Intel News Disclosures from Day 2 of the Intel Developer Forum in San Francisco

SAN FRANCISCO--(BUSINESS WIRE)--

Intel is holding its Intel Developer Forum Sept. 18-20 in San Francisco. Below are summaries of each executive's keynote speech and the major news disclosed during the second day.

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    David (Dadi) Perlmutter "Breaking the Barriers to Mobility"

    Intel Senior Vice President and General Manager, Mobility Group

Describing the latest trends in mobile computing, Dadi Perlmutter highlighted forthcoming Intel platforms for notebooks that builds on the mobility attributes of performance, battery life, form factor and wireless communications, and also how these attributes can be extended to new device types and usage models. He also discussed the future of wireless networking connectivity, including mobile WiMAX.


    --  Santa Rosa Refresh - In January 2008, Intel will launch "Santa
        Rosa Refresh," an update to Intel(R) Centrino(R) processor
        technology that includes the next generation 45nm high-k
        mobile processor (codenamed Penryn) and improved graphics
        capabilities. With the Penryn mobile processor, Santa Rosa
        Refresh-based notebooks receive enhanced performance and
        battery life features. Graphics improvement for Santa Rosa
        Refresh focuses on unlocking advanced graphics technologies
        for an enhanced visual experience, especially with DirectX
        10-based applications. Santa Rosa Refresh notebook PCs also
        contain the Mobile Intel(R) 965 Express chipset family, Intel
        Next-Gen Wireless-N network connection, Intel(R) 82566MM and
        82566MC Gigabit Network Connection, and optional Intel(R)
        Turbo memory.

    --  Future Mobile Roadmap for Notebooks - Perlmutter showed the
        next generation Montevina processor technology Intel is
        targeting to deliver in mid-2008. Montevina includes the new
        45nm high-k Intel Penryn mobile processor and the
        next-generation chipset with DDR3 memory support. This will be
        Intel's first Centrino processor technology for notebooks to
        offer the option of integrated Wi-Fi and WiMAX wireless
        technologies for greater wireless broadband access. It will
        also feature integrated HD-DVD/Blu-ray support for consumers
        and next generation data manageability and security features
        for the enterprise. With approximately 40 percent smaller
        components, Montevina will be ideal for the wide spectrum of
        notebook designs from sub to full-sized notebooks.

    --  Wi-Fi - 802.11n/Cisco - Announced on Sept. 4, Cisco and Intel
        are working together on interoperability testing of 802.11n
        draft 2.0, helping to ensure reliable performance and
        compatibility between Intel Centrino-based notebook PCs and
        Cisco wireless networks.

    --  WiMAX for Notebooks in 2008 - Perlmutter highlighted both the
        quality of the WiMAX network as well as the significant
        ecosystem working on and supporting this wireless standard,
        including conformance and interoperability testing. He showed
        several mobile implementations, all illustrating the benefits
        of "true mobile connectivity" using Intel's Echo Peak, the
        industry's first integrated Wi-Fi / WiMAX module solution that
        will be offered as an option for notebooks based on
        next-generation Centrino processor technology (Montevina) in
        2008.

        -- Echo Peak incorporates advanced MIMO antenna technology for
            increased data throughput rates -- improving users'
            broadband experiences at home, work and "on the go."
            Integrating Wi-Fi and WiMAX into the platform not only
            frees up valuable laptop real estate for other uses, but
            also helps yield a highly cost-effective solution,
            enabling higher device attach rates and better economics.

        -- A number of OEMs, including Acer, Asus, Lenovo, Panasonic
            and Toshiba have already expressed intent to embed WiMAX
            into next-generation Centrino processor technology-based
            notebook PCs in 2008.
    --  Powerful Entertainment - As seen in Perlmutter's keynote,
        Intel Centrino processor technology provides robust and
        high-definition entertainment. He demonstrated the multimedia
        capabilities of today's Centrino-based platforms showing
        high-definition content streaming wirelessly. He also provided
        a glimpse of the entertainment power of the upcoming
        Penryn-based Intel Centrino systems with video rendering and
        encoding.
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Anand Chandrasekher, "Unleashing the Internet Experience"

Intel Senior Vice President and General Manager, Ultra Mobility Group, Intel Corporation

Anand Chandrasekher discussed the growing need of mobile users to communicate, entertain, stay informed and be productive on-the-go. Chandrasekher outlined Intel's strategy to unleash the full Internet for mobile users by using low power IA platforms, which drastically reduce CPU and chipset power performance. He also demonstrated increasing momentum in the ecosystem with a range of announcements and demonstrations throughout his keynote.

    --  Intel "Menlow" Platform Enables Full Internet in Your Pocket
        in 2008 - Chandrasekher discussed the upcoming Intel Menlow
        platform, scheduled for launch in 1H'08, which is comprised of
        a ground-up designed processor, codenamed Silverthorne, based
        on a new 45nm Hi-k low power microarchitecture and a new
        chipset, codenamed Poulsbo, based on a ground-up single-chip
        design. He highlighted that a Menlow platform will deliver
        great performance at low power and could fit in a 74mm x 143mm
        sized motherboard, thus enabling a full Internet experience
        while enabling form factors that are small enough to fit in
        your pocket. Chandrasekher showed how Silverthorne draws 10x
        lower power compared to today's lower-power processors (based
        on pre-silicon estimates). Also, he discussed standardized
        communications options such as Wi-Fi, 3G and WiMAX for MIDs
        and UMPCs, thus enabling connected experiences.

    --  Intel "Moorestown" Platform Headed for 10x Idle Platform
        Reduction - Chandrasekher provided a sneak peek into the
        future Intel Moorestown platform which consists of a System on
        Chip (SOC) and a Communications Hub. The SOC integrates the
        CPU, graphics, video, and memory controller to a single chip
        and brings the 45nm process benefits to the complex. The
        Communications Hub provides I/O capabilities for storage,
        features, and wireless integration and the architecture allows
        for ultra low power operation. Chandrasekher announced that
        the platform idle power for a Moorestown-based MID platform
        will be 10x lower compared to a Menlow-based platform.

    --  Mobile Internet Device Innovation Alliance Shows Progress -
        Intel had announced the formation of the MID Innovation
        alliance at IDF Beijing in April with industry-leading systems
        manufacturers Asus(1), BenQ(1), Compal(1), Elektrobit(1),
        HTC(1), Inventec(1) and Quanta(1). Chandrasekher announced
        that these companies had made significant progress over the
        past 6 months on Intel-based Menlow platforms and are on track
        to bring platforms to the marketplace in the first half of
        2008. He showed working prototypes from Asus, BenQ, Compal,
        Elektrobit, Inventec and Quanta during his speech as evidence
        of this progress.

    --  Intel Announces Strategic Collaborators for MID and UMPC
        Categories - In a sign of growing momentum in the industry,
        Chandrasekher announced more than 15 industry leaders which
        have embraced Intel's "Full Internet in Your Pocket" vision,
        are investing in the UMPC and MID categories, and are expected
        to bring products over time. These companies included system
        manufacturers such as Aigo(1), Clarion(1), Fujitsu(1),
        Harman-Becker(1), Hitachi(1), Lenovo(1), LG Electronics(1),
        NEC(1), Panasonic(1), Samsung(1), and Toshiba(1), and service
        providers such as Clearwire(1), KDDI(1), Korea Telecom(1), NTT
        DoCoMo(1) and Sprint.

    --  Shuttleworth Demonstrates Pre-Alpha Release of Ubuntu(1)
        Mobile on Menlow-based MID - Chandrasekher welcomed Mark
        Shuttleworth, founder and CEO of Canonical(1), on stage and
        discussed the company's entry into the MID segment.
        Shuttleworth described the flexibility of the Ubuntu OS and
        the steps Canonical is taking to deliver a reliable, small
        footprint, and highly responsive operating system for the
        category. He also discussed how the company is planning to
        deliver unique user interface, applications, and content to
        deliver a differentiated experience to its customers and
        showcased a pre-alpha release of Ubuntu Mobile on an Intel
        Menlow-based MID platform.

    --  World's First Demonstration of Adobe(1) AIR(1) Application on
        Intel Menlow-based Platform - Chandrasekher welcomed Al
        Ramadan, senior vice president, Mobile and Device Solutions
        Business Unit, Adobe, on stage. Ramadan described Adobe(1)
        AIR(1), a cross-operating system runtime that will extend the
        reach of rich internet applications, and discussed how the
        combination of MIDs and Adobe AIR applications will bring
        compelling new experiences to the user. Ramadan also
        demonstrated Adobe Media Player (AMP), an Adobe AIR
        application, and showcased AMP delivering premium content
        based entertainment to new MID devices. Additionally, Ramadan
        emphasized that Adobe AIR will support Windows- and
        Linux-based Menlow platforms in the future.

Intel, Centrino, Intel Core and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

(1) Other names and brands may be claimed as the property of others.

Source: Intel Corporation