,866 42.6 % 43,815 55.4 % Research and development 16,046 29.6 % 17,528 27.8 % 15,190 19.2 % Marketing, general, and administrative 5,634 10.4 % 7,002 11.1 % 6,543 8.3 % Restructuring and other charges (62) (0.1)% 2 - % 2,626 3.3 % Operating income 93 0.2 % 2,334 3.7 % 19,456 24.6 % Gains (losses) on equity investments, net 40 0.1 % 4,268 6.8 % 2,729 3.5 % Interest and other, net 629 1.2 % 1,166 1.8 % (482) (0.6)% Income before taxes 762 1.4 % 7,768 12.3 % 21,703 27.5 % Provision for (benefit from) taxes (913) (1.7)% (249) (0.4)% 1,835 2.3 % Net income 1,675 3.1 % 8,017 12.7 % 19,868 25.1 % Less: Net income (loss) attributable to non- controlling interests (14) - % 3 - % - Net income attributable to Intel $ 1,689 3.1 % $ 8,014 12.7 % $ 19,868 25.1 % Earnings per share attributable to Intel- diluted $ 0.40 $ 1.94 $ 4.86 intel. MD&A 37 K J KN JK IJ K IJ L JK NIIKN JK IJ K%KE#,I PR E F:/803;:; 32==2630EC:H5 :81/8: <6>350 :C:<?:8 :C:<?:8 :C:<?:8 <6>35 &6B:5 :A:3>: <6>35 &6B:5 :A:3>: <6>35 &6B:5 :A:3>: :58:A:3>: % $ 7& % ! 7& % " 7& KJ K K +*%-. 3 < +3%22 -. 1< +-%*7 11 3< 8600</8423 " 7& !$!! 7!& $ 7& KI P J 3%13 *7 3< .%-*2 *. 2< -%7 7 *< 'IJ % I % KJIJP -%3+1 1< .%* < 3%-1+ 2 +< KJINJNI JIIK 53*6 5 6< * Z< *%3*3 + +< H:8/523423C6<: 7& 7"& ! 7!& " K5 KKK6 QNJL PKJ JK% J 1 < 1%*32 3 2< *%.*7 + -< JIKJ JI% J 3*7 *< %33 2< 512*6 5 36< 3C6<:?:B68:5/E:0 "! 7& ""!$ 7 & " "7& $I PK I5 JI 6JMK 57+6 5 .6< 5*176 5 16< %2+- * +< :523C6<: !" 7& $" 7"& $!$ 7& 0KK9&J 5 KK6JJI NJ J JI JIKJK 516 Z< + Z< Z Z< :523C6<:/5582?>5/?=:5635:= % !$ 7& % $ 7"& % $!$ 7& /832340H:801/8:/5582?>5/?=:5635:=I ;2=>5:; % 7 % 7 % 7$! ' (# +.
Revenue Segment Revenue Walk $B $79.0 I . 0.7 0.5 0.1 $63.1 0.2 0.5 $54.2 (9.3) (3.3) (4.7) (2.5) (3.9) (2.6) (0.4) 2021 CCG DCAI NEX MBLY IFS Other 2022 CCG DCAI NEX MBLY IFS Other 2023 2023 vs. 2022 2023 revenue was $54.2 billion, down $8.8 billion, or 14%, from 2022. CCG revenue decreased 8% from 2022 primarily due to lower notebook and desktop volume driven by lower demand across market segments, partially offset by increased volume in the second half of the year as customer inventory levels normalized compared to higher levels in the first half. Notebook ASPs decreased due to the relative strength in the education market segment resulting in a higher mix of small core products combined with a higher mix of older generation products, and were partially offset by higher desktop ASPs due to an increased mix of product sales to the commercial and gaming market segments. DCAI revenue decreased 20% from 2022 due to lower server volume resulting from a softening CPU data center market, which was partially offset by higher server ASPs from a lower mix of hyperscale customer-related revenue and a higher mix of high core count products. NEX revenue decreased 31% from 2022 as customers tempered purchases to reduce existing inventories and adjust to a lower demand environment across product lines. Incentives offered to certain customers to accelerate purchases and to strategically position our products with customers for market segment share purposes, contributed approximately $700 million to our revenue during Q4 2023, the impacts of which were contemplated in our financial guidance for Q1 2024, as included in our Form 8-K dated January 25, 2024. 2022 vs. 2021 2022 revenue was $63.1 billion, down $16.0 billion, or 20%, from 2021. CCG revenue was down 23% from 2021 due to lower notebook and desktop volume in the consumer and education market segments, and lower revenue due to the continued ramp down from the exit of our 5G smartphone modem business and lower demand for our wireless and connectivity products. Notebook volume decreased, driven by lower demand in the consumer and education market segments, while ASPs increased due to the resulting product mix. Desktop volume decreased, driven by lower demand in the consumer and education market segments while ASPs increased due to an increased mix of commercial products. DCAI revenue decreased 15% from 2021 due to lower server demand from enterprise customers, and due to customers tempering purchases to reduce existing inventories in a softening data center market. The decrease was partially offset by higher revenue from our FPGA business. Server ASPs decreased due to customer and product mix. NEX revenue increased 10% from 2021, driven by higher Ethernet ASPs and increased demand for 5G products, partially offset by lower demand for Network Xeon. Mobileye revenue increased 35% from 2021, primarily driven by higher demand for EyeQ products and Mobileye Supervision systems. The decrease in our "all other" revenue was due to revenue from the divested NAND memory business of $4.3 billion recognized in 2021, for which historical results are recorded in "all other," and $584 million of revenue recognized in 2021 from a prepaid customer supply agreement. Incentives offered to certain customers to accelerate purchases and to strategically position our products with customers for market segment share purposes, particularly in CCG, contributed approximately $1.7 billion to our revenue during Q4 2022. intel. MD&A 38 P N J P N! ;) %"7 7 7 7" 7 7 7" 7 7 7! 7 7 7 %! 7 %7 ** " # & = ')0, JI *** " # & = ')0, JI **+ **+PK *** **+IP NRK;-1 * % R ;2 2 % I1<%I *** "IP NIK2<I ***II LNJ RI J KJ P NIP L RI I KKIJK JK%IJ L KJ L IKP N JK JLIKNKJ I P J IL P K I O IJ I P K JIKJ & J #$KIKNJ JI JP KJI J JNJ IJK JIKN J IM K II NJK RJIM I IJ I NJK% RIIJ L KJ LIKJ #$KNJ IKM I NJK KJ J I IJK JK # IP NIK*<I ***NJ RIKIPIP NIKN J I K J $1J JI IJ%RRKIJ L KJ LIKIPI#$KI RIM LIK NKJ II JIP N IM I N JI NJK & =IP NIK+<I ***KNKJ IKJINIKKJ INMKJ P J IK 8NKJJ RI PI JI KKI NJ K JPK IJ IJ NKJ IKJ IJNIKK J KJIJ L KJ NII NJKRJNKJ IK IIJ K JKINI KK% JI NJI MJ L;. J NIIP NNI 41**+%JJK RRI J J NI N I4**1%K N NI I2J@ NIL*-%**1 ***PK ** ***IP NRK;3+ % R ;3 % I*<%I ** "IP NRK R *+<I **NJ RI J KJ P N J KNI NJ IJK JK% RIIP NNJ J J NI R I JMJ NI-"KIJ NK KK RI I NIRI KK JPJLI NJK & J P NIK% IP L RI J KNI NJ IJK JK%R #$K IKNJ JIKN J I NJM KJ P NIK%IP L RI J KNI NJ IJK JKR #$K IKNJ IKM I I NJK # IP NIK-<I **NJ RIKIPI I JIIKNKJ IK% NJ NKJ IKJI NIKKJ INMKJ P J IK K J J JIIJ IKRKIJ L KJ LIIP NI NI$"# NK KK IPI#$KIKNJ NKJ I I NJM & =IP N IK <I **%IP LI JI J#$K IK I-"I NJK%IJ L KJ L RI I&JR I = ' LIP N IK+-<I **%II LIP LI I L4I NJK ' LNIPK KLKJK IK NIE JIEIP NRKNJ IP NI JPKJ&#& IL NK KK ;1 + I O **% IRKJ I IKN JKII I ] JI%^ ;-21 IP NI O **I INKJ I KN LI J JPK IJ IJ NKJ IKJ IJNIKK J KJIJ L KJ NII NJKRJNKJ IK IIJ K JKINI KK%IJN I L "% JI NJI MJ L; . J NIIP NNI 41*** ' (# +2
Gross Margin We derived most of our overall gross margin in 2023 from the sale of products in the CCG and DCAI operating segments. Our overall gross margin dollars in 2023 decreased by $5.2 billion, or 19%, compared to 2022, and in 2022 decreased by $16.9 billion, or 39%, compared to 2021. Gross Margin $B (Percentages in chart indicate gross margin as a percentage of total revenue) $43.8 $21.7 $26.9 li 40.0% 2023 2022 2021 (In Millions) $ 21,711 2023 Gross Margin (2,709) Lower product margin primarily due to lower server revenue (1,832) Lower product margin driven by lower revenue across NEX product lines (1,704) Lower product margin primarily from lower notebook and desktop revenue (1,654) Higher unit cost primarily from increased mix of Intel 7 products (411) Higher period charges related to excess capacity charges 1,973 Lower period charges driven by the sell-through of previously reserved inventory and lower reserves taken in 2023 788 Lower period charges primarily driven by a decrease in product ramp costs 723 Absence of the inventory impairment charge taken in 2022 related to the wind down of our Intel Optane memory business 204 Absence of corporate charges from a patent settlement in 2022 (533) Other $ 26,866 2022 Gross Margin (4,717) Lower product margin primarily from lower notebook and desktop revenue (3,325) Lower product margin primarily due to lower server revenue (2,651) Higher unit cost primarily from increased mix of Intel 7 products and 10nm SuperFin (2,090) Higher period charges primarily driven by inventory reserves taken in 2022 (1,995) Lower gross margin related to the divested NAND memory business (2,148) Higher period charges primarily associated with the ramp up of Intel 4 and other product enhancements (723) Inventory impairment related to the wind down of our Intel Optane memory business (584) Lack of revenue recognized in Q1 2021 from a prepaid customer supply agreement (423) Higher period charges due to excess capacity charges (313) Higher stock-based compensation (204) Corporate charges from patent settlement Lower period charges due to a benefit related to insurance proceeds received for business interruption and property 484 damage that occurred in 2020 522 Higher product margin from NEX Ethernet revenue 785 Higher product margin from DCAI other product revenue 433 Other $ 43,815 2021 Gross Margin intel. MD&A 39 "I KK'I !IP KJ NI PI I KKI **+I JK I NJK J" # IJ K JK NI PI I KKI IK **+IK L;- * % I7<% IJ ***% ***IK L;3 7 % I+7<% IJ ** "I KK'I ;) 5$I JK IJ JI KKI KI J J J IP N6 %7" %!7 % 7$ 7& 7!& 7& **+ *** ** 32==2630 % " 8600/8423 5*%.76 0 RII NJI II LNJ RIKIPIIP N 5%2+*6 0 RII NJI IP L RIIP NI KK& =I NJ K 5%.16 0 RII NJI II LI RI J KJ IP N 5%3-16 >IN J KJII LI IKM J .I NJK 516 >II IKI JJ MKKJLIK %7.+ 0 RII IKIP LJK JI N IP NK LIKIP P J IL RIIKIPKJ **+ .22 0 RII IKII LIP LIK I NJI KJK .*+ # K J P J ILI JIJ ***I JJ JR R NI J J IL NK KK *1 # K I IJIKI J JKJJ J *** 5-++6 JI % !$!! 8600/8423 51%..6 0 RII NJI II LI RI J KJ IP N 5+%+*-6 0 RII NJI II LNJ RIKIPIIP N 5*%3-6 >IN J KJII LI IKM J .I NJK NI 5*%76 >II IKII LIP L P J ILIKIPKJ *** 5%77-6 0 RII KKI I JJ JPKJ&#& IL NK KK 5*%126 >II IKII LKK JRJJIN J 1 JII NJ JK 5.*+6 P J ILI JI JJ JR R NI J J IL NK KK 5-216 0 IP NI O 4**I INKJ IKN LI J 51*+6 >II IKNJ MKKJLIK 5++6 >IKJ K KJ 5*16 I IJIKI J JKJJ J 121 0 RII IKNJ JI JJ KNI I KIP I NK KK JIINJ I IJL JJ NII ** -** >II NJI I & = JI JIP N .2- >II NJI I # JII NJIP N 1++ JI % $ 8600/8423 ' (# +7
We are making capital investments in furtherance of our IDM 2.0 strategy. As of December 30, 2023, our capital investments classified as construction in progress totaled $43.4 billion ($36.7 billion as of December 31, 2022). These assets have not yet been placed into service and have not yet begun depreciating. As these construction-in-progress assets are placed into service, we expect to incur depreciation expense that impacts future production costs and, ultimately, cost of sales. To the extent we are unable to grow our revenues to offset these production costs, our gross margin and operating income will be unfavorably affected. Additionally, we could incur asset impairments on property, plant, and equipment assets if our IDM 2.0 strategy is not successful. Effective January 2023, we increased the estimated useful life of certain production machinery and equipment from 5 to 8 years. When compared to the estimated useful life in place as of the end of 2022, we estimate total depreciation expense in 2023 was reduced by $4.2 billion. We estimate this change resulted in an approximately $2.5 billion increase to gross margin, $400 million decrease in R&D expenses, and $1.3 billion decrease in ending inventory values. These estimates are based on the assets in use and under construction as of the beginning of 2023 and are calculated at that point in time. Most of the depreciation expense associated with this useful life change is included in overhead cost pools and is combined with other costs and other depreciation expense from assets placed into service after this calculation was performed, for which such costs are subsequently absorbed into inventory as each product passes through our manufacturing process. As a result, the actual amount of impact from the useful life change that is included in our 2023 operating results and financial position is impractical to individually and specifically quantify on a year-over-year basis. Operating Expenses Total R&D and MG&A expenses for 2023 were $21.7 billion, down 12% compared to 2022. These expenses represent 40.0% of revenue for 2023 and 38.9% of revenue for 2022. In support of our strategy, we continue to make significant investments to accelerate our process technology roadmap. This requires increased investments in R&D and focused efforts to attract and retain talent. We have implemented certain cost-cutting measures while we continue to improve our product execution. Research and Development $B Marketing, General, and Administrative $B (Percentages indicate expenses as a percentage of total revenue) $16.1 $17.5 $15.2 29.6% 27.8% $7.0 $6.5 19.2% $5.6 10.4% 11.1% 2023 2022 2021 2023 2022 2021 Research and Development 2023 vs. 2022 R&D decreased by $1.5 billion, or 8%, driven by the following: - The effects of various cost-cutting measures + Higher incentive-based cash compensation 2022 vs. 2021 R&D spending increased by $2.3 billion, or 15%, driven by the following: Investments in our process technology + Increase in corporate spending + Investments in leadership products Incentive-based cash compensation Marketing, General, and Administrative 2023 vs. 2022 MG&A decreased by $1.4 billion, or 20%, driven by the following: - Lower corporate spending as a result of various cost-cutting measures + Higher incentive-based cash compensation 2022 vs. 2021 MG&A spending increased by $459 million, or 7%, driven by the following: + Increase in corporate spending - Incentive-based cash compensation intel. MD&A 40 !I J PKJ JK NIJI NI '* KJIJL #K I+%**+% NIJ PKJ JK KKK KJINJ I IKKJ J ;1+ 1 5;+3 . K I+%***6 KKKJKP JLJ J KIP P JLJ N IJ #KJK KJINJ I IKKKKJKI J KIP%RMJJ NIIJ M KJJJKNJNII NJ KJK %N JJ L% KJ K K JMJ JRIN J I R NIIP NKJ KJ JKI NJ KJK% NII KKI IJ R N P I LJ #J L%R N NIKKJ I JK I IJL% J% QN JKKJK NI '* KJIJLK JKNKKN JP@ NIL**+%R IKJKJJNKN IJ I NJ IL QN JI -J 2LIK ! IJ JKJJNKN K J ***%RKJJJ J IJ M K **+RKIN L ;1 * !KJJJK IKN J I MJ L;* - IKJ I KKI %;1 IK ( M KK% ; + IK P J ILP NK KKJJKI K JKKJK NK N I KJINJ K J **+ I N JJJJ J J ' KJ JIJ M KKK JRJJKNKN K N PI KJ K K RJ JI KJK JIIJ M KI KKJK J KIPJIJK N J RKI I% IRKN KJKIKN KQN J L K I J P J ILKI NJKKK JI N NI NJNI I KK #KIKN J%JJN N J JI JNKN JJK N NI**+ IJ IKN JK KJ KIJ J PN L K LQN JL LI PILI KK IJ M KK J ( '"(#M KK I**+RI;* . % R *< IJ *** KM KKIIK J1 < IP N I**+ +2 7< IP N I*** KN IJ NIKJIJL%R J NJ K J PKJ JKJ IJ NII KK J LI KIQNIK IK PKJ JK ( NK IJKJ JJIJ IJ J J !P J IJ KJNJJ KNIKR R J NJ I P NII NJMNJ KI P J;) 'IJ %" I % # KJIJP;) 5$I JK JM KKKI J J J IP N6 %!7 %"7 %7 7!& "7$& 7& **+ *** ** %7! %"7 %!7 7& 7& $7 & **+ *** ** KI P J **+PK *** ( IK L; - % I2<%IP LJ R 9 JK PI NK KJNJJ KNIK ' >I JP KK KJ ***PK ** ( K IK L;* + % I-<%IP LJ R 9 ' PKJ JK NII KKJ L ' IK I IJK ' PKJ JK IKI NJK JP KK KJ 'IJ %" I % # KJIJP **+PK *** '"(#IK L; 1 % I*<%IP LJ R 9 0 RI I IJK KIKN J PI NK KJNJJ KNIK ' >I JP KK KJ ***PK ** '"(#K IK L;1-7 % I.<%IP LJ R 9 ' IK I IJK JP KK KJ ' (# 1
Restructuring and Other Charges Years Ended (In Millions) Dec 30, 2023 Dec 31, 2022 Dec 25, 2021 Employee severance and benefit arrangements $ 222 $ 1,038 $ 48 Litigation charges and other (329) (1,187) 2,291 Asset impairment charges 45 151 287 Total restructuring and other charges $ (62) $ 2 $ 2,626 The 2022 Restructuring Program was approved to rebalance our workforce and operations and to create efficiencies and improve our product execution in alignment with our strategy. In 2023, activity related to the 2022 Restructuring Program consisted of cash settlements of previously accrued employee severance and benefit arrangements, as well as incremental accruals throughout the year and was substantially complete as of December 30, 2023. The 2022 Restructuring Plan, in conjunction with other initiatives, reduced our cost structure and allowed us to reinvest certain of these cost savings in resources and capacity to develop, manufacture, market, sell, and deliver our products in furtherance of our strategy. The cumulative cost of the 2022 Restructuring Program as of December 30, 2023 was $1.3 billion. Litigation charges and other includes a $1.2 billion benefit in 2023 due to a reduction in the previously accrued $2.2 billion charge as a result of developments in the VLSI litigation in Q4 2023. 2023 charges also include a $401 million charge for an EC-imposed fine. In 2009, we recorded and paid an EC-imposed fine that was subsequently annulled, resulting in a benefit of $1.2 billion in 2022. Also in 2023, we mutually agreed with Tower to terminate the acquisition agreement that was entered into during 2022 and, as a result, we paid a $353 million termination fee to Tower in accordance with the terms of the agreement Gains (Losses) on Equity Investments and Interest and Other, Net Years Ended (In Millions) Dec 30, 2023 Dec 31, 2022 Dec 25, 2021 Ongoing mark-to-market adjustments on marketable equity securities $ (36) $ (787) $ (130) Observable price adjustments on non-marketable equity securities 17 299 750 Impairment charges (214) (190) (154) Sale of equity investments and other 273 4,946 2,263 Gains (losses) on equity investments, net $ 40 $ 4,268 $ 2,729 Interest and other, net $ 629 $ 1,166 $ (482) Gains (Losses) on Equity Investments, Net Ongoing mark-to-market adjustments recognized in 2023, 2022, and 2021 were primarily driven by our investment in Montage Technology, Co. Ltd. (Montage). In 2023, we recognized $243 million of initial fair value adjustments in sale of equity investments and other related to the public market offerings of four of our portfolio companies; in 2022, we recognized $278 million of initial fair value adjustments related to the public market offerings of five of our portfolio companies; and in 2021, we recognized $447 million related to the public market offerings of four of our portfolio companies. In 2022, the sale of McAfee Corp. (McAfee) consumer business was completed, and we received $4.6 billion in cash for the sale of our remaining share of McAfee, recognizing a $4.6 billion gain in sale of equity investments and other. In 2021, we recognized McAfee dividends of $1.3 billion, which included a special dividend of $1.1 billion paid in connection with the sale of McAfee's enterprise business, and recognized $228 million related to the partial sale of our investment in McAfee. In 2021, we recognized $471 million in observable price adjustments related to our investment in Beijing Unisoc Technology Ltd. Interest and Other, Net In 2022, we recognized a gain of $1.0 billion from the first closing of the divestiture of our NAND memory business. intel. MD&A 41 KJINJNI JIIK F:/803;:;32==2630 :C :C :C LKPI JII JK ; *** ; %+2 ; 12 0JJ IK JI 5+*76 5%2.6 *%*7 #KKJI JIK 1- - *2. 65/=8:058>C5>8234/3;651:8C1/84:0 % ! % % !! *** KJINJNI $I IRKI PJ I NIR I I IJ K J IJ K I P NI I NJMNJ JRJ NIKJIJL **+%JPJLI JJ J*** KJINJNI $I I KKJ KKJJ JK IP NK LIN LKPI JII JK%KR K I J IN KJI N NJJLI RK KN KJ J L JK I+%**+ *** KJINJNI $ % 8N J RJ JI JJPK%IN NI KJ KJINJNI RNKJ I PKJIJ JK KJKP K IK NIK JLJ P % NJNI%IJ%K % PI NII NJK NIJI NIKJIJL NN JP KJ J*** KJINJNI $I IK I+%**+RK ; + K# #'$ #& "2$!' 6$ 9& 2 ! NK; * J **+NJ INJ JIP NK LIN;* * IK IKN J P JK J?0 JJ 41**+ **+IK K N;1 I I K *7% RI I K JJRKKN KQN J L N %IKN J J ; * *** # K **+%R NJN LIRJ RIJ JI JJQNKJ I JJJRK JI J NI *** %KIKN J%R;+-+ JI J J RI I RJJJIK JI J " K50 KKK6 QNJL PKJ JK JIKJ JI%&J F:/803;:;32==2630 :C :C :C IJ IJ8NKJ JK IJ QNJLKNIJK ; 5+36 ; 5.2.6 ; 5+6 KIP I8NKJ JK IJ QNJLKNIJK . *77 .- I JIK 5*16 576 5-16 QNJL PKJ JK JI *.+ 1%713 *%*3+ /230=600:0 63:J>25D23A:05<:3503:5 % % !$ % " 35:8:05/3;651:83:5 % ! % !! % $ " K50 KKK6 QNJL PKJ JK%&J IJ IJ8NKJ JKI O **+%***% **RIII LIP L NI PKJ J ' J L% 0J 5' J6 **+%RI O;*1+ J IP N8NKJ JK 6$ &? G1# C# , 6 ) 6$ 9& 2 !I JJ JN IJ I K NI NI IJ K: ***%RI O;*.2 J IP N8NKJ JKI JJ JN IJ I K P NI IJ K: **%RI O;11. I JJ JN IJ I K NI NI IJ K ***%JK '# I 5'#6 KNI NK KKRK J% RIP;1 3 K IJK NI I KI '#%I O ;1 3 6$ &? G1# C# , 6 ) 6$ 9& 2 ! **%RI O'# P K ; + %R NK P ; J RJJK '#/K JIIK NK KK% I O;**2 I JJ JIJ K NI PKJ J '# **%RI O;1. 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Provision for (Benefit from) Taxes Years Ended (In Millions) Dec 30, 2023 Dec 31, 2022 Dec 25, 2021 Income before taxes 762 $ 7,768 $ 21,703 Provision for (benefit from) taxes (913) $ (249) $ 1,835 Effective tax rate (119.8)% (3.2)% 8.5 % Our effective tax rate decreased in 2023 compared to 2022, primarily driven by our R&D tax credits, which provide a tax benefit based on our eligible R&D spending and are not dependent on lower income before taxes, and a higher proportion of our income being taxed in non-US jurisdictions. Our benefit from income taxes increased in 2023 compared to 2022 primarily due to a higher proportion of our income being taxed in non-US jurisdictions. The 2023 shift in income was attributable to the 2022 tax costs associated with the gains recognized from the equity sale of McAfee and the divestiture of our NAND memory business. Our effective tax rate decreased in 2022 compared to 2021, primarily driven by a higher proportion of our income being taxed in non-US jurisdictions and a change in tax law from 2017 Tax Reform related to the capitalization of R&D expenses that went into effect in January 2022. In 2022 we recognized a benefit from taxes as compared to a provision for taxes in 2021 as the higher proportion of our income being taxed in non-US jurisdictions and the change in tax law from 2017 Tax Reform were only partially offset by the tax costs associated with the gains recognized from the equity sale of McAfee and the divestiture of our NAND memory business. In 2021 the OECD announced an Inclusive Framework on Base Erosion and Profit Shifting including Pillar Two Model Rules defining the global minimum tax, which calls for the taxation of large multinational corporations at a minimum rate of 15%. Subsequently multiple sets of administrative guidance have been issued. Many non-US tax jurisdictions have either recently enacted legislation to adopt certain components of the Pillar Two Model Rules beginning in 2024 (including the European Union Member States) with the adoption of additional components in later years or announced their plans to enact legislation in future years. We are continuing to evaluate the impacts of enacted legislation and pending legislation to enact Pillar Two Model Rules in the non-US tax jurisdictions we operate in. Liquidity and Capital Resources We believe we have sufficient sources of funding to meet our business requirements for the next 12 months and in the longer term. Cash generated by operations, supplemented by our total cash and investments', is our primary source of liquidity for funding our strategic business requirements. These sources are further supplemented by our committed credit facilities and other borrowing capacity and certain other Smart Capital initiatives that we have undertaken. Our short-term funding requirements include capital expenditures for worldwide manufacturing and assembly and test, including investments in our process technology roadmap; working capital requirements; and potential and pending acquisitions, strategic investments, and dividends. Our long-term funding requirements incrementally contemplate investments in significant manufacturing expansion plans and investments to accelerate our process technology. These plans include expanding existing operations in Arizona, Ireland, Israel, New Mexico, and Oregon, and investing in new leading-edge manufacturing facilities in Germany and Ohio. We also expect to continue to benefit from government incentives and any incentives above our current expectations would enable us to increase the pace and size of our investments. Conversely, incentives below our expectations would increase our anticipated cash requirements. We expect our planned capital investments to continue to put pressure on our adjusted free cash flow in the short term. As we invest in multiple expansions, we expect our capital expenditures to continue to be higher than historical levels for the next several years. We expect to adjust the cadence of our investments based on the execution of our roadmap and changing business conditions. As of December 30, 2023, we had commitments for capital expenditures of $20.4 billion for 2024 and had $7.1 billion in capital expenditures committed in the long term. As of December 30, 2023, other purchase obligations and commitments in 2024 under our binding commitments for purchases of goods and services were $2.7 billion, with an additional $5.6 billion committed in the long term. We have additional obligations as part of our ordinary course of business, beyond those committed for capital expenditures and other purchase obligations and commitments for purchases of goods and services. For example, see "Note 19: Commitments and Contingencies" within the Notes to Consolidated Financial Statements for information about our lease obligations, which include supply agreements structured as leases; "Note 8: Income Taxes" within the Notes to Consolidated Financial Statements for information about our tax obligations, including impacts from Tax Reform enacted in 2017 for the one-time transition tax on previously untaxed foreign earnings; and "Note 13: Borrowings" within the Notes to Consolidated Financial Statements for information about our debt obligations. The expected timing of payments of our obligations is estimated based on current information. Timing of payments and actual amounts paid may be different, depending on the timing of receipt of goods or services, or changes to agreed-upon amounts for some obligations. In addition, some of our purchasing requirements are not current obligations and are therefore not included in the amounts above. For example, some of these requirements are not handled through binding contracts or are fulfilled by vendors on a purchase order basis within short time horizons. intel. 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When assessing our current sources of liquidity, we include our total cash and investments' as follows: (In Millions) Dec 30, 2023 Dec 31, 2022 Cash and cash equivalents $ 7,079 $ 11,144 Short-term investments 17,955 17,194 Loans receivable and other 5 463 Total cash and investments' $ 25,039 $ 28,801 Total debt $ 49,266 $ 42,051 I See "Non-GAAP Financial Measures" within MD&A. We maintain a diverse investment portfolio that we continually analyze based on issuer, industry, and country. Substantially all of our investments in debt instruments are in investment-grade securities. Our sources of liquidity in 2023 included $1.5 billion from partner contributions, net proceeds of $1.6 billion from a secondary offering of Mobileye Class A common stock, $1.4 billion of cash proceeds from the sale of minority stakes in our IMS business to both Bain Capital and TSMC, and government incentives of $1.0 billion. Other potential sources of liquidity include our commercial paper program and our automatic shelf registration statement on file with the SEC, pursuant to which we may offer an unspecified amount of debt, equity, other securities, and non-recourse factoring arrangements with third-party financial institutions. Under our commercial paper program, we have an ongoing authorization from our Board of Directors to borrow up to $10.0 billion and, as of December 30, 2023, we had no commercial paper obligations outstanding. During 2023, we issued a total of $11.0 billion aggregate principal amount of senior notes for general corporate purposes, including, but not limited to, refinancing our outstanding debt and funding for working capital and capital expenditures. We also amended both our five-year $5.0 billion variable-rate revolving credit facility agreement, extending that maturity date by one year to March 2028, and our 364-day $5.0 billion credit facility agreement, extending the maturity date to March 2024. As of December 30, 2023, we had no borrowings outstanding on the revolving credit facilities. In Q1 2023, we declared a reduced quarterly dividend on our common stock. This dividend reduction reflects our deliberate approach to capital allocation, is expected to support the critical investments needed to execute our business strategy, and is designed to position us to create long-term value. In January 2024, our Board of Directors declared a quarterly dividend of $0.125 per share on the company's common stock, which will be payable on March 1, 2024 to stockholders of record as of February 7, 2024. Future declarations of dividends and the establishment of future record and payment dates are subject to the final determination of our Board of Directors. Our cash and investments and related cash flows may be affected by certain discretionary actions we may take with customers and suppliers to accelerate or delay certain cash receipts or payments to manage liquidity, among other factors, for our strategic business requirements. In 2023 these actions included, among others, negotiating with suppliers to optimize our payment terms and conditions, adjusting the amounts and timing of cash flows associated with customer sales programs and collections, managing inventory levels and purchasing practices, and selling certain of our accounts receivable on a non-recourse basis to third-party financial institutions. While such actions have benefited, and may further benefit, cash flow in the near term, we may experience a corresponding detriment to cash flow in future periods as these actions cease or as the impacts of these actions reverse or normalize. Our cash flows for each period were as follows: Years Ended (In Millions) Dec 30, 2023 Dec 31, 2022 Dec 25, 2021 Net cash provided by operating activities $ 11,471 $ 15,433 $ 29,456 Net cash used for investing activities (24,041) (10,231) (24,283) Net cash provided by (used for) financing activities 8,505 1,115 (6,211) Net increase (decrease) in cash and cash equivalents $ (4,065) $ 6,317 $ (1,038) Operating Activities Cash provided by operating activities is net income adjusted for certain non-cash items and changes in assets and liabilities. For 2023 compared to 2022, the $4.0 billion decrease in cash provided by operating activities was primarily driven by lower 2023 net income after adjusting for non-cash items, partially offset by 2023 cash-favorable working capital changes compared to 2022. For 2022 compared to 2021, the $14.0 billion decrease in cash provided by operating activities was primarily driven by lower 2022 net income after adjusting for non-cash items, including the gain on the sale of McAfee and the pre-tax gain from the divestiture of our NAND business, partially offset by 2022 cash-favorable working capital changes compared to 2021. Intel. MD&A 43 ! KKKK NINII JK NIK QNJL%R N NIJ J K PKJ JKK RK9 32==2630 :C :C /01/3;C/01:J>2A/=:350 % "" % IJJI PKJ JK .%7-- .%71 0 KIP JI - 13+ 65/=C/01/3;23A:05<:350 % % $$ 65/=;:?5 % !! % * /& 0;-# $ "#$ 7 $61! 6B# 2# 7 ! 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Investing Activities Investing cash flows consist primarily of capital expenditures; investment purchases, sales, maturities, and disposals; proceeds from capital-related government incentives; and proceeds from divestitures. Our capital expenditures were $25.8 billion in 2023 ($24.8 billion in 2022 and $18.7 billion in 2021). The increase in cash used for investing activities in 2023 compared to 2022 was primarily due to a lack of proceeds from the divestiture of our NAND business and from the sale of our remaining McAfee share that occurred in 2022, lower maturities and sales of short-term investments, and increased capital expenditures. These unfavorable cash flow impacts during 2023 were partially offset by higher 2023 proceeds from capital-related government incentives and by other cash favorable investment activities, including lower acquisitions during 2023. The decrease in cash used for investing activities in 2022 compared to 2021 was primarily due to increased maturities and sales of short- term investments, proceeds from the divestiture of our NAND business, and proceeds from the sale of our remaining share of McAfee, partially offset by an increase in capital expenditures. Financing Activities Financing cash flows consist primarily of payment of dividends to stockholders, issuance and repayment of short-term and long-term debt, and proceeds from partner contributions and equity-related issuances. The increase in cash provided by financing activities in 2023 compared to 2022 was primarily due to higher debt issuances along with lower repayment of long-term debt, decreased dividend payments to stockholders, and increased proceeds from sales of subsidiary shares, partially offset by commercial paper issuances in 2022 that were subsequently repaid in 2023. Our total dividend payments were $3.1 billion in 2023, compared to $6.0 billion in 2022. We have paid a cash dividend in each of the past 125 quarters. Cash provided by financing activities in 2022 compared to cash used for financing activities in 2021 was primarily due to higher commercial paper and debt issuances, our 2022 curtailment of common stock repurchases, proceeds from the Mobileye IPO, and partner contributions for joint investments, partially offset by higher 2022 debt repayments. Critical Accounting Estimates The methods, assumptions, and estimates that we use in applying our accounting policies may require us to apply judgments regarding matters that are inherently uncertain. We consider an accounting policy to be a critical estimate if: (1) we must make assumptions that are uncertain when the judgment is made, and (2) changes in the estimate assumptions, or selection of a different estimate methodology, could have a significant impact on our financial position and the results that we report in our Consolidated Financial Statements. While we believe that our estimates, assumptions, and judgments are reasonable, they are based on information available when the estimate was made. Refer to "Note 2: Accounting Policies" within the Notes to Consolidated Financial Statements for further information on our critical accounting estimates, which are as follows, as well as our significant accounting policies: ■ Inventories—the transition of manufacturing costs to inventory, net of factory excess capacity costs. Inventory reflected at the lower of cost or net realizable value considering forecasted future demand and market conditions; ■ Long-lived assets—the valuation methods and assumptions used in assessing the impairment and evaluation of useful lives of property, plant, and equipment; identified intangibles; and impairment of goodwill, including the determination of asset groupings and the identification and allocation of goodwill to reporting units; and ■ Loss contingencies—the estimation of when a loss is probable and reasonably estimable. intel. MD&A 44 PKJ #JPJK PKJ K RK KKJII L J M JNIK: PKJ JNIKK%K K%JNIJK% K K K:I KI J I J PI J JPK: I KI PKJJNIK NIJ M JNIKRI;*- 2 **+5;*1 2 *** ;2 . **6 IK KNK I PKJ JPJK **+ IJ ***RKII LNJ I KI JPKJJNI NI&#& NK KK I JK NII '#KIJJ NII ***% RIJNIJK K K K IJJI PKJ JK% IKJ M JNIK KN P I K RJKNI **+RIIJ L KJ LI**+ I KI J I J PI J JPK L JIKP I PKJ JJPJK% N RIQNKJ KNI **+ IK KNK I PKJ JPJK *** IJ **RKII LNJ IKJNIJK K K K IJ JI PKJ JK%I KI JPKJJNI NI&#& NK KK% I KI JK NII KI '#% IJ L KJ L IK J M JNIK #JPJK K RK KKJII L L J P KJ KJ IK%KKN IL J K IJJI JI J% I KI IJ I JI NJ K QNJLI JKKN K IK KI P L JPJK **+ IJ ***RKII LNJ I JKKN K RJ RIIL J JI J%IKP L JKJ KJ IK% IKI KI K K KN KIL KIK%IJ L KJ L I IKKN K ***JJRIKN KQN J LI **+ NIJ J P L JKRI ;+ **+% IJ ;3 *** !PKP JKJ*-QNIJIK KI P L JPJK *** IJ KNK I JPJK **RKII LNJ I I I JKKN K% NI***NIJ J KJ INIKK%I KI J' L $% IJ I JI NJ K I8 J PKJ JK%IJ L KJ LI*** JIL JK IJ # N J KJJK J K%KKNJ K% KJJKJJRNK L NI N J KLIQNINKJ L8N JKII JJIKJJI I J LN IJ ! 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Non-GAAP Financial Measures In addition to disclosing financial results in accordance with US GAAP, this document contains references to the non-GAAP financial measures below. We believe these non-GAAP financial measures provide investors with useful supplemental information about our operating performance, enable comparison of financial trends and results between periods where certain items may vary independent of business performance, and allow for greater transparency with respect to key metrics used by management in operating our business and measuring our performance. These non-GAAP financial measures are used in our performance-based RSUs and our cash bonus plans. Our non-GAAP financial measures reflect adjustments based on one or more of the following items, as well as the related income tax effects. Beginning in 2023, income tax effects are calculated using a fixed long-term projected tax rate of 13% across all adjustments. We project this long-term non-GAAP tax rate on an annual basis using a five-year non-GAAP financial projection that excludes the income tax effects of each adjustment. The projected non-GAAP tax rate also considers factors such as our tax structure, our tax positions in various jurisdictions, and key legislation in significant jurisdictions where we operate. This long-term non-GAAP tax rate may be subject to change for a variety of reasons, including the rapidly evolving global tax environment, significant changes in our geographic earnings mix, or changes to our strategy or business operations. Management uses this non-GAAP tax rate in managing internal short- and long-term operating plans and in evaluating our performance; we believe this approach facilitates comparison of our operating results and provides useful evaluation of our current operating performance. Prior-period non-GAAP financial measures have been retroactively adjusted to reflect this updated approach. Our non-GAAP financial measures should not be considered a substitute for, or superior to, financial measures calculated in accordance with US GAAP, and the financial results calculated in accordance with US GAAP and reconciliations from these results should be carefully evaluated. Non-GAAP adjustment or measure Definition Usefulness to management and investors NAND memory business We completed the first closing of the divestiture of our NAND memory business to SK hynix on December 29, 2021 and fully deconsolidated our ongoing interests in the NAND OpCo Business in Q1 2022. We exclude the impact of our NAND memory business in certain non-GAAP measures. While the second closing of the sale is still pending and subject to closing conditions, we deconsolidated this business in Q1 2022 and management does not view the historical results of the business as a part of our core operations. We believe these adjustments provide investors with a useful view, through the eyes of management, of our core business model and how management currently evaluates core operational performance. In making these adjustments, we have not made any changes to our methods for measuring and calculating revenue or other financial statement amounts. Acquisition-related adjustments Amortization of acquisition-related intangible assets consists of amortization of intangible assets such as developed technology, brands, and customer relationships acquired in connection with business combinations. Charges related to the amortization of these intangibles are recorded within both cost of sales and MG&A in our US GAAP financial statements. Amortization charges are recorded over the estimated useful life of the related acquired intangible asset, and thus are generally recorded over multiple years. We exclude amortization charges for our acquisition- related intangible assets for purposes of calculating certain non-GAAP measures because these charges are inconsistent in size and are significantly impacted by the timing and valuation of our acquisitions. These adjustments facilitate a useful evaluation of our current operating performance and comparison to our past operating performance and provide investors with additional means to evaluate cost and expense trends. Share-based compensation Share-based compensation consists of charges related to our employee equity incentive plans. We exclude charges related to share-based compensation for purposes of calculating certain non- GAAP measures because we believe these adjustments provide better comparability to peer company results and because these charges are not viewed by management as part of our core operating performance. We believe these adjustments provide investors with a useful view, through the eyes of management, of our core business model, how management currently evaluates core operational performance, and additional means to evaluate expense trends, including in comparison to other peer companies. intel. MD&A 45 & "##$ 'KNIK J J K K IKN JK I RJ1"##$%JK N J J KII KJ J "##$ KNIK R ! PJK "##$ KNIKI P PKJ IKRJNKN KN J IJ NJ NI IJ I I % IK JI K IKN JK JR I KRIIJ JKLPIL J NK KKI I % R IIJIJI KI LRJIKJJ LJIKNK L J IJ NI NK KK KNI NII I K "##$ KNIKINK NII I K 1K NIK NK K NI "##$ KNIKI J8NKJ JK K I I J R JK%KR KJI J JM JK ) **+% JMJKI N JNK M JII 8JJMIJ +<I KK 8NKJ JK ! 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P JK8NKJ JKI P PKJ IKRJNKN PR% JI NJLK J% NI I NK KK R JNII J LP NJK I IJ I I JK8NKJ JK% RP J L KJ NIJ K I KNI N J IP N I JI KJJ J N JK #QNKJ I J 8NKJ JK # IJOJ QNKJ I J J KKJK KKJK IJOJ J KKJKKNK P J L% I K% NKJ I I J KKQNI J RJ NK KK J K IKI JJ J IJOJ JK J KII IRJ J KJ K K '"(# NI1"##$ KJJ JK # IJOJ IKII I PIJKJJ NKN JI JQNI J KKJ% JNKI I LI I PIN J LIK !M N IJOJ IK I NIQNKJ I J J KKJK INI KK N J IJ "##$KNIK NKJKIKI KKJ J KO IK J LJ LJ J P NJ NIQNKJ K K 8NKJ JK JJNKN P NJ NINII J IJ I I IK J NIKJ IJ I I I P PKJ IKRJ J KJ P NJ KJ M KJI K I K KJ I K KJ KKJK IKI J J NI LQNJL JP K !M NIKI JJ KI K KJ INI KK N J IJ "##$KNIK NKR PJK8NKJ JK I P JJI I JLJ I LIKN JK NKJKIKI JPR L J KIJ NI I IJ I I ! P JK8NKJ JKI P PKJ IKRJNKN PR% JI NJLK J% NI I NK KK % R JNII J LP NJK I IJ I I % J KJ P NJM KJI K% N IK J JII K 63 /;K>05<:3568 <:/0>8: :B2325263 0:B>=3:0056</3/4:<:35/3;23A:05680 ' (# 1-
Non-GAAP adjustment or measure Definition Usefulness to management and investors Patent settlement A portion of the charge from our IP settlements represents a catch-up of cumulative amortization that would have been incurred for the right to use the related patents in prior periods. This charge related to prior periods is excluded from our non-GAAP results; amortization related to the right to use the patents in the current and ongoing periods is included. We exclude the catch-up charge related to prior periods for purposes of calculating certain non-GAAP measures because this adjustment facilitates comparison to past operating results and provides a useful evaluation of our current operating performance. Optane inventory impairment A charge in 2022 as we initiated the wind-down of our Intel Optane memory business. We exclude these impairments for purposes of calculating certain non-GAAP measures because these charges do not reflect our current operating performance. This adjustment facilitates a useful evaluation of our current operating performance and comparisons to past operating results. Restructuring and other charges Restructuring charges are costs associated with a formal restructuring plan and are primarily related to employee severance and benefit arrangements. Other charges may include periodic goodwill and asset impairments, certain pension charges, and costs associated with restructuring activity. 2023 includes a benefit as a result of developments in the VLSI litigation in Q4 2023, an EC- imposed fine, and a fee related to the termination of our agreement to acquire Tower. 2022 includes a benefit related to the annulled EC fine and 2021 includes a charge related to the VLSI litigation. We exclude restructuring and other charges, including any adjustments to charges recorded in prior periods, for purposes of calculating certain non-GAAP measures because these costs do not reflect our core operating performance. These adjustments facilitate a useful evaluation of our core operating performance and comparisons to past operating results and provide investors with additional means to evaluate expense trends. (Gains) losses on equity investments, net (Gains) losses on equity investments, net consists of ongoing mark-to-market adjustments on marketable equity securities, observable price adjustments on non- marketable equity securities, related impairment charges, and the sale of equity investments and other. We exclude these non-operating gains and losses for purposes of calculating certain non-GAAP measures because it provides better comparability between periods. The exclusion reflects how management evaluates the core operations of the business. (Gains) losses from divestiture (Gains) losses are recognized at the close of a divestiture, or over a specified deferral period when deferred consideration is received at the time of closing. Based on our ongoing obligation under the NAND wafer manufacturing and sale agreement entered into in connection with the first closing of the sale of our NAND memory business on December 29, 2021, a portion of the initial closing consideration was deferred and will be recognized between first and second closing. We exclude gains or losses resulting from divestitures for purposes of calculating certain non-GAAP measures because they do not reflect our current operating performance. These adjustments facilitate a useful evaluation of our current operating performance and comparisons to past operating results. Adjusted free cash flow We reference a non-GAAP financial measure of adjusted free cash flow, which is used by management when assessing our sources of liquidity, capital resources, and quality of earnings. Adjusted free cash flow is operating cash flow adjusted for (1) additions to property, plant, and equipment, net of proceeds from capital-related government incentives and partner contributions, (2) payments on finance leases, and (3) proceeds from the McAfee equity sale in 2022. This non-GAAP financial measure is helpful in understanding our capital requirements and sources of liquidity by providing an additional means to evaluate the cash flow trends McAfee of our business. Since and the sales 2017 divestiture, contributed to prior equity operating distributions and free cash flow, and while the McAfee equity sale in Q1 2022 would have typically been excluded from adjusted free cash flow as an equity sale, we believe including the sale proceeds in adjusted free cash flow facilitate a better, more consistent comparison to current and past presentations of liquidity. Total cash and investments Total cash and investments is used by management when assessing our sources of liquidity, which include cash and cash equivalents, short-term investments, and loans receivable and other. This non-GAAP measure is helpful in understanding our capital resources and liquidity position. intel. MD&A 46 $J JKJJ J # IJ JII NI $KJJ JK IIK JKJN NN JP IJOJ JJ R N P NII IJIJJ NKJ I JJ JK I II K KII JJ IJOJ I JJ JIJJ NKJJ JK JNII J I KK N !M NJJNII JJ I II K INI KK N J IJ "##$KNIK NKJK8NKJ J JJK IK J KJ IJ IKN JK I PKNKN P NJ NI NII J IJ I I J P J IL I J #I ***KR JJJR R NI J J IL NK KK !M NJKI JK INI KK N J IJ "##$KNIK NK JKIK JI J NINII J IJ I I K8NKJ J JJKNKN P NJ NINII J IJ I I IK KJ KJ IJ IKN JK KJINJNI JIIK KJINJNI IKI KJKKK JRJ I IKJINJNI III LI JJ L KPI JII JK JIIKL NI R KKJI JK%IJ K IK% KJKKK JRJIKJINJNI JPJL **+ NK JKIKN J P JK J?0 JJ 41**+% K % I JJ JJI J NI I JJ QNI RI *** NK J I JJ J N ** NK II JJ J?0 JJ !M NIKJINJNI JIIK% N L8NKJ JKJ IKI I I II K% I NI KK N J IJ "##$KNIK NKJK KJK JI J NI I IJ I I K8NKJ JK JJNKN P NJ NI I IJ I I IK KJ KJ IJ IKN JK I P PKJ IKRJJ KJ P NJM K JI K 5" K6 KKK QNJL PKJ JK% J 5" K6 KKK QNJL PKJ JK% J KKJK IJ IJ8NKJ JK IJ QNJLKNIJK% KIP I8NKJ JK IJ QNJLKNIJK%I JI JIK% JK QNJL PKJ JK JI !M NJK IJ K KKK I NI KK N J IJ "##$KNIK NKJI PK JJI I JL JR I K M NK I JK R J P NJKJ I IJ K J NK KK 5" K6 KKK I PKJJNI 5" K6 KKKII OJJ K PKJJNI% I PIKII I R II KIJ KIPJJJ K )K NI J N IJ&#& RI NJNI K I J JI J J RJJIKJ K JK NI&#& IL NK KK I*7%**% IJ J J K KIJ RKII R I O JR IKJ K K !M N K I KKKIKN J I PKJJNIK I NI KK N J IJ "##$KNIK NKJL JI J NINII J IJ I I K8NKJ JK JJNKN P NJ NINII J IJ I I IK KJ KJ IJ IKN JK #8NKJIK R !II "##$ KNI 8NKJ IK R%RKNK L JR KKKK NIK NIK QNJL%J IK NIK% QN JL I K #8NKJIK RK IJ K R8NKJ I56J KJ I IJL% J% QN J% J I KI J I J PI J JPK IJ I JI NJ K%5*6 L JK KK% 5+6I KI J '#QNJLK *** K "##$ KNIK N N IKJ NIJ IQNI JK K NIK QNJL LI P J KJ P NJJ K RJI K NI NK KK J*. PKJJNI%'#QNJLKJI NJ K K K JI NJJ I I IJ IK R% R J'#QNJLK 4***R N P JL L M NI 8NKJIK RK QNJLK %R P N JK I K 8NKJIK R JJ JJI% I KKJ J IK J NII J KJIK JJ K QNJL J K PKJ JK J K PKJ JKKNK L J R KKKK NIK NIK QNJL%R N K KQNP JK%K IJJI PKJ JK% KIP JI K "##$KNIK N N IKJ NI J IK NIK QNJL KJ 63 /;K>05<:3568 <:/0>8: :B2325263 0:B>=3:0056</3/4:<:35/3;23A:05680 ' (# 13
Following are the reconciliations of our most comparable US GAAP measures to our non-GAAP measures presented: Years Ended (In Millions, Except Per Share Amounts) Dec 30, 2023 Dec 31, 2022 Dec 25, 2021 Net revenue $ 54,228 $ 63,054 $ 79,024 NAND memory business (4,306) Non-GAAP net revenue $ 54,228 $ 63,054 $ 74,718 Gross margin percentage 40.0 % 42.6 % 55.4 % Acquisition-related adjustments 2.3 % 2.1 % 1.6 % Share-based compensation 1.3 % 1.0 % 0.4 % Patent settlement — % 0.3 % — % Optane inventory impairment — % 1.1 % — % NAND memory business — % — % 0.6 % Non-GAAP gross margin percentage 43.6 % 47.3 % 58.1 % Earnings per share attributable to Intel—diluted $ 0.40 $ 1.94 $ 4.86 Acquisition-related adjustments 0.33 0.37 0.36 Share-based compensation 0.77 0.76 0.50 Patent settlement 0.05 Optane inventory impairment 0.18 Restructuring and other charges (0.01) 0.65 (Gains) losses on equity investments, net (0.01) (1.04) (0.67) (Gains) losses from divestiture (0.04) (0.28) NAND memory business (0.33) Adjustments attributable to non-controlling interest (0.02) Income tax effects (0.37) (0.31) (0.32) Non-GAAP earnings per share attributable to Intel—diluted 1.05 $ 1.67 $ 5.05 Years Ended (In Millions) Dec 30, 2023 Dec 31, 2022 Dec 25, 2021 Dec 26, 2020 Dec 28, 2019 Net cash provided by operating activities $ 11,471 $ 15,433 $ 29,456 $ 35,864 $ 32,618 Net additions to property, plant, and equipment (23,228) (23,724) (18,567) (14,086) (15,948) Payments on finance leases (96) (345) Sale of equity investment — 4,561 Adjusted free cash flow $ (11,853) $ (4,075) $ 10,889 $ 21,778 $ 16,670 Net cash used for investing activities $ (24,041) $ (10,231) $ (24,283) $ (21,351) $ (13,314) Net cash provided by (used for) financing activities $ 8,505 $ 1,115 $ (6,211) $ (12,842) $ (18,129) MD&A 47 R IJI J K NI KJ I 1"##$KNIKJ NI "##$KNIKIK J9 F:/803;:;32==2630EC:H5 :81/8: <6>350 :C :C :C :58:A:3>: % $ % ! % " &#& IL NK KK Z Z 51%+36 63 3:58:A:3>: % $ % ! % ""$ 8600</8423H:8C:35/4: 7& 7!& 7& #QNKJ I J8NKJ JK * +< * < 3< I K KJ +< < 1< $J JKJJ J Z< +< Z< J P J ILI J Z< < Z< &#& IL NK KK Z< Z< 3< 63 48600</8423H:8C:35/4: 7!& "7 & $7& /832340H:801/8:/5582?>5/?=:5635:=I;2=>5:; % 7 % 7 % 7$! #QNKJ I J8NKJ JK ++ +. +3 I K KJ .. .3 - $J JKJJ J Z - Z J P J ILI J Z 2 Z KJINJNI JIIK 5 6 Z 3- 5" K6 KKK QNJL PKJ JK% J 5 6 5 16 5 3.6 5" K6 KKKI PKJJNI 5 16 5 *26 Z &#& IL NK KK Z Z 5 ++6 #8NKJ JKJJI NJ J JI JIKJ 5 *6 Z Z JMJK 5 +.6 5 +6 5 +*6 63 :/832340H:801/8:/5582?>5/?=:5635:=I;2=>5:; % 7 % 7!" % 7 F:/803;:;32==2630 :C :C :C :C! :C$ :5C/01H86A2;:;?D6H:8/5234/C52A252:0 % " % % ! % $! % !$ &JJ KJ I IJL% J% QN J 5*+%**26 5*+%.*16 52%-3.6 51%236 5-%7126 $L JK KK 5736 5+1-6 Z Z Z QNJL PKJ J Z 1%-3 Z Z Z ;K>05:;B8::C/01B=6@ % $ % " % $$ % ""$ % !!" :5C/01>0:;B6823A:05234/C52A252:0 % % % $ % % :5C/01H86A2;:;?D>0:;B68 B23/3C234 /C52A252:0 % $ % % ! % $ % $ ' (# 1.
Risk Factors and Other Ke Information Risk Factors The following summarizes the material factors that make an investment in our securities speculative or risky. When any one or more of the following risks materialize from time to time, our business, reputation, financial condition, cash flows, and results of operations can be materially and adversely affected, and the trading price of our common stock could decline. These risk factors do not identify all risks that we face; our operations can also be affected by factors that are not presently known to us or that we currently consider to be immaterial to our operations, or by various risks that are generally applicable to most companies. Due to risks and uncertainties, known and unknown, our past financial results may not be a reliable indicator of future performance, and historical trends should not be used to anticipate results or trends in future periods. Refer also to the other information set forth in this Form 10-K, including in the MD&A and Financial Statements and Supplemental Details sections. We are in a highly competitive and rapidly changing industry. The industry in which we operate is highly competitive and subject to rapid technological, geopolitical, and market developments; changes in industry standards; changes in customer and end-user needs, expectations, and preferences; and frequent product introductions and improvements. When we do not anticipate or respond to these developments, our competitive position can weaken, and our products or technologies can become uncompetitive or obsolete. Our competitive environment has intensified in recent years, and we expect it to continue to do so in the future. If we are not able to compete effectively, or if our foundry strategy is unsuccessful, our financial results will be adversely affected, including through reduced revenue and gross margin, and we may be required to accelerate the write-down of the value of certain assets. We face intense competition across our product portfolio. Our competitors include companies offering platform products, such as AMD and Qualcomm; accelerator products such as GPUs, including those offered by NVIDIA; other accelerator products such as ASICs, application-specific standard products, and FPGAs; memory and storage products; connectivity and networking products; and other semiconductor products. Some of these competitors have developed or utilize competing computing architectures and platforms, such as the ARM architecture*, and these architectures and platforms can produce beneficial network effects for competitors when an ecosystem of customers and application developers for such architectures and platforms grows at scale. For example, ARM-based products are being used in PCs and servers, which could lead to further development and growth of the ARM ecosystem. We also compete with internally developed semiconductors from OEMs, cloud service providers, and others, some of whom are customers. Some of these customers vertically integrate their own semiconductor designs with their software assets and/or customize their designs for specific computing workloads. For example, in 2020, Apple introduced PC products utilizing its own internally developed ARM-based semiconductor designs in place of our client CPUs, and we face increasing competition from Apple's products and ecosystem. Most of our competitors rely on third-party foundries, such as TSMC or Samsung, for the manufacture and assembly and test of their semiconductor components and products. Manufacturing process and assembly and test improvements introduced by such foundries have contributed, and may continue to contribute, to increasingly competitive offerings by our competitors. Our process technology roadmap to regain transistor performance and power performance leadership by 2025 is subject to a number of risks, and we could fail to realize our goals, including due to changes in competitor technology roadmaps, changes affecting our projections regarding our technology or competing technology, and the risks described in the risk factor "The development and implementation of new semiconductor products and manufacturing technologies are subject to many risks and uncertainties." As an IDM, we have higher capital expenditures and R&D spending than many of our fabless competitors due to the high ongoing investments required to maintain leading- edge process technology and manufacturing capacity. We also face new sources of competition as a result of changes in industry participants through, for example, acquisitions or business collaborations, as well as new entrants, including in China, which could have a significant impact on our competitive position. For example, we could face increased competition as a result of China's programs to promote a domestic semiconductor industry and supply chains. Our products compete based on a number of factors, including performance, energy efficiency, ease-of-integration, ease-of-use, innovative design, features, workload optimization, price, quality, reliability, security, software ecosystem and developer support, time-to- market, reliable product roadmap execution, brand recognition, customer support and customization, and availability. The importance of these factors varies by product and market segment. To the extent our products do not meet our customers' requirements across these factors in an increasingly competitive landscape, our business and results of operations can be harmed. Introduction of competitive new products and technologies, aggressive pricing, and other actions taken by competitors can harm demand for our products, exert downward pricing pressure on our products, and adversely affect our business. For example, our competitors have introduced data center and client platform products with performance improvements and additional processor core counts that have contributed to an increasingly competitive environment. Further, our DCAI revenue, platform ASPs and market share were negatively impacted by the competitive environment and the shift of customer spend towards GPUs during the past few years. Additionally, a number of business combinations and strategic partnerships in the semiconductor industry have occurred in recent years, and more could occur in the future. Consolidation could also lead to fewer customers, partners, or suppliers, any of which could negatively affect our financial results. intel. Risk Factors and Other Key Information 48 KJ IK JIL IJ KJ IK R KNIOKJJI J IKJJ PKJ J NIKNIJKKN JP IIKL ! L I I J R IKKJI OI JJ J% NI NK KK%INJJ % J %K RK% IKN JK IJ K JI L PIK LJ% JJI I NI KJ N KIKJ IK J JL IKKJJ R: NI IJ K K J LJ IKJJI JIK J L R J NK IJJRNII J L KIJ JI J NI IJ K% I LPI NKIKKJJI I L J KJ K NJ IKK N IJ JK% R N R % NIKJ IKN JKL J I J I NJNII I % KJ I JI KK N J NKJ JJ IKN JK IJI K NJNII K I K J J JI IJ KJ IJ JK I% N J' (# JJ JK N J J KKJ K !I L JJP I L NKJIL NKJIL RR IJK L JJP KN 8JJ IJ % J % IJP JK: K NKJILKJ IK: K NKJ I NKI K%MJJ K% II K: IQN JI NJ JI NJ K I P JK ! R J JJ IIK J JKP JK% NI JJP KJ R % NII NJK I J K N JJP I K J NI JJP PI JK J K I JLIK% RMJJJ J NJ K JNJNI RI J J JJP L% I NI N ILKJIJLKN KNKKN % NI IKN JKR PIK LJ% N JI NINIP N I KKI % RL IQNIJ IJJRIJ R J P N IJ KKJK ! J K JJ I KK NII NJ IJ NI JJ IK N K I J II NJK%KNK#' 4N : IJ II NJKKNK"$1K% N J K I L&? #: JI IJ II NJKKNK# K% J KKJ II NJK% $"#K: IL KJ II NJK: JPJL JR I I NJK: JI K NJ II NJK JK JJ IKPP INJ O J NJ IJJNIK J IK%KNK J# 'IJJNIA% JKIJJNIK J IK I N JR IJK I JJ IKR KLKJ NKJ IK J P IK IKNIJJNIK J IKI RKJK IM %# ' KI NJKI NK $K KIPIK%R N J NIJIP J I RJ J# ' KLKJ ! K JRJ JI LP K NJ IKI 'K% NKIPI PIK% JIK%K R INKJ IK JK NKJ IKPIJ L JIJJI R K NJ IK KRJJIK JRIKKJK 8 INKJ OJIK K IK NJ R I K IM % **%# JI N$I NJKNJ O JK R JI LP # ' K K NJ IK K NI J$1K% R IK JJ I # /KI NJK KLKJ ' KJ NI JJ IKI L JIIJL N IK%KNK' IKN % IJ NJNI KK L JKJ JI K NJ I JK I NJK ' NJNI I KK KK L JKJI P JK JI N LKN N IK P JI NJ% L J NJ JI NJ%J IK L JJP I K L NI JJ IK NII KKJ L I J I JI KKJ II I RII I IK L**-KKN 8JJ N I IKK% R N J I O NI K% N NJ K JJ IJ LI K% KJ NII 8J KII NI J L I J J L% JIKKKI JIKJ IEP J JJ R K NJ II NJK NJNI J KIKN 8JJ LIKK N IJ JK E#K '%RPIJ M JNIK ( K J L NI KK JJ IKNJ J PKJ JKIQNIJ J I KKJ L NJNI JL ! K RK NIK JJ KIKN J K NKJIL IJ JKJI N% IM %QNKJ K I NK KK IJ K%KR K R JI JK% N %R N P K JJ NI JJP KJ IM %R N IK JJ KIKN J /KI IKJ I J KJK NJ I NKJIL KN L K NII NJK J K N I J IK% N I I % IL L%K JIJ %K NK% PJPK %JNIK%R I JOJ %I%QN JL%I JL%KNIJL%K JRI KLKJ P IKN IJ%JJ IJ%I I NJI MNJ % I I J %NKJ IKN IJ NKJ OJ % P JL IJ JKJ IKPIK LI NJ IJK J JMJ J NII NJK JJ NINKJ IK/IQNI JKI KKJK J IK IK L JJP K% NI NK KK IKN JK IJ K I JI NJ JJP R I NJK J K%IKKPI % JIJ KJ L JJ IK I I NII NJK%MIJ R RII IKKNI NII NJK% PIK LJ NI NK KK IM % NI JJ IKP JI NJ JI J J II NJKRJI I I P JK J I KK I I N JKJJP JI NJJ IK L JJP PI J NIJI% NI # IP N% J I#$K IJKIRI JP LJ LJ JJP PI J JKJ NKJ IK J RIK"$1KNI JKJRLIK #J L% N I NK KK J K KJIJIJ IKK JK NJ I NKJILP NII I JLIK% I N NI JNJNI K J N K J RINKJ IK%IJ IK% IKN IK% L R N JP LJ NI IKN JK KJ IK JIL IJ 12
We have limited experience in the highly competitive and capital-intensive third-party foundry business. As we pursue our strategy to establish IFS as a major provider of foundry capacity to manufacture semiconductors for others, we will face intense competition from well-established competitors such as TSMC, Samsung, Global Foundries (GF), United Microelectronics Corporation (UMC), and Semiconductor Manufacturing International Corporation (SMIC). To succeed, we will need to compete effectively across factors such as availability and time-to-market of manufacturing technology; advances in manufacturing processes in areas such as performance, performance per watt, and density; multi-chip packaging; system integration; manufacturing capacity; price; margin; ease of use; quality; yields; customer satisfaction; and ecosystem support. Building and maintaining a competitive foundry business requires high ongoing investments to maintain leading-edge process technology and manufacturing capacity, which investments in many instances must be made ahead of customer commitments and may not be recouped. Moreover, many of the largest potential IFS customers are fabless semiconductor companies whose products compete with our own. As a result, our strategy requires us to overcome customer concerns regarding protection of confidentiality information, intellectual property, and foundry capacity, among other competitive concerns, to attract and retain such customers. Our limited third-party foundry experience also means we must continue to hire and retain talented employees with relevant foundry experience with respect to both leading-edge and legacy nodes. Our efforts may be hindered by the higher costs of, regulatory and environmental restrictions imposed upon, and time it takes to build fabrication and assembly and test facilities in the jurisdictions in which we operate and plan to build new or upgrade existing foundry facilities as compared to the jurisdictions in which our competitors predominantly operate their foundry facilities. Our construction projects to expand capacity require available sources of labor, materials, and equipment. Increasing demand for such sources, including from other foundries; supply constraints, labor shortages, and other adverse market conditions; issues with permits or approvals; on-site incidents; and other construction issues arise from time to time and can result in significant delays and increased costs for our projects, as well as legal and reputational harm. These significant hurdles to our foundry strategy make it highly risky and our success highly uncertain. We are making significant, long-term and inherently risky investments in R&D and manufacturing facilities that may not realize a favorable return. To compete successfully, we must maintain an effective R&D program, develop new products and manufacturing processes, improve our products and processes, and make significant capital investments in new and existing manufacturing facilities, all ahead of competitors and market demand. The R&D efforts and capital investments we require are intensive as we compete across both product and process technologies. We incurred R&D expenses of $16.0 billion in 2023, $17.5 billion in 2022, and $15.2 billion in 2021. We are focusing our R&D efforts across several key areas, including process and packaging technology, our xPU products and features, AI, and software. These include ambitious initiatives, such as our efforts to introduce five new manufacturing process technologies, or nodes, in four years and our unified oneAPI portfolio of developer tools. Our investments are typically long-term and, even where successful, often do not contribute to our operating results for a number of years. We cannot guarantee that our efforts will deliver the benefits we anticipate, including as a result of our new products or technologies falling short of expectations or the offerings of competitors. For example, we previously experienced significant delays in the implementation of our 10nm process technology, and during 2020, we announced that our then 7nm process technology would be delayed relative to our prior expectations. In such instances where we do not timely introduce new manufacturing process technologies that improve performance, performance per watt, transistor density, die utilization, core counts, and/ or new features such as optimizations for Al and other workloads, with sufficient manufacturing yields and operational efficiency, relative to competing foundry processes, we have faced and will face cost, product performance, and time-to-market disadvantages relative to our competitors and adverse impacts to our financial condition as a result of higher operating costs, including as a result of additional costs from unused manufacturing capacity, higher leverage and borrowing costs, and pressure on our credit ratings. Further, we are not always able to timely or successfully develop new products, including as a result of bugs, late changes to features due to customer requests, or other design challenges. For example, in 2022, we announced that the release of Intel's 4th Gen Intel Xeon Scalable processor would be delayed from the first half of 2022 to the second half of 2022. To the extent our R&D efforts do not develop new products on schedule with improvements in areas like performance, performance per watt, die utilization, and core counts, and/or with new features such as optimizations for AI and other workloads, our competitive position can be harmed. We have adopted a disaggregated design approach for some of our future products, in which different processors and components can be manufactured on different processes and connected by advanced packaging technology into a single package. This approach introduces new areas of complexity in design and manufacturability, particularly in the deployment of advanced packaging technologies, several of which are novel, have a limited manufacturing history, and/or have increased costs. Delays or failures in implementing disaggregated designs could adversely affect our ability to timely introduce competitive products. For example, adapting a processor or component design for a new or different manufacturing process involves additional R&D expense and can result in delays in the development of the associated product and higher costs due to the utilization of more advanced and expensive capital equipment. intel. Risk Factors and Other Key Information 49 !P JMI J L JJP J J KPJIIJL N IL NK KK #KRNIKN NIKJIJLJ KJ K K8 II PI N ILJLJ NJNIK NJ IK I JIK%RR J K JJ I R KJ K JJ IKKNK'%KN %" N IK5"6%1 J'I JI K I IJ 51'6% NJ I' NJNI JI J I IJ 5' 6 KN%RR J JJP LI KKJ IKKNK P JL JJ IJ NJNI J L:P K NJNI I KKK IKKNKI I % I I IRJJ% KJL:N J :KLKJ JIJ : NJNI JL:I:I :K NK:QN JL: L K:NKJ IKJKJ : KLKJKN IJ )N J JJP N IL NK KKIQNIK PKJ JKJ J I KKJ L NJNI JL%R PKJ JK L KJ KNKJ NKJ I J JK L J I N ' I PI% L J IKJ J J NKJ IKI KK K NJ I KR KI NJK JRJ NI R #KIKN J% NIKJIJLIQNIKNKJ PI NKJ I I K II I JJ J JL IJ % J JN I IJL% N ILJL% JI JJP I K%J JJIJ IJ KNNKJ IK NI JJIIJL N ILMI K KRNKJ J NJ I IJ J J LK RJI P J N ILMI RJIKJJ J L K NI IJKL I LJI KJK % IN J IL PI J IKJIJ K KN % JJJKJ N IJ KK L JKJ JK J 8NIKJ K RR IJ J N R INIMKJ N IL JKK IJ J8NIKJ K R NI JJ IKI J L IJJI N IL JK NI KJINJ I 8JKJ M JLIQNIP K NIK I% JI K% QN J IK IKNK NIK% N I JI N IK:KN L KJI JK% IK IJK% JIPIKIJ J K:KKNKRJIJK II P K: KJ JK: JI KJINJ KKNKIKI JJ J IKN J K J LK IK KJK I NII 8JK%KR K INJJ I KK JNI K J NI N ILKJIJLJ LIKL NIKNKK LN IJ !I K J% JI I J LIKL PKJ JK ( NJNI JKJJL JI OP I IJNI JKNKKN L%RNKJ J JP ( I I%P RI NJK NJNI I KKK%I P NI I NJK I KKK% K JJ PKJ JK R MKJ NJNI JK% JJ IK IJ ( IJK J PKJ JKRIQNII J KPKR JI KK JI NJ I KK J K ! NII ( M KK ;3 **+%;. - ***% ;- * ** !I NK NI ( IJKI KKKPI LIK% N I KK J L% NIM$1I NJK JNIK%# % K JRI K N J NK JJPK%KNK NI IJKJ JI NP R NJNI I KKJ K% I K% NILIK NIN #$ IJ P IJ K NI PKJ JKIJL L JI %P RIKNKKN % J J JI NJJ NI IJ IKN JK I N I LIK ! JNI JJJ NI IJKR PIJ JKR JJ% N KIKN J NI RI NJK IJ K K IJ MJJ K IJ I K JJ IK IM %R IP NK LMI K J LK J JJ NI I KKJ L% NI **%R N JJ NI J . I KKJ LR N LI JPJ NII IMJJ K KN KJ KRIR JJ L JI N R NJNI I KKJ KJJI PI I %I I IRJJ%JI KKJ I KJL%NJ OJ % I N JK% 8 I RJNIKKNK JOJ K I# JIR I K%RJKN J NJNI L K IJ L%I JPJ J N ILI KKK%RP R KJ%I NJI I % JJ IJKP JKI JPJ NI JJ IK PIKJKJ NI J KIKN J I IJ KJK% N KIKN J J KJK I N NK NJNI JL%I PI II R KJK% IKKNI NIIJIJ K NIJI%RI J RLK J J L IKNKKN LP RI NJK% N KIKN J NK% J KJ JNIKNJ NKJ IIQNKJK% I JIK K IM % ***%R N JJJI K J /K1J" J = I KK IR N LI JIKJ ***J JK *** JMJ J NI ( IJK JP RI NJK KN RJ I P JK IK I I %I I IRJJ%NJ OJ % I N JK% 8 IRJ RJNIKKNK JOJ K I# JIR I K% NI JJP KJ I !P JKIJK I I K NINJNII NJK% RI JI KK IK JK NJNI I JI KKK J LP J L J K KI JI NK RIK MJL K NJNI JL%IJN I L J L J P J K%KPI RI P %P J NJNI KJ IL% 8 IP IK KJK LK I NIK J KIJK K N PIK LJ NI JLJ J L JI N JJPI NJK IM %J I KK I I JK I R II J NJNI I KK P PKJ ( M K IKN J LK JP J JKK JI NJ I KJKNJ JNJ OJ IP M KPJ QN J KJ IK JIL IJ 17
The investments required for our process technology roadmap and our worldwide manufacturing and assembly and test require capital expenditures above our historical levels. In recent years, the semiconductor manufacturing industry has seen very significant increases in the capital investments required for manufacturing facilities utilizing leading process technologies, including as a result of the use of EUV photolithography tools. Our ownership and operation of such high-tech fabrication facilities, and our need to build new and expand existing facilities in anticipation of future demand, has resulted and will continue to result in our incurring large capital outlays and high costs that are fixed or difficult to reduce in the short term. Such capital outlays and costs include those related to utilization of existing facilities, facility construction and equipment, R&D, and the employment and training of a highly skilled workforce. To the extent customers are unwilling to pay prices to access the features that our process and product investments are expected to deliver or demand for our products, foundry capacity and assembly and test capacity decreases or we fail to forecast demand accurately, our gross margin and operating income can be disproportionately affected due to our high fixed cost structure, which is difficult to reduce quickly in response to lower demand and other unfavorable market factors. We could also be required to write off inventory or record excess manufacturing capacity charges, which would also lower our gross margin and operating income. To the extent the demand decrease is prolonged, our manufacturing or assembly and test capacity could be underutilized, and we may be required to write down our long-lived assets, which would increase our expenses. We may also be required to shorten the useful lives of under-used facilities and equipment and accelerate depreciation. As we continue to make substantial investments in increasing our manufacturing capacity as part of our IDM 2.0 strategy, these underutilization risks may be heightened. Conversely, at times, demand may increase or we may fail to forecast accurately or produce the mix of products demanded. To the extent we are unable to add capacity or increase production fast enough, we are at times required to make production decisions and/or are unable to fully meet market demand, which can result in a loss of revenue opportunities or market share, legal claims, and/or damage to customer relationships. The development and implementation of new semiconductor products and manufacturing technologies are subject to many risks and uncertainties. We are continually engaged in the development of next-generation technologies. Forecasting our progress and schedule for developing advanced nodes and other technologies is challenging, and at times we encounter unexpected delays due to the complexity of interactions among steps in the manufacturing process, challenges in using new materials or new production equipment, and other issues. Diagnosing defects in our manufacturing processes often takes a long time, as manufacturing throughput times can delay our receipt of data about defects and the effectiveness of fixes, and defects can be more serious and difficult to resolve than initially anticipated. We are not always successful or efficient in developing or implementing new process nodes and manufacturing processes. We experienced significant delays in implementing our 10nm process technology, and in 2020, we encountered a defect mode in the development of our then 7nm process technology that resulted in delays relative to our prior expectations. In 2022, Intel's 4th Gen Intel Xeon Scalable processor was delayed to allow for more platform and product validation time. These delays have allowed competitors using third-party foundries, such as TSMC, to benefit from advancements in manufacturing processes introduced ahead of us, including improvements in performance, energy efficiency, and other features, which have helped increase the competitiveness of their products. Because of these prior delays in our process technologies, we may experience greater adverse competitive impacts in the event of delays in the development of future manufacturing process technologies and products. Our efforts to innovate involve significant expense and carry inherent risks, including difficulties in designing and developing next- generation process and packaging technologies, and investments in manufacturing assets and facilities that are made years in advance. We cannot guarantee that we will realize the expected benefits of next-generation process technologies, including the expected cost, performance, power, and density advantages, or that we will achieve an adequate return on our capital and R&D investments, particularly as the development of new nodes has grown increasingly expensive. In such circumstances, we may be required to write down the value of some of our manufacturing assets and facilities, increasing our expenses. Risks inherent in the development of next-generation process technologies include production timing delays, lower-than-anticipated manufacturing yields, longer manufacturing throughput times, failure to achieve expected performance, power, and area improvements, and product defects and errata (deviations from published specifications). Production timing delays have at times caused us to miss customer product design windows, which can result in lost revenue opportunities and damage to our customer relationships. Furthermore, when the introduction of next-generation process nodes is delayed, adding cores or other competitive features to our products can result in larger die size products, manufacturing supply constraints, and increased product costs. Lower manufacturing yields and longer manufacturing throughput times, compared to previous process nodes, can increase our product costs, adversely affect our gross margins, and contribute to manufacturing supply constraints. A new process node typically has higher costs compared to a mature node due to factors that include higher depreciation costs and lower yields, and costs and yields at times do not improve at the same rate as on prior nodes. As the die size of our products has increased and our manufacturing process nodes have shrunk, our products and manufacturing processes have grown increasingly complex and more susceptible to product defects and errata, which at times also contribute to production timing delays and lower yields that may also increase our costs to manufacture and warranty our products. Our disaggregated design strategy poses increased logistical risks and challenges, particularly where we decide to manufacture different product components on different process technologies, including third-party foundries' process technologies. To combine components in a single package, they need to be manufactured on a timely basis and in sufficient quantities, while the manufacturing processes we utilize may have differing yields, throughput times, and capacity constraints. We may be required to safely store some components pending the manufacture of others. Delays or quality issues with one component could limit our ability to manufacture the entire completed product. In addition, the packaging technologies used to combine these components can increase our costs and may introduce additional complexity and quality issues. To the extent we are unable to manage these risks, our ability to timely supply competitive products can be harmed and our costs could increase. Intel. Risk Factors and Other Key Information 50 PKJ JKIQNI I NII KKJ LI NIR I R NJNI KK L JKJIQNIJ M JNIK P NIKJ I P K I JLIK%JK NJ I NJNI NKJILKK PILK J IKK JJ PKJ JKIQNI I NJNI JKNJ O I KKJ K% N KIKN J JNK 1? J J ILJ K NI R IK IJ KNJ IJ JK% NI J N R M MKJ JK JJ NJNI %KIKN J R J NJ IKN J NI NII IJ NJ LK KJKJJIM IN JJ IN JK IJJI NJ NJ LK KJK NJ KI JJ NJ OJ MKJ JK% JL KJINJ QN J% ( % J L J JI LK R I I JMJ JNKJ IK IN R J LIKJ KKJJNIKJJ NII KK I NJ PKJ JKIMJJ PI I I NI I NJK% N ILJL KK L JKJJLIKK IR J IKJ NIJ L% NII KKI IJ KI IJ J LJNJ NIM KJKJINJNI%RKN JJ INQN L IK KJ RI JIN P I IJJ IK ! N K IQNIJ RIJ P J IL II IMKK NJNI JLIK%RR N K RI NII KKI IJ JMJ JJ IKKI % NI NJNI IKK L JKJJL N N INJ O% RL IQNIJ RIJ R NI PKKJK%R R N IK NIM KK !L K IQNIJ K IJ JNKN PK N INK JK QN J IJ IJ #KR J NJ KN KJ J PKJ JK IK NI NJNI JLKIJ NI '* KJIJL% JKN INJ OJ IKKL J PIK L%JJK% L IK IRL J IKJNIJ L I I NJM I NJK JMJ JRIN J JL I IKI NJ KJ N%RIJJK IQNIJ I NJ K K 8 IIN J N LJIJ %R IKN J KK IP N IJN JK IIJKI% K% 8 IJ NKJ II J KK P J JJ RK NJ II NJK NJNI J K IKN 8JJ LIKK N IJ JK !I J N L JP J MJ IJ J K IKJ NII IKK KN IP P K JIJ KK % JJKR N JIN MJ LKNJ J MJL JIJ K KJK J NJNI I KK% K NK RJI K I RI NJ QN J% JI KKNK K JK NI NJNI I KKK J JK J%K NJNI JI NNJJK L NI IJ J NJJK JJP KK MK% JK IKI NK N JJ IK PJ J L JJ !I J RLKKNKKN I J P I J RI KK K NJNI I KKK ! MI K J LK J NI I KKJ L% **%R N JIJ J P J NIJ . I KKJ LJJIKN J LKI JPJ NII IMJJ K ***% J /K1J" J = I KK IRK LJ R I I J I I NJP J J K LKP R JJ IK NK JIIJL N IK%KNK'%J JI P JK NJNI I KKK JI N NK% N I P JK I I % IL L% JIJNIK%RP IKJ JJP KK JII NJK )NK JKI I LK NII KKJ K%RLMI IJIPIK JJPJK JP J LK JP J NJNI NJNI I KKJ K I NJK NI IJKJ PJ P PK JM K IIL I JIKK% N N JK K P MJ IJ I KK J K% PKJ JK NJNI KKJK JKJJILIK P ! JNI JJJRR I OJMJ JK MJ IJ I KKJ K% N JMJ KJ% I I % RI% KJLP JK% IJJRR P QNJIJNI NIJ ( PKJ JK%IJN I L KJP J R KKI R IK LM KP KNINKJ K%RL IQNIJ RIJ R JP N K NI NJNI KKJK JK% IK NIM KK KK I J JP J MJ IJ I KKJ K NI NJ J LK% RIJ JJ NJNI L K% I NJNI JI NNJJK% NIJ PMJI I % RI% II P JK% I NJJK IIJ5PJ KI N KKJ K6 $I NJ J LKPJJKNKNKJ KK NKJ II NJK R RK%R IKN J KJIP N IJN JK J NINKJ II J KK NIJI I% R J JI NJ MJ IJ I KK KK L% IK I JI JJPJNIKJ NII NJK IKN J IIKOI NJK% NJNI KN L KJI JK% IKI NJ KJK 0 RI NJNI L K I NJNI JI NNJJK% IJ IP NKI KK K% IK NII NJ KJK%PIK LJ NII KK I K% JI NJJ NJNI KN L KJI JK # RI KK JL LKI KJK IJ JNI NJ J IKJJ NIIJ KJK RIL K% KJK L KJJK JI PJJKIJK I I K #KJKO NII NJKK IK NI NJNI I KK KPKIN % NII NJK NJNI I KKKPI R IK L M IKNKJ J I NJJK IIJ%RJJK K JI NJJ I NJ J LK RIL KJJL K IK NI KJKJ NJNI RII JL NII NJK NIKIJK KJIJL KK IK KJ IKK K%IJN I LRIRJ NJNII J I NJ JK I JI KKJ K% N JIIJL N IK/I KKJ K JK K %JL J NJNI J L KK KN JQN JJK%R J NJNI I KKKRNJ O LPI L K%JI NNJJK% JL KJI JK !L IQNIJ K LKJ IK JK J NJNI JIK LK IQN JLKKNKRJ J N J NI JLJ NJNIJ JI JI NJ J %J J KNKJ JK JK IK NI KJK L JI NJ MJL QN JLKKNK JMJ JRIN J JKIKK% NI JLJ J LKN L JJPI NJK I NI KJK N IK KJ IK JIL IJ -
From time to time, disruptions in the production process result from errors; defects in materials; delays in obtaining or revising permits and licenses; interruptions in our supply of materials, resources, or production equipment; adverse changes in equipment productivity; and disruptions at our fabrication and assembly and test facilities due to accidents, maintenance issues, power interruptions, equipment malfunctions, or unsafe working conditions—all of which could affect the timing of production ramps and yields and could result in production timing delays. Production issues periodically lead to increased costs and affect our ability to meet product demand, which can adversely impact our business and the results of operations. Our implementation of new business strategies and investments in new businesses, products, and technologies are inherently risky and do not always succeed. Our IDM 2.0 strategy requires implementation of new business strategies, as well as many internal structural, systems and process changes. We have entered new businesses and introduced new products and services as we seek to capitalize on the opportunities presented by growth in semiconductor demand, ubiquitous compute, pervasive connectivity, cloud to edge infrastructure, AI, and sensing. In recent years, we have expanded our product offerings in areas such as discrete GPUs, mobility solutions, Al accelerators, IPU products, and silicon photonics. As part of our IDM 2.0 strategy, we announced plans to establish IFS as a major provider of foundry capacity to manufacture semiconductors for others and to implement an internal foundry operating model through updates to our processes, systems, and guardrails between our manufacturing and our individual product-based business units. The implementation of our internal foundry operating model requires many internal structural, system, and process changes to support the separation of the product and manufacturing sides of our business and our external foundry business, including a new ERP system. In parallel, we are undertaking significant efforts to separate out portions of our business, such as PSG and IMS, to raise capital and unlock value as we focus on our core product and manufacturing capabilities. Significant business changes are inherently risky and are not always successful. For example, in 2022, we wound down Intel Optane; in 2020, we agreed to sell our NAND memory business to SK hynix; and in 2019, we exited the 5G smartphone modem business based on our determination that there was no clear path to profitability for those businesses. These new and developing areas and products represent a significant portion of our revenue growth opportunity, and they also introduce new sources of competition, including, in some cases, incumbent competitors with established technologies, ecosystems, and customer bases, lower prices, margins, or costs, and greater brand recognition. These developing products and market segments require significant investment, do not always grow as projected or at all, or sometimes adopt competing technologies, and we may not realize an adequate return on our investments. For example, Al and machine learning are increasingly driving innovations in technology, but if we fail to develop leading products for these workloads, or if our customers use competing technologies, we may not realize a return on our investments in these areas. Similarly, we expect intense competition related to the significant opportunity we see in networking infrastructure and the distribution of computing to the network edge and may not succeed in our efforts. To be successful, we need to cultivate relationships with customers and partners in these market segments and continue to improve our offerings. Despite our ongoing efforts, there is no guarantee that we will achieve or maintain market demand or acceptance for our products and services in these various market segments or realize an adequate return on our investments, which could lead to impairment of assets and restructuring charges, as well as opportunity costs. Our Smart Capital approach to capital spending, alternative financing arrangements and pursuit of government grants involves risks and may not be successful. As we pursue our IDM 2.0 strategy, we have utilized our Smart Capital approach to capital spending in an effort to appropriately time and scale our capital investments. To support our capital investments, we have pursued alternative financing arrangements, such as our 2022 joint investment with Brookfield in the manufacturing expansion of our Arizona campus, and expect to enter into similar arrangements in the future. These transactions may fail to advance our business strategy, may include unfavorable pricing or other terms, and may fail to achieve their anticipated benefits. Our partners may also fail to satisfy financial or other obligations on which we rely and we may fail to resolve any potential disputes. Any of these risks, including our ability to effectuate any additional transactions at all, could have a material adverse effect on our business, results of operations, financial condition, or cash flows, which may limit our ability to raise sufficient capital for our required investments. In addition, as part of our Smart Capital approach, we have applied for, received, and expect to receive additional grants and incentives from domestic and foreign local, regional and national governments. Legislation in the US and EU has been adopted to provide government funding for semiconductor manufacturing expansions in those regions, but there is uncertainty as to the amounts and timing of funding we may receive and as to the conditions and restrictions that may apply to us as a recipient of such funding. For example, we expect to receive substantial grants from the US government under the CHIPS Act to support significant planned new fabrication facilities in the US and the German government under the EU Chips Act to support significant planned new fabrication facilities in Germany. However, governments may choose not to award grants and incentives in sufficient amounts or in a timely manner to support our capital investment plans and to offset the higher costs of operations in many of the locations of our facilities as compared to those of many of our competitors, or we may be unable to comply with the requirements and limitations of such grants and incentives. To the extent such funding is below our expectations, we elect not to accept any grants or incentives due to burdensome compliance requirements, or we are required to return any amounts received from any grants or incentives due to an inability to comply with any requirements or limitations contained therein, our anticipated cash requirements would increase. intel. Risk Factors and Other Key Information 51 I JJ J%KINJ K JI NJ I KKIKN JI II IK:JK JI K: LK J IIPK IJK KK: JIINJ K NIKN L JI K%IK NIK% II NJ QN J:PIK K QN JI NJPJL: KINJ KJ NI IJ KK L JKJ JKNJ JK% J KKNK% RI JIINJ K%QN J N J K% IN KR I J KZ R N JJJ I NJ IK L K N IKN J I NJ J LK $I NJ KKNKI L J IK KJK J NI JLJ JI NJ %R PIK LJ NI NK KK JIKN JK IJ K NI JJ R NK KKKJIJK PKJ JK R NK KKK%I NJK% J KI I J LIKL J RLKKN NI '* KJIJLIQNIK JJ R NK KKKJIJK%KR K L JI KJINJNI %KLKJK I KK K !P JI R NK KKK JI N RI NJK KIPKKRKJ J O J IJN JK IK J LI RJ K NJ I %N QNJ NK NJ%IPKP JPJL% NJ IKJINJNI%# % K K I JLIK%RPM NII NJ I K IKKNKKIJ"$1K% JLK NJ K%# IJ IK% $1 I NJK% K J K #KIJ NI '* KJIJL%R N KJ KJ K K8 II PI N IL JLJ NJNIK NJ IK I JIK J J JI N IL IJ JI NNJKJ NI I KKK%KLKJK% NII K JR NI NJNI NI PN I NJ K NK KKN JK JJ NI JI N IL IJ IQNIK L JI KJINJNI %KLKJ% I KK KJ KN IJJKIJ J I NJ NJNI KK NI NK KK NIMJI N IL NK KK% N R $KLKJ I %RI N IJ K J IJKJ KIJ NJ IJ K NI NK KK%KNK$" '%J IKJ N P NKR NK NI II NJ NJNI JK J NK KK KI I J LIKL I J RLK KNKKN IM % ***%RR N R J J : **%RIJ K NI&#& IL NK KKJ L M: *7%RMJJ-"KIJ NK KK K NIJI J JJJIRK IJJ I J JL IJ K NK KKK K R P IK I NJKIIK JK J IJ NIIP NI RJ IJN JL% JL K JI N RK NIK JJ % N % K KK% N J JJ IKRJKJ KJ K% KLKJK% NKJ I KK% RIIK%I K% I KJK% IJI I I J KP I NJK IJK JKIQNIK J PKJ J% J RLKI RKI 8J IJ % IK JK J J J K% RL JI O QNJ IJNI NI PKJ JK IM %# I I IK LIP PJ K J L% NJR J P I NJK IJKR I K% I NINKJ IKNK J J K%RL JI OIJNI NI PKJ JK JKIK I L%RMJ J K JJ I JJ JK J IJN JLRK JR I IKJINJNI JKJI NJ NJ J J JR I L JKN NI IJK KNKKN %R J N JPJI J KKRJNKJ IK IJ IK JKIJK JK J NJ I P NI I K KJ NI IJK%JIK NI JJJRR P I J IJ IJ I NII NJK KIPK JK PI NKIJK JK II O QNJIJNI NI PKJ JK%R N J I J KKJK IKJINJNI IK%KR K IJN JL KJK NIIJJ I J J K % JI JP II JK NIKNJ PI JI JK P PKIKK L J KNKKN #KRNIKN NI '* KJIJL%RPNJ O NIIJJ I J J K IJJ I IJ LJ K NIJ PKJ JK KN IJ NIJ PKJ JK%RPNIKN JI JP II JK%KNK NI*** 8 J PKJ JRJ)I J NJNI M K NI#IO NK% MJJ JI J K III JK JNJNI KJI KJ KL J P NI NK KKKJIJL%L NN P I I I JIJIK% L J PJI JJ JK NIIJ IKL K J KJKL I JI J K RRI L RL J IK P L J J KNJK # L JKIKK% N NI JLJ JNJ LJ JI KJ KJ % N PJI PIKJ NI NK KK%IKN JK IJ K% J % IK RK%RL J NI JLJ IKKN JJ I NIIQNI PKJ JK J %KIJ NIIJJ I %RP I%IP% MJJ IPJ I JK JPK I KJ I %I J PI JK 0K J J1 1K JJ I P PI JN IK NJ I NJNI M K K J KI K% NJJIKN IJ JLKJ J N JK J N RLIP KJ J J K IKJIJ KJJL LJ NKKI J KNN IM %R MJJ IPKN KJ J I JKI J1 PI JN IJ> $#JJ KN IJK J R IJ JK J1 J"I PI JN IJ 1K#JJ KN IJK J R IJ JK "I L > RPI% PI JKL K JJ RII JK JPK KN J N JK I J L IJ KN IJ NIJ PKJ J K J KJJI KJK IJ K L J J K NI JKK IJ J K L NI JJ IK% IRL N J LRJJIQNI JK JJ K KNI JK JPK JMJ JKN N K R NIMJJ K%R J JJ J LI JK I JPKNJ NI K IQNI JK% IRI IQNIJ IJNI L N JKIPI LI JK I JPKNJ JLJ LRJ LIQNI JK I JJ K J JI % NI JJKIQNI JKR N IK KJ IK JIL IJ -
Changes in product demand can adversely affect our financial results. Our products are used in different market segments, and demand for our products varies within or among them. It is difficult to forecast these changes and their impact. For example, we expect the PC TAM to grow over time driven by factors such as a larger installed base, demand for Al capabilities, new platforms, shorter replacement cycles, and adoption in new markets; however, the PC industry has been highly cyclical in the past, and these growth expectations may not materialize, or we may fail to capitalize on them. Changes in the demand for our products, particularly our CCG, DCAI, and NEX platform products, have in the past and may in the future reduce our revenue, lower our gross margin, or require us to write down the value of our assets. Important factors that lead to variation in the demand for our products include: • business conditions, including downturns in the market segments in which we operate, or in global or regional economies; • consumer confidence, income levels, and customer capital spending, which can be impacted by changes in market conditions, including changes in government borrowing or spending, taxation, interest rates, the credit market, current or expected inflation, employment, and energy or other commodity prices; • geopolitical conditions, including trade policies and geopolitical tensions and conflicts; • our ability to timely introduce competitive products; • competitive and pricing pressures, including new product introductions and other actions taken by competitors; • the level of our customers' inventories and computing capacity; • customer order patterns and order cancellations, including as a result of maturing product cycles for our products, customers' products, and related products such as operating system upgrade cycles; and disruptions affecting customers, such as the delays in obtaining tools, components, and other supplies as a result of COVID-19-related port shutdowns in China that negatively impacted demand for our business in 2022, as well as the industry substrate and component shortages that negatively impacted demand across several of our businesses in 2021; • market acceptance and industry support of our products and services, including the introduction and availability of software and other products used together with our products, such as software to harness the new Al capabilities of our latest CPUs, as well as our foundry services offerings through IFS; and • customer product needs and emerging technology trends, including changes in the levels and nature of customer and end-user computing workloads, such as work- and learn-from-home trends. Our pricing and margins vary across our products and market segments due in part to marketability of our products and differences in their features or manufacturing costs. For example, our core product offerings range from lower-priced and entry-level platforms, such as those based on Intel Atom processors, to higher-end platforms based on Intel Xeon processors. Our ancillary product offerings that extend beyond our core product lines typically have significantly lower margins than our higher-priced products, and at times are not profitable. To the extent demand shifts from our higher-priced to lower-priced core products in any of our market segments, or our ancillary products represent a greater share of our mix of products sold, our gross margin percentage has decreased and may decrease again. Macroeconomic conditions and geopolitical tensions and conflicts, including changes to trade policies and regulations, present significant risks to us in many jurisdictions. We have manufacturing, assembly and test, R&D, sales, and other operations in many countries, and some of our business activities are concentrated in one or more geographic areas. Our operations rely upon a supply chain that is also highly distributed, and with reliance in some instances on supplies or materials available in only one or more geographic areas. Moreover, sales outside the US accounted for 74% of our revenue for the fiscal year ended December 30, 2023, with revenue from billings to China contributing 27% of our total revenue. As a result, our operations and our financial results, including our ability to execute our business strategy, manufacture, assemble and test, design, develop, or sell products, and the demand for our products, are at times adversely affected by a number of global and regional factors outside of our control. Adverse changes in global or regional economic conditions periodically occur, including recession or slowing growth; changes or uncertainty in fiscal, monetary, or trade policy; higher interest rates; tighter credit; inflation; lower capital expenditures by businesses, including on IT infrastructure; increases in unemployment; and lower consumer confidence and spending. Adverse changes in macroeconomic conditions can significantly harm demand for our products and make it more challenging to forecast our operating results and make business decisions, including regarding prioritization of investments in our business. An economic downturn or increased uncertainty may also lead to increased credit and collectability risks, higher borrowing costs or reduced availability of capital and credit markets, reduced liquidity, adverse impacts on our suppliers, failures of counterparties, including financial institutions and insurers, asset impairments, and declines in the value of our financial instruments. intel. Risk Factors and Other Key Information 52 K I NJ PIK LJ NI IKN JK NII NJKINK I JIJK JK% I NII NJKPIKRJ I J JKN JJ IKJ JK K JIJ IM %RMJJ$#'J I R PIJIP LJ IKKNK II KJ K% I# JK% R J IK%K IJII JL K% J RIJK: RPI%J$ NKJILK LL JKJ% JKI RJMJJ KL JJI O% IRL J J O J K J I NII NJK%IJN I L NI"% # % & = J II NJK%P JKJ L JNJNIIN NI IP N% RI NII KKI % IIQNINKJ RIJ R JP N NIKKJK IJ JJ IKJJ J PIJ J I NII NJK N9 W NK KK J K% N R JNI K JIJK JK RR IJ% I II K: W KNI % P K% NKJ IJ K %R J L K IJ J K% N K PI J II R IK %JMJ % JIKJIJK%JIJIJ%NII J IMJ J % L J% IL I JI JLIK: W J J K% N JI K J J K K JK: W NI JLJ J L JI N JJPI NJK: W JJP I IKKNIK% N RI NJ JI NJ K JIJ KJ L JJ IK: W J P NINKJ IK/ P J IK NJ JL: W NKJ I IIJJI K II J K% N KIKN J JNI I NJL K I NII NJK%NKJ IK/ I NJK% I JI NJKKNK IJ KLKJNIL K: KINJ KJ NKJ IK%KNKJ LK J J K% JK% JIKN KKIKN J ? 7I J IJKNJ R K JJ JP LJ I NI NK KK ***%KR KJ NKJILKN KJIJ JK IJKJJ JP L J I KKKPI NI NK KKK **: W IJJ NKJILKN IJ NII NJK KIPK% N J JI NJ P JL K JRI JII NJKNKJ JIRJ NII NJK%KNKK JRIJ I KKJ R# JK NI JKJ$1K%KR K NI N ILKIPK I KJI N : W NKJ II NJ K I J LJI K% N K J P K JNI NKJ I NKI NJ R I K%KNKR I I I JI K NII I KPILI KK NII NJK IJK JKN IJJ IJ JL NII NJK I K JIJNIK I NJNI KJK IM % NI II NJ I KI I RII JIL P J IK%KNK J K K J #J I KK IK%J I J IK K J = I KK IK NI ILI NJ I KJJMJ L NI II NJ KJL LPK J L RII KJ NIIII NJK% JJKI JI J JMJ J KJKI NIIIJ RII II NJK L NIIJK JK% I NI ILI NJK IIK JIJIKI NIM I NJKK % NII KKI I JKIK LIK 'I J K J J K K JK% N KJ JI K IN J K%IK JK JIKKJ NK L8NIKJ K !P NJNI %KK L JKJ% ( %K K% JI IJ K L N JIK% K NI NK KKJPJKI JIJ I I IIK NI IJ KI LN KN L JJK K LKJI NJ% RJI K KJ K KN K IJI KP L I I IIK ' I PI%K K NJKJ1 N J I .1< NIIP N IJK LI I+%**+%RJIP NI KJ JI NJ *.< NIJ J IP N #KIKN J% NI IJ K NI IKN JK% N NI JLJ MNJ NI NK KKKJIJL% NJNI% KK JKJ%K %P % IK I NJK% J I NII NJK%IJJKPIK LJ L N I I J IK NJK NI JI #PIK K II J KI L NI% N IKK IK R I RJ: K I N IJ JL K % JIL% IJI L:I JIKJIJK:JJIIJ: J : RIJ M JNIK L NK KKK% N IKJINJNI: IKK N L J: RI KNI K #PIK K I J K K J LI I NII NJK J I J IKJ NI IJ IKN JK NK KKK K% N II I IJOJ PKJ JK NI NK KK # R JNI I IK N IJ JLL K J IKIJ J JLIKK%I II R KJK IINP JL J IJ IJK%IN QNJL%PIKJK NIKN IK% NIK N JIIJK% N KJJNJ K KNIIK%KKJ I JK% K JP N NI KJIN JK KJ IK JIL IJ -*
Trade policies and disputes at times result in increased tariffs, trade barriers, and other protectionist measures, which can increase our manufacturing costs, make our products less competitive, reduce demand for our products, limit our ability to sell to certain customers, limit our ability to procure components or raw materials, or impede or slow the movement of our goods across borders. Increasing protectionism and economic nationalism may lead to further changes in trade policies and regulations, domestic sourcing initiatives, or other formal and informal measures that could make it more difficult to sell our products in, or restrict our access to, some markets. They can also result in declining consumer confidence and slowing economic growth or recession, and could cause our customers to reduce, cancel, or alter the timing of their purchases with us. Sustained geopolitical tensions could lead to long-term changes in global trade and technology supply chains, domestic sourcing initiatives, and decoupling of global trade networks, which could make it more difficult to sell our products in, or restrict our access to, some markets and have a material adverse effect on our business and growth prospects. In particular, geopolitical and trade tensions between the US and China, one of our largest markets, have led to increased tariffs and trade restrictions, including tariffs applicable to some of our products, and have affected customer ordering patterns. Further, the US has imposed restrictions on the export of US-regulated products and technology to certain Chinese technology companies, including certain of our customers. Specifically, in 2022 the US significantly increased US export controls on semiconductor manufacturing equipment and on artificial intelligence and advanced computing products. In 2023, the US added to the restrictions in all three areas and also worked with Japan and the Netherlands to align on additional restrictions on semiconductor manufacturing equipment. During this time, the US has increasingly added Chinese companies to prohibited lists. In response, China has restricted US access to certain minerals and has blocked certain companies that provide products to Taiwan's military from selling products in China. These restrictions have in some instances reduced our sales and in a number of instances required specific governmental authorizations or exceptions - $3.2 billion, or 6%, of our 2023 revenue was dependent upon US government export control authorizations, an amount that we expect may increase in future years. These and potential future restrictions could adversely affect our financial performance and result in reputational harm to us. In addition, a number of semiconductor companies in China, including Semiconductor Manufacturing International Corporation (SMIC), are making significant investments, in many instances with the support of the Chinese government, in advanced semiconductor technologies to enable such companies to develop products and technologies that compete with ours. It is difficult to predict what further trade-related actions governments may take, the extent to which we may be able to mitigate the effects of any such actions, and the longer-term implications of such actions on the market opportunities for us and the competition we may face. We can also be adversely affected by other global and regional factors that periodically occur, including: • geopolitical and security issues, such as armed conflict and civil or military unrest, political instability, human rights concerns, and terrorist activity, including, for example: Russia's war with Ukraine, initiated in 2022, which resulted: in the imposition of financial and other sanctions and export controls against Russia and Belarus that caused us and other companies to limit or suspend Russian operations (we had no exports to Russia in 2023); Russia-imposed currency restrictions and regulations and other retaliatory trade and other actions; increased supply, commodity, and other costs; and increased risk of cyberattacks; tensions and conflict affecting Israel, where we have multiple semiconductor development centers and a leading-edge manufacturing facility and where our Mobileye business is headquartered and has most of its operations, and in surrounding areas, such as past conflicts in Lebanon and the current conflict in the Red Sea; and rising tensions between China and Taiwan; • natural disasters, public health issues (including pandemics), and other catastrophic events; • inefficient infrastructure and other disruptions, such as supply chain interruptions, materials shortages or delays, and large-scale outages or unreliable provision of services from utilities, transportation, data hosting, or telecommunications providers; • formal or informal imposition of new or revised export, import, or doing-business regulations, including trade sanctions, tariffs, and changes in the ability to obtain export licenses, which could be changed without notice; • government restrictions on, or nationalization of, our operations in any country, or restrictions on our ability to repatriate earnings from or distribute compensation or other funds in a particular country; • adverse changes relating to government grants, tax credits, or other government incentives, including more favorable incentives provided to competitors; • differing employment practices and labor issues, including restricted access to talent; • ineffective legal protection of our IP rights in certain countries; • local business and cultural factors that differ from our current standards and practices; • continuing uncertainty regarding social, political, immigration, and tax and trade policies in the US and abroad; and • fluctuations in the market values of our domestic and international investments, and in the capital and credit markets, which can be negatively affected by liquidity, credit deterioration or losses, interest rate changes, financial results, political risk, sovereign risk, or other factors. intel. Risk Factors and Other Key Information 53 I K KNJKJJKIKN J IKJIK%JI IIIK% JII JJ KJKNIK%R IK NI NJNI KJK% NII NJK KK JJP%IN I NII NJK% J NI JLJ K J IJ NKJ IK% J NI JLJ I NI JK IIRJI K% I IK RJ P J NI KI KK IIK IK I JJ K J KL J NIJI K JI K IN J K% KJK NI JJPK% I JI I I KNIKJJ N J IN JJ K NII NJK % IIKJIJ NIKKJ %K IJK L K IKN J KNI K R I RJ IIKK % N NK NINKJ IKJ IN% % I JIJJ JINIKKRJNK NKJ J J K K N J JI K JI J LKN L K% KJK NI JJPK% N JI JR IK%R N J IN JJ K NII NJK % IIKJIJ NIKKJ %K IJK PJI PIKJ NI NK KK I RJI KJK IJN I% J JIJ K K JR J1 % NI IKJIJK%P J IKJIK JI IKJIJ K% N JIK J K NII NJK% PJNKJ I II JJI K NIJI%J1K KIKJIJ K JM IJ 1IN JI NJK J LJ IJ KJ L K% N IJ NINKJ IK L% ***J1K J L IK1M IJ JI K K NJ I NJNI QN J IJ J P NJ I NJK **+%J1J JIKJIJ K JIIK K R IRJ @ J&JI KJ J IKJIJ K K NJ I NJNI QN J NI JKJ%J1K IK L K KJ I J KJK IK K% KIKJIJ1KKJ IJ I K K IJ KJJI PI NJKJ R /K JILI K I NJK KIKJIJ KP K KJ KIN NIK K N I KJ KIQNIK PI J NJ IOJ K IMJ K;+ * % I 3<% NI**+IP NRK JN 1 PI JM IJ JI NJ IOJ K% N JJJRMJL IK NJNILIK K J J NJNIIKJIJ K N PIK LJ NI I I IKN J INJJ IJ NK J % N I K NJ I K % N NJ I' NJNI JI J I IJ 5' 6% I K J PKJ JK% L KJ KRJJKN IJ J K PI J% P K NJ I J KJ KN KJ P I NJK J KJJ JRJ NIK JKN JJ IJRJNIJI JII JJ K PI JKLJ%JMJ JJ RRL J JJJJK LKNJ K% J IJI J K KNJ K JIJ IJN JK INK J JJ RL ! K PIK LJ L JI I J IKJJI L NI% N 9 W J KNIJLKKNK%KNKI J P I JILN IKJ% J KJ JL%N IJK I K% JII IKJJPJL% N % IM 9 W NKKTKRIRJ1I % JJ ***%RIKN J9 J KJ JIK J K M IJ JI K KJ NKK ) INKJJNKNK JI KJ J IKNK NKK IJ K5R M IJKJ NKK **+6: NKK KNII LIKJIJ K IN J K JIIJ J ILJI JIJ K: IKKN L% JL% JI KJK: IKIK L IJJK: W J K K JJ KI %RIRPN J K NJ IP J JIK NJNI JL RI NI' L NK KKKQNIJI K KJ JK IJ K% KNII N IK%KNKKJ JK 0 JNII J J J : W IK J K K JR R : W JNI KKJIK%N JKKNK5 N K6% JIJKJI P JK: W J IKJINJNI JIKINJ K%KNKKN L JIINJ K%JI KK IJK I LK% IK NJK IN I I PK KIPKI NJ JK%JI K IJJ %J KJ % IJ N J KI PIK: W I I I KJ R IIPKM IJ% IJ% I NK KKIN J K% N JIK J K%JIK% K J JLJ J M IJ KK%R N RJ NJ J: W PI JIKJIJ K % I J OJ % NI IJ K L N JIL% IIKJIJ K NI JLJ IJIJI K I IKJI NJ KJ I JIN K IJN I N JIL: W PIK KI J J PI JI JK%JMIJK% I JI PI J JPK% N IP I JPK I PJ JJ IK: W I L JIJK IKKNK% N IKJIJKKJ J J: W JP I JJ NI $IJK IJ N JIK: W NK KK N JNI J IKJJII NINII JKJ IK IJK: W J N N IJ JLII K % J %IJ % JM JI K J1 I : W NJNJ K JIJP NK NI KJ JI J PKJ JK% JJ IJIJK%R JP LJ L QNJL%IJJI IJ I KKK% JIKJIJ K% IKN JK% J IK%K PI IK% I JIJ IK KJ IK JIL IJ -+
We are subject to numerous risks associated with the evolving market for products with Al capabilities. The markets and use cases for products with Al capabilities have been rapidly evolving, are difficult to predict and may impact demand for our products. For example, in the last few years the demand for high-end GPUs for model training increased dramatically and has resulted and may continue to result in a significant shift in DCAI customer spend. The significant investments we have made to develop products and software to address what we believe will be increasing demand for Al capabilities may be insufficient, and we face significant hurdles, including whether demand will materialize, whether third-party developers will develop the software to utilize the Al capabilities of our products, and whether we will be successful in developing products that can compete with offerings by established competitors. Our use of Al technology may subject us to reputational, financial, legal, or regulatory risks. As we incorporate Al technology into our products and services, any failure to address concerns relating to the responsible use of the evolving Al technology in our products and services may cause harm to our reputation or financial liability and, as such, may increase our costs to address or mitigate such risks and issues. Al technology may create ethical issues, generate defective algorithms, and present other risks that create challenges with respect to its adoption. In addition, evolving rules, regulations, and industry standards governing Al may require us to expend significant resources to modify, maintain, or align our business practices or products to comply with US and non-US rules and regulations, the nature of which cannot be determined at this time. Several jurisdictions around the globe, including the EU and certain US states, have already proposed or enacted laws governing Al. US federal agencies are likely to release Al regulations in the near future in light of the Biden administration's October 30, 2023 Executive Order on Al. The regulatory environment surrounding the impact of the implementation of Al on our products and services may adversely affect our ability to produce and export products and as a result may cause harm to our reputation and financial liability. We rely upon a complex global supply chain. We have a highly complex global supply chain composed of thousands of suppliers. These suppliers provide direct materials for our production processes; supply tools, equipment, and IP (via licenses) for our factories; deliver logistics and packaging services; and supply software, lab and office equipment, and other goods and services used in our business. We also rely on suppliers to provide certain components for our products and to manufacture and assemble and test some of our components and products. From time to time, we are negatively impacted by supply chain issues, including: • suppliers extending lead times, experiencing capacity constraints, limiting or canceling supply, allocating supply to other customers including competitors, delaying or canceling deliveries, or increasing prices; • supplier quality issues; • cybersecurity events, IP or other litigation, man-made or natural disasters, public health issues (including pandemics), operational failures, or other events that disrupt suppliers; • long lead times to qualify alternate or additional suppliers, or the unavailability of qualified alternate suppliers; and • increased legislation, regulation, or stakeholder expectations regarding responsible sourcing practices, such as heightened reporting and other obligations with regard to environmental impacts, the risk of forced labor, or supplier conduct that does not meet such standards, which can result in supply chain disruptions, the loss of a supplier, and the government seizure of goods. These and other supply chain issues can increase our costs, disrupt or reduce our production, delay our product shipments, prevent us from meeting customer demand, damage our customer relationships, or negatively affect our reputation. They may keep us from successfully implementing our business strategy and can materially harm our business, competitive position, results of operation, and financial condition. From time to time, our customers experience disruptions or shortages in their own supply chains that constrain their demand for our products. During the past several years, macroeconomic and geopolitical conditions, as well as outbreaks of COVID-19, caused supply chain disruptions and delays in obtaining tools and other components, and the semiconductor industry experienced widespread shortages of substrates and other components and available foundry manufacturing capacity. These shortages have previously limited our ability to supply customer demand in certain of our businesses, and have adversely affected customer demand for our products, as some customers have been unable to procure sufficient quantities of third-party components used together with our products to produce finished systems. It is difficult to predict the future impact of these shortages when they occur. To obtain future supply of certain materials and components, particularly substrates, and third-party foundry manufacturing capacity, we have entered into arrangements with some of our suppliers that involve long-term purchase commitments and/or large prepayments. These arrangements may not be adequate to meet our requirements, or our suppliers may fail to deliver committed volumes on time or at all, or their financial condition may deteriorate. If future customer demand over the horizon of such arrangements falls below our expectations, we could have excess or obsolete inventory, unneeded capacity, and increased costs, and our prepayments may not be fully utilized, and in some cases may not be fully recoverable. We utilize third-party foundries and component suppliers to manufacture or supply certain components and products for areas such as networking, communications, graphics, programmable semiconductor solutions, and memory. As part of our IDM 2.0 strategy, we expect to increase our use of third-party foundries. Delays in the development of foundries' future manufacturing processes could delay the introduction of products or components we design for such processes, and insufficient foundry capacity could prevent us from meeting customer demand. We typically have less control over delivery schedules, design and manufacturing co-optimization, yields, quality, product quantities, and costs for components and products that are manufactured by third parties. intel. Risk Factors and Other Key Information 54 !IKN 8JJ NI NKIKKKK JRJJP P IJ II NJKRJ# JK IJK NKKK II NJKRJ# JKP I LP P %IN JJ IJ LJ I NII NJK IM % J KJRLIKJ I "$1K I JI IKIJ L K IKN J L J NJ IKN J K JKJ # NKJ IK K J PKJ JKRPJ P I NJK K JRIJ IKKRJR PR IK I# JKL KN J% RK J NI K% N RJI R JI O%RJIJIIJLP IKR P JK JRIJ NJ OJ# JK NII NJK% RJIRR KNKKN P I NJKJJ JRJ I K LKJ K JJ IK NINK # J LLKN 8JNKJ INJJ % % % IIN J ILIKK #KR I IJ# J L J NI I NJK KIPK% L NIJ IKK I KI J J JIK K NK JP P # J L NII NJK KIPKLNKIJ NIINJJ I JL %KKN%L IK NI KJKJ IKK IJJKNIKK KKNK # J LLIJJ KKNK% IJJP IJK% IK J JIIKKJJIJ KRJIKJ J JK J J %P P IN K%IN J K% NKJILKJ IK PI # LIQNINKJ M K JIK NIK J L% J % I NI NK KKIJK II NJKJ LRJ1 1IN K IN J K%J JNI R J JI JJKJ PI 8NIKJ KI N J % N J 1 IJ 1KJJK%P ILI K I J RK PI # 1I KI LJ I K# IN J K J INJNI J J) KJIJ TKJ I+%**+ MNJPII # IN J IL PI JKNII N JJ J JJ # NII NJK KIPKLPIK LJ NI JLJ I N M IJI NJK KIKN JLNKIJ NI INJJ JL !I LN M KN L !P L M KN L K J NK K KN IK KKN IKI PIJJI K I NI I NJ I KKK:KN LJ K%QN J% $5P KK6 I NIJ IK: PI KJK KIPK: KN L K JRI% QN J% JI K KIPKNK NI NK KK ! K I L KN IKJ I PIJ JK I NII NJK J NJNI KK JKJK NI JK I NJK I JJ J%R I JP LJ LKN L KKNK% N 9 W KN IKMJ JK%MI JL KJI JK% J I KN L% J KN LJ JI NKJ IK N JJ IK% L I PIK% I IK IK: W KN IQN JLKKNK: W L IKNIJLP JK% $ I JI JJ % I JNI KKJIK%N JKKNK5 N K6% IJ NIK% I JIP JKJJKINJKN IK: W JKJ QN L JI J IJ KN IK% IJN P JL QN JI JKN IK: W IK K J %IN J % IKJ IMJJ KII IK K K NI IJK%KNKJ I IJ JI J KRJIIJ PI J JK%JIK I I% IKN I NJJJ K J JKNKJ IK%R IKN J KN L KINJ K%J KK KN I% J PI JKONI K K JIKN L KKNK IK NI KJK%KINJ IIN NII NJ % L NII NJK JK%IP JNK I J NKJ I % NINKJ II J KK% I JP LJ NIINJJ LLNKI KNKKN L J NI NK KKKJIJL JI LI NI NK KK% JJP KJ %IKN JK IJ % J I JJ J% NINKJ IKMI KINJ K IK IJK JI R KN L KJJ KJI JI I NII NJK NI JKJKPI LIK%I J J K%KR K NJ IK ? 7% NKKN L KINJ K LK J J K JI JK% JK NJ I NKJILMI RKIK IJK KN KJIJK JI JK P N IL NJNI JL KK IJKP IP NK L J NI JLJ KN LNKJ I IJ NI NK KKK% PPIK LJNKJ I I NII NJK%KK NKJ IKP N J I NIKN JQN JJK JIIJL JKNKJ JIRJ NI I NJKJ I N KKLKJK JKN JJ IJJNJNIJ JKK IJKR JL NI J NJNIKN L IJ JI K JK%IJN I LKN KJIJK% JIIJL N IL NJNI JL%R P JI J II JKRJK NIKN IKJJ P P JINIK J JK 8 I IIL JK KII JKL J QNJJ J NIIQNI JK% I NIKN IKL J PI JJP NK J IJ % IJI J LJI IJ NJNINKJ I PIJ IO KNII JK K R NI MJJ K%R N PMKK I K J P J IL%N JL% IK KJK% NIIL JKL J N LNJ O% K KKL J N LI PI !NJ OJIIJL N IK JKN IKJ NJNI IKN LIJ JK I NJK IIKKNK JR I % N J K%IK%I I K NJ IK NJ K% IL #KIJ NI '* KJIJL%RMJ J IK NINK JIIJL N IK LK JP J N IKTNJNI NJNI I KKK N LJ JI NJ I NJK I JKRK IKNI KKK% KN J N ILJL N IP JNKI J NKJ I !JL LP KK JI PI PILKN K%K NJNI JOJ %L K%QN JL% I NJQN JJK% KJK I JK I NJKJJI NJNI LJIIJK KJ IK JIL IJ -1
Where possible, we seek to have several sources of supply. However, for certain components, services, materials, and equipment, we rely on a single or a limited number of suppliers, or upon suppliers in a single location, which can impact the nature, quality, availability, and pricing of the products and services available to us. For example, ASML Holding N.V. (ASML) is currently the sole supplier of EUV photolithography tools that we are deploying in our Intel 4 and subsequent manufacturing process nodes. These tools are highly complex to develop and produce, and increasingly costly, and from time to time there are increases in lead times or delays in their development and availability, which could delay the development or ramp of our future process nodes. As a further example, a limited number of third- party foundries offer leading-edge manufacturing processes, and these providers are geographically concentrated in Asia. Supplier consolidation or business failures can also reduce the pool of qualified suppliers. We are subject to the risks of product defects, errata, or other product issues. From time to time, we identify product defects, errata, and other product issues, which can result from problems in our product design or our manufacturing and assembly and test processes. Components and products we purchase or license from third-party suppliers, or gain through acquisitions, can also contain defects. Product issues also sometimes result from the interaction between our products and third- party products and software. We face risks if products that we design, manufacture, or sell, or that include our technology, cause personal injury or property damage, even where the cause is unrelated to product defects or errata. These risks may increase as our products are introduced into new devices, market segments, technologies, or applications, including transportation, autonomous driving, healthcare, communications, financial services, and other industrial, critical infrastructure, and consumer uses. Costs from defects, errata, or other product issues could include: • writing off some or all of the value of inventory; • recalling products that have been shipped; • providing product replacements or modifications; • providing consideration to customers, including reimbursement for certain costs they incur; • defending against litigation and/or paying resulting damages; • paying fines imposed by regulatory agencies; and • reputational harm. These costs could be large and may increase expenses and lower gross margin, and/or result in delay or loss of revenue. Mitigation techniques designed to address product issues, including software and firmware updates, are not always available on a timely basis—or at all—and do not always operate as intended or effectively resolve such issues for all applications. We and third parties, such as hardware and software vendors, make prioritization decisions about which product issues to address, which can delay, limit, or prevent development or deployment of a mitigation and harm our reputation and result in costs. Product defects, errata, or other product issues and/or mitigation techniques can result in product failures, adverse performance and power effects, reboots, system instability or unavailability, loss of functionality, data loss or corruption, unpredictable system behavior, decisions by customers and end users to limit or change the applications in which they use our products or product features, and other issues. Product issues can damage our reputation, negatively affect product demand, delay product releases or deployment, result in legal liability, or make our products less competitive, which could harm our business and financial results. Subsequent events or new information can develop that change our assessment of the impact of a product issue. In addition, our liability insurance coverage has certain exclusions or may not adequately cover liabilities incurred. Our insurance providers may be unable or unwilling to pay a claim, and losses not covered by insurance could be large, which could harm our financial condition. We face risks related to security vulnerabilities in our products. We or third parties regularly identify security vulnerabilities with respect to our processors and other products, as well as the operating systems and workloads that run on them and the components that interact with them. Components and IP we purchase or license from third parties for use in our products, as well as industry-standard specifications we implement in our products, are also regularly subject to security vulnerabilities. Our processors and other products are being used in application areas that create new or increased cybersecurity and privacy risks, including applications that gather and process large amounts of data, such as the cloud or Internet of Things, and critical infrastructure and automotive applications. The security vulnerabilities identified in our processors include a category known as side-channel vulnerabilities, such as the variants referred to as "Spectre" and "Meltdown." Additional categories and variants have been identified and are expected to continue to be identified. Publicity about these and other security vulnerabilities has resulted in, and is expected to continue to result in, increased attempts by third parties to identify additional vulnerabilities. Security and manageability features in our products cannot make our products absolutely secure, and these features themselves are subject to vulnerabilities and attempts by third parties to identify additional vulnerabilities. Vulnerabilities are not always mitigated before they become known. We, our customers, and the users of our products do not always promptly learn of or have the ability to fully assess the magnitude or effects of a vulnerability, including the extent, if any, to which a vulnerability has been exploited. Subsequent events or new information can develop that changes our assessment of the impact of a security vulnerability, including additional information learned as we develop and deploy mitigations or updates, become aware of additional variants, evaluate the competitiveness of existing and new products, and address future warranty or other claims or customer satisfaction considerations, as well as developments in the course of any litigation or regulatory inquiries or actions over these matters. intel. Risk Factors and Other Key Information 55 !I KK %RKJ PKPI K NIK KN L > RPI% IIJ JK%KIPK%JI K% QN J%R I L K I J N I KN IK% IN KN IK K J %R JJ JNI%QN JL%P JL% I JI NJK KIPKP J NK IM %#'0> & ? 5#'06KNII J LJK KN I 1? J J ILJ KJJRI L NI J 1 KN KQN J NJNI I KK K KJ KI L M J P I N% IK L KJ L% I JJ JJII IKK JK I LK JIP J P JL%R N LJP J II NINJNII KK K #KNIJIM % J N I JI IJL N IK I NJNI I KKK% JKI PIKI I L JIJ #K N I K J I NK KK NIK K INJ QN KN IK !IKN 8JJ JIKK I NJJK%IIJ% I JII NJKKNK I JJ J%R JLI NJJK%IIJ% JII NJKKNK%R IKN JI I K NII NJK I NI NJNI KK L JKJI KKK JK I NJKRNIK I KI JIIJLKN IK% I JI NQNKJ K% K J JK $I NJKKNK K K JKIKN JI J JIJ JR NII NJK JI IJLI NJK K JRI !IKKI NJKJJRK % NJNI% IK % IJJ N NIJ L%NKIK 8NIL II IJL%P RIJNKKN I JJ I NJJK IIIJ KIKKL IKK NII NJKI JI N J RPK%IJK JK%J K% I J K% N JI K IJJ %NJ NKIP % JI% N J K% KIPK% JI NKJI %IJ IKJINJNI% KNINKK KJKI JK%IIJ% I JII NJKKNK N N9 W RIJ K I JP N P J IL: W I I NJKJJP K: W I P I NJI JK I J K: W I P KIJ J NKJ IK% N I NIK J IIJ KJKJL NI: W KJ JJ 8 IL IKN J K: W L K K LIN J IL K: W INJJ I K KJK N I L IKM KK RII KKI % 8 IIKN J L I KK IP N 'JJ J QNKK J IKKI NJKKNK% N K JRI IRINJK%I J RLKP J L KKZ I J Z J RLK IJK J IJP LIK PKNKKNK I J K ! JIIJK%KNK IRI K JRIP IK%I IJOJ K K NJRI NJKKNKJ IKK%R L% J% IIP J P J I L J JJ I NIINJJ IKN J KJK $I NJJK%IIJ% I JII NJKKNK 8 IJJ J QNK IKN J I NJ NIK%PIKI I RIJK%I JK%KLKJ KJ JL I N P JL% KK N J JL%J KK I IINJ %N IJ KLKJ P I%K K LNKJ IK NKIKJ J I J J K RJLNK NII NJK II NJJNIK% JIKKNK $I NJKKNK NIINJJ % JP LJI NJ % LI NJI KK I L J%IKN J JL% I NII NJK KK JJP% R N I NI NK KK IKN JK N KQN JP JK I R IJ P JJ NIKKKK J JJ I NJKKN J % NI JL KNI PIKIJ M NK K IL JQNJ L PI JK NII NI KNI I PIKL N IN R J L % KKK J PI L KNI N I%R N I NI J !IKKI JJ KNIJLPN I JK NII NJK ! IJIIJKIN I L JLKNIJLPN I JKRJIKJJ NII KK IK JII NJK%KR KJ IJ KLKJK R I KJJIN J J JKJJ JIJRJJ JK $RNIK I KI JIIJK INK NII NJK%KR K NKJILKJ IKJ KR J NII NJK%I K IN I LKN 8JJ KNIJLPN I JK NII KK IK JII NJKI NK J IKJJIJ R I IKL IKNIJL IPLIKK% N J KJJJI I KK I N JK J%KNKJ N I JI J K% IJ IKJINJNI NJ JP J K KNIJLPN I JK J NII KK IK NJ IL R K K PN I JK%KNKJPI JKIIIJ KEJIE E' J R E#J J IK PI JKP J IMJJ J NJ J $N JL NJJK JIKNIJLPN I JKKIKN J % K MJJ J NJ IKN J % IKJJJK LJIIJKJ JLJ PN I JK NIJL JL JNIK NII NJK J NII NJK K NJ LKNI% JKJNIKJK PKIKN 8JJ PN I JK JJJK LJIIJKJ JLJ PN I JK ?N I JKI J RLKJJ IJL R !% NI NKJ IK% JNKIK NII NJK J RLKI J L I IPJ JLJ N LKKKKJ JN IJK PN I JL% N JMJ J% L%J RPN I JLK M J N KQN JP JK I R IJ P JJ K NIKKKK J JJ KNIJLPN I JL% N J IJ I KRP L JJ K INJK% RI J PI JK%P NJJ JJP KK MKJ RI NJK% IKK NJNIRII JL I JI K INKJ IKJKJ KIJ K%KR KP JK J NIK L JJ I IN J IL QNIK IJ K PIJKJJIK KJ IK JIL IJ --
Mitigation techniques designed to address security vulnerabilities in our products, including software and firmware updates or other preventative measures, are not always available on a timely basis—or at all—and at times do not operate as intended or effectively resolve vulnerabilities for all applications. In addition, we are often required to rely on third parties, including hardware, software, and services vendors, as well as our customers and end users, to develop and/or deploy mitigation techniques, and the availability, effectiveness, and performance impact of mitigation techniques can depend solely or in part on the actions of these third parties in determining whether, when, and how to develop and deploy mitigations. Export restrictions may impede our ability to provide updates or patches to customers in certain geographies or that appear on sanctions lists, potentially leaving systems unpatched and open to exploitation. Further, sanctions lists may include third parties with whom we need to interact for coordinated vulnerability disclosure, which may impair our ability to receive information about vulnerabilities and to deliver mitigations for them. We and such third parties make prioritization decisions about which vulnerabilities to address, which can delay, limit, or prevent development or deployment of a mitigation and harm our reputation. Security vulnerabilities and/or mitigation techniques can result in adverse performance or power effects, reboots, system instability or unavailability, loss of functionality, data loss or corruption, unpredictable system behavior, decisions by customers and end users to limit or change the applications in which they use our products or product features, and/or the misappropriation of data by third parties. Security vulnerabilities and any limitations or adverse effects of mitigation techniques can adversely affect our results of operations, financial condition, customer relationships, prospects, and reputation in a number of ways, any of which may be material. For example, whether or not vulnerabilities involve attempted or successful exploits, they may result in our incurring significant costs related to developing and deploying updates and mitigations, writing down inventory value, defending against product claims and litigation, responding to regulatory inquiries or actions, paying damages, addressing customer satisfaction considerations, providing product replacements or modifications, or taking other remedial steps with respect to third parties. Adverse publicity about security vulnerabilities or mitigations could damage our reputation with customers or users and reduce demand for our products and services. These effects may be greater to the extent that competing products are not susceptible to the same vulnerabilities or if vulnerabilities can be more effectively mitigated in competing products. Moreover, third parties can release information regarding potential vulnerabilities of our products before mitigations are available, which, in turn, could lead to attempted or successful exploits, adversely affect our ability to introduce mitigations, or otherwise harm our business and reputation. We are subject to increasing and evolving cybersecurity threats and privacy risks. We face significant and persistent cybersecurity risks due to: the breadth of geographies, networks, and systems we must defend against cybersecurity attacks; the complexity, technical sophistication, value, and widespread use of our systems, products and processes; the attractiveness of our systems, products and processes to threat actors (including state-sponsored organizations) seeking to inflict harm on us or our customers; the substantial level of harm that could occur to us and our customers were we to suffer impacts of a material cybersecurity incident; and our use of third-party products, services and components. Such an incident, whether or not successful, could result in our incurring significant costs related to, for example, rebuilding our internal systems, writing down inventory value, implementing additional threat protection measures, providing modifications to our products and services, defending against litigation or enforcement proceedings, paying damages, providing customers with incentives to maintain a business relationship with us, or taking other remedial steps with respect to third parties, as well as incurring significant reputational harm. We regularly face attempts by malicious attackers who attempt to gain access to our network or data centers or those of our suppliers, customers, partners, end users, or other third parties; steal proprietary, personal, or confidential information related to our business, products, employees, suppliers, or customers; introduce malicious software to our systems or those of our suppliers, customers, partners, end users, or other third parties; interrupt our systems and services or those of our suppliers, customers, or others; or demand ransom to return control of such systems and services. As we grow certain emerging business lines, such as our foundry business and our cloud computing and software-as-a-service offerings, we expect to collect or host significant amounts of highly sensitive customer data, which may increasingly make us a target of attempts to steal or corrupt that data. Individuals and organizations, including malicious hackers, state-sponsored organizations, insider threats including employees and third-party service providers, and intruders into our physical facilities, at times attempt to gain unauthorized access to and/or corrupt the processes used to design and manufacture our hardware products and our associated software and services. We are also a frequent target of attackers that intend to sabotage, compromise, take control of, or otherwise corrupt our manufacturing or other processes, products, and services. In some instances, we, our suppliers, our customers, and the users of our products and services may be unaware of a threat or incident or its magnitude and effects, or we may be unable to timely mitigate the impacts of an incident. Cyber attack attempts are increasing in number, magnitude, and technical sophistication, and if successful may expose us and the affected parties to loss or misuse of proprietary or confidential information or disruptions to our business operations, including our manufacturing operations, and could impact our financial results. We expect emerging technologies to contribute to the increasing sophistication of attacks and to lead to new threats. For example, threat actors may leverage emerging Al technologies to develop new hacking tools and attack vectors, exploit vulnerabilities, obscure their activities, and increase the difficulty of threat attribution. As a developer of leading-node processes and widely utilized products, we have been, and expect to continue to be, the subject of intense efforts by sophisticated cyber adversaries, including state-sponsored organizations, who seek to compromise our systems, disrupt our operations or those of users of our products, or steal trade secrets. As geopolitical or armed global conflicts escalate, attacks against us, our customers, or our strategic allies may similarly intensify. For example, from 2019 to 2021, we, along with other companies with meaningful operations in Israel, were targets of concerted cyberattacks. In the fourth quarter of 2020, our Habana Labs subsidiary's network was breached in connection with a suspected unsuccessful ransomware attack, resulting in unauthorized third-party access of certain confidential information. intel. Risk Factors and Other Key Information 56 'JJ J QNKK J IKKKNIJLPN I JK NII NJK% N K JRI IRINJK I JI IP JJPKNIK%I J RLKP J L KKZ IJ Z JJK J IJK J IJP L IK PPN I JK I J K J %RI J IQNIJ I L JIIJK% N IRI%K JRI% KIPKP IK%KR K NINKJ IK NKIK%J P 8 I LJJ J QNK% JP JL% JP KK% I I J JJ J QNK K L I IJ JJ K JKJIIJK JI RJI%R % RJ P LJJ K M IJIKJIJ KL NI JLJ I PNJK I JKJ NKJ IK IJ IK IJJI K J K KJK% J J L P KLKJKN J J M JJ NIJI%K J K KJKL NJIIJKRJR R J JIJ I I JPN I JLK KNI%R LI NI JLJ IP IJ NJPN I JK J PIJJ K IJ ! KNJIIJK I IJOJ K K NJRPN I JKJ IKK%R L% J% IIP JP J I L J JJ I NIINJJ NIJLPN I JK 8 IJJ J QNK IKN J PIKI I I RIJK%I JK% KLKJ KJ JL IN P JL% KK N J JL%J KK I IINJ %N IJ KLKJ P I%K K LNKJ IK NKIKJ J I J J K RJLNK NII NJK II NJJNIK% 8 IJKI IJ J L JIIJK NIJLPN I JK L JJ K IPIKJK JJ J QNK PIK LJ NIIKN JK IJ K% J %NKJ II J KK%I KJK% INJJ N I RLK% L RL JI IM % RJI I JPN I JK P PJJJ IKNKKN M JK%JLLIKN J NI NII K J KJKI JJ P L NJK JJ K%RIJ R P J ILP N% KJI NJ K JJ % IK J IN J IL QNIK IJ K%L K%IKK NKJ IKJKJ KIJ K%I P I NJ I JK I J K% IJ JII KJKRJIKJJ JIIJK #PIKN JL NJKNIJLPN I JK IJJ K N NIINJJ RJNKJ IK INKIK IN I NII NJK KIPK KJKL IJIJ JMJ JJJ J I NJKI JKNKJ J JKPN I JK IPN I JK IJP L JJ J I NJK ' I PI%JIIJK I K IJ II J J PN I JK NII NJK I JJ KIP %R% JNI % N J JJJ IKNKKN M JK%PIK LJ NI JLJ JI NJJ K% I JIRKI NI NK KK INJJ !IKN 8JJ IK P P L IKNIJLJIJK IPLIKK !K J IKKJ JL IKNIJLIKKNJ 9J IJ IK% JR IK% KLKJKRNKJ KJ L IKNIJLJJK:J MJL%J K KJJ %P N% RKINK NIKLKJK%I NJK I KKK:J JJIJP KK NIKLKJK%I NJK I KKKJ JIJJ IK5 N KJJK K I I OJ K6K J JI NK I NINKJ IK:JKN KJ J P IJJ N NIJ NK NINKJ IKRIRJ KNIJK JI L IKNIJL J: NINK JIIJLI NJK%KIPK JK N J%RJI I JKNKKN % N IKN J NI NII K J KJKI JJ % IM %I N NI JI KLKJK%RIJ R P J ILP N% J J JIJI JJ KNIK%I P J KJ NII NJK KIPK% KJ JJ I I J I K%L K%I P NKJ IKRJ JPKJ J NK KKI J KRJNK% IJ JII KJKRJIKJJ JIIJK%KR K NII K JINJJ I !IN I LJJJK L NKJJIK R JJJJ KKJ NI JR I IJ JIK IJ K NIKN IK%NKJ IK%IJ IK% NKIK% I JIJIIJK: KJ I IJIL%IK % I J IJ I JJ NI NK KK%I NJK% LK%KN IK% INKJ IK: JI N NKK JRIJ NIKLKJK IJ K NIKN IK%NKJ IK%IJ IK% NKIK% I JIJIIJK: JIINJ NIKLKJK KIPK IJ K NIKN IK%NKJ IK% I JIK: I I K J IJNI JI KNKLKJK KIPK #KR I RIJ I NK KK K%KNK NI N IL NK KK NI N NJ K JRIKKIP I K%R MJJ J I KJK J N JK LK KJPNKJ IJ%RL IK LNKJIJ JJJKJ KJ I IINJJJJ PN K I OJ K% N NKIK%KJJK K I I OJ K% KIJIJK N LK JIIJLKIPI PIK% JINIK J NILK JK%JJKJJJJ N NJ IO KKJ 8 I IINJJI KKKNKJ K NJNI NIIRII NJK NIKK JK JRI KIPK !I K IQN JJIJ JJIKJJ J J K J% I K%J JI % I JIRK IINJ NI NJNI I JII KKK%I NJK% KIPK K KJ K%R% NIKN IK% NINKJ IK% JNKIK NII NJK KIPK L N RI JIJ I J IJK JN JK% IRL N J J LJJJJK J L IJJJJJKI IK N I% JN% J K KJJ % KNKKN LM KNK J JIJKJ KK IKNK I IJIL I J IJ IKINJ KJ NI NK KK IJ K% N NI NJNI IJ K% N J NI IKN JK !MJI J KJ JI NJJ J IK K KJJ JJK J J RJIJK IM %JIJJ IKL PII # J KJ P R J K JJPJ IK%M JPN I JK% KNIJIJPJK% IKJN JL JIJJJI NJ #KP I I KKK R LNJ OI NJK%RP % MJJ J NJ %JKN 8J J K IJK LK KJJL IPIKIK% N KJJK K I I OJ K%R KJ I K NIKLKJK%KINJ NI IJ K IJ K NKIK NII NJK% IKJ JIKIJK #K J II JKK J%JJK KJ NK% NINKJ IK% I NIKJIJ KLK I L J KL IM %I *7J **%R% RJ JI KRJ N IJ K KI %RIJIJK IJL IJJK J NIJQNIJI **% NI> 0 KKN KILTK JR IRK I J RJKNKJN KNKKN I K RIJJ%IKN J N NJ IOJIIJLKK IJ J IJ KJ IK JIL IJ -3
We are also subject to risks associated with attacks on products, services and components in our supply chain, such as the 2020 compromise of IT infrastructure management software provided by SolarWinds Corporation. These providers can experience breaches of their systems and products, or provide inadequate updates or support, which can impact the security of our systems and our proprietary or confidential information. Since 2021, we have observed an increase in ransomware attacks in our supply chain. In December 2021, a vulnerability named "Log4Shell" was reported for the widely used Java logging library, Apache Log4j* 2, and similar vulnerabilities affecting commonly used programs and tools were reported in 2022 and 2023. We are required to comply with stringent, complex, and evolving laws, rules, regulations, and standards in many jurisdictions, as well as contractual obligations, relating to cybersecurity and data privacy. Our compliance efforts are complicated by the fact that these requirements and obligations may be subject to uncertain or inconsistent interpretations and enforcement, and may conflict among various jurisdictions. Any failure or perceived failure by us to comply with applicable laws, rules, regulations, standards, certifications, or contractual obligations, or any compromise of security that results in unauthorized access to, or unauthorized loss, destruction, use, modification, acquisition, disclosure, release, or transfer of personal information, may result in outcomes such as: requirements to modify or cease certain operations or practices; the expenditure of substantial costs, time, and other resources; proceedings or actions against us; legal liability; governmental investigations; enforcement actions; claims; fines; judgments; awards; penalties; sanctions; and potentially costly litigation (including class actions). The theft, loss, or misuse of personal data collected, used, stored, or transferred by us to run our business, including data stored with vendors or other third parties, could result in significantly increased business and security costs or costs related to defending legal claims. Costs to comply with and implement privacy-related and data-protection measures are significant, and noncompliance could expose us to significant monetary penalties, damage to our reputation, suspension of online services or sites in certain countries, and even criminal sanctions. Even our inadvertent failure to comply with federal, state, or international privacy-related or data-protection laws and regulations could result in audits, regulatory inquiries, or proceedings against us by governmental entities or other third parties. We are subject to IP risks, including related litigation and regulatory proceedings. We cannot always protect our IP or enforce our IP rights. We regard our patents, copyrights, trade secrets, and other IP rights as important to the success of our business. We rely on IP law—as well as confidentiality and licensing agreements with our customers, employees, technology development partners, and others—to protect our IP and IP rights. Our ability to enforce these rights is subject to general litigation risks, as well as uncertainty as to the enforceability of our IP rights in various countries and other geopolitical factors. We are not always able to obtain protection for our IP or enforce or protect our IP rights. When we seek to enforce our rights, we may be subject to claims that our IP rights are invalid, not enforceable, or licensed to an opposing party. Our assertion of IP rights may result in another party seeking to assert claims against us, which could harm our business. From time to time, governments adopt regulations— and governments or courts render decisions—requiring compulsory licensing of IP rights, or governments require products to meet standards that favor local companies. Our inability to enforce our IP rights under any of these circumstances can harm our competitive position and business. In some cases, our IP rights can offer inadequate protection for our innovations. In addition, the theft or unauthorized use or publication of our trade secrets and other confidential business information could harm our competitive position and reduce acceptance of our products; as a result, the value of our investment in R&D, product development, and marketing could be reduced. This risk is heightened as competitors for technical talent increasingly seek to hire our employees. Our licenses with other companies and participation in industry initiatives at times allow competitors to use some of our patent rights. Technology companies often bilaterally license patents between each other to settle disputes or as part of business agreements. Some of our competitors have in the past had, and may in the future have, licenses to some of our patents, and under current case law, some of the licenses can exhaust our patent rights as to licensed product sales under some circumstances. Our participation in industry standards organizations or with other industry initiatives at times requires us to offer to license our patents to companies that adopt industry-standard specifications. Depending on the rules of the organization, government regulations, or court decisions, we sometimes have to grant licenses to some of our patents for little or no cost, and as a result, we may be unable to enforce certain patents against others, and the value of our IP rights may be impaired. Third parties assert claims based on IP rights against us and our products, which could harm our business. We face claims based on IP rights from individuals, companies, investment litigation entities, other non-practicing entities, academic and research institutions, and other parties. We have seen an increase in patent assertions and lawsuits initiated by well-funded non-practicing entities, including entities funded by third-party investment firms. These lawsuits can increase our cost of doing business, impact our reputation or relationship with customers, and could disrupt our operations if they succeed in blocking the trade of our products. The patent litigation environment has also become more challenging due to the emergence of venues adopting procedural and substantive rules that make them more favorable for patent asserters and courts in which injunctions are available for non-competitors. As a result, we believe we are facing a more hostile IP litigation environment than in past years. We are typically engaged in a number of disputes involving IP rights. Claims that our products, technologies, or processes infringe the IP rights of others, regardless of their merits, cause us to incur large costs to respond to, defend, and resolve the claims, and they divert the efforts and attention of our management and technical personnel from our business and operations. In addition, we may face claims based on the alleged theft or unauthorized use or disclosure of third-party trade secrets, confidential information, or end-user data that we obtain in conducting our business. Any such incidents and claims could severely disrupt our business, and we could suffer losses, including the cost of product recalls and returns, and reputational harm. Furthermore, in many instances we agree to indemnify customers for certain IP rights claims against them. IP rights claims against our customers could also limit demand for our products or disrupt our customers' businesses, which could in turn adversely affect our results of operations. Intel. Risk Factors and Other Key Information 57 !I K KN 8JJ IKKKK JRJJJK I NJK%KIPK JK NIKN L %KNKJ** I K IKJINJNI JK JRII P L I! K I IJ KI PIK MI IK JIKLKJK I NJK% II P QNJNJK IKN IJ%R JJKNIJL NIKLKJK NII IJIL I J IJ **%RP KIP IK I K RIJJK NIKN L I**% PN I JL ]0 1 ^RKI IJ IJR LNK@P IIL%#0 18A*% K IPN I JK J LNKI IK J KRII IJ *** **+ !IIQNIJ LRJKJI J% M% P P RK%IN K%IN J K% KJ IK L8NIKJ K%KR K JIJN J K%I J J L IKNIJL JIPL NI IJKI J LJJJJJK IQNI JK J KL KN 8JJ N IJ I KKJ J JIIJJ K I J% L J PI NK8NIKJ K # L NI IIP NI LNKJ LRJ RK%IN K%IN J K%KJ IK%IJJ K% I JIJN J K% I L I K KNIJLJJIKN JK N NJ IOKKJ % IN NJ IO KK%KJINJ %NK% J %QNKJ %K KNI%I K% IJI KI IK IJ %LIKN J NJ KKNK9IQNI JKJ L IKIJ IJ K IIJK:JM JNI KN KJ J KJK%J% JIIK NIK:I K IJ K KJ NK: JL: PI J PKJJ K: I JJ K: K: K:8N JK:RIK: JK:K J K: J J L KJ L JJ 5 N KKJ K6 JJ% KK% IKNK IK J J%NK%KJ I% IJI KII LNKJ IN NI NK KK% N JKJ IRJ P IK I JIJIIJK% N IKN J K J L IK NK KK KNIJL KJK I KJKI JJ K KJKJ LRJ JIPLI J JI JJ KNIKIK J% N M KNKJ K J JIL JK%J NIINJJ %KNK K KIPK IKJK IJ N JIK% P I K J K P NI PIJ J NIJ LRJI %KJJ% I JI J IPLI J IJI JJ RK IN J K N IKN J NJK%IN J IL QNIK% II K KJNK L PI J JJK I JIJIIJK !IKN 8JJ $IKK% N I J JJ IN J ILI K ! J RLKI JJ NI $ I I NI $IJK !II NIJ JK% LIJK%JIKIJK% JI $IJKK IJ JJ JKNKK NI NK KK !I L $ RZKR K J JL K I JKRJ NINKJ IK% LK%J LP JIJ IK% JIKZJ I JJ NI $ $IJK NI JLJ IJKIJKKKN 8JJ I JJ IKK%KR KN IJ JLKJ J I JL NI $IJK PI NK N JIK JI J J IK ! I J RLK J J I JJ I NI $ I I II JJ NI $IJK ! RKJ I NIIJK%RL KN 8JJ KJJ NI $IJKI P % J I % I KJ K IJL NIKKIJ $IJKLIKN J JIIJLK J KKIJ K KJNK%R N I NI NK KK I JJ J% PI JK JIN J KZ PI JK I NIJKI IK KZIQNI N K IL K $IJK% I PI JKIQNII NJKJ J KJ IKJJP I K NI JLJ I NI $IJKN I L JKINKJ K I NI JJP KJ NK KK K KK% NI $IJK I QNJI JJ I NI PJ K J %JJJ I N NJ IONK IN J NIJIKIJK JI J NK KK IJ N I NI JJP KJ INJ NII NJK:KIKN J%JP N NI PKJ J ( %I NJP J% IJ N IN KIKKJ K JJ IK IJ J J IK LKJ I NI LK NI KKRJ JI K IJJ NKJIL JJPKJJK R JJ IKJ NKK NIJ JIJK L K J JI L KJ JK JR JIJ KJJ KNJK IKIJ NK KKI JK NI JJ IKP JKJ% L JNJNIP% KKJ K NIJ JK% N INII JK R%K &#